Semiconductor Packaging News
We search for industry news, so you don't need to.
July 29, 2014
Circulation Over 35,000
Test Your Knowledge
What is usually thrown the farthest in a track and field competition?
See answer below.
Letters Submit
No letters for today.
NASA Created
NASA Created
The U.S. Congress passes legislation establishing the National Aeronautics and Space Administration (NASA), a civilian agency responsible for coordinating America's activities in space.

The day was July 29, but what year was it?
Cartoon of the Day
"I actually have nothing to say, so my presentation should only last an hour or two."
Copyright © Randy Glasbergen
Top Story
Amkor Technology Reports Financial Results for the Second Quarter 2014
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2014, with net sales of $767 million, net income ...
The Wall Street Journal
Industry News
Intel and the air: Reconciling chipmaker's environmental and economic impact
Intel employs more Oregonians than any other business. And it pollutes more than just about anyone else in the state. Maybe that shouldn't ...
The Oregonian
STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits
STATS ChipPAC Ltd. announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip ...
Market Watch
IBM rejects GlobalFoundries' offer to acquire computer chip business
GlobalFoundries may not be purchasing IBM's chip manufacturing business after all, as the companies failed to reach an agreement, according ...
Albany Business Review
Next-Generation Sustainability Gets More Challenging
The semiconductor industry has made major progress on reducing energy usage and water consumption, and effectively abating its emissions, ...
Semiconductor Engineering
GlobalFoundries reportedly pulls out of deal to buy IBM’s chip business
IBM's hopes of pulling off another fire-sale of one of its businesses look to have been dashed, with reports suggesting that GlobalFoundries ...
Silicon Angle
Imec demonstrates 28Gb/s photonics platform
Imec has reached some key development milestones for its silicon photonics platform (iSiPP25G) by extending the performance towards ...
Compound Semiconductor
Changes In NAND Flash Market
Things are changing quickly in the NAND flash market. Newcomers are challenging long-time market leaders and shifting the lineup in this ...
Semiconductor Engineering Amazon Brings Fire to Phone Market
Preliminary Teardown analysis suggests that Amazon's $649.00 phone costs $209.00 to build. Qualcomm is the primary provider of many of the ...
EE Times
Is Moore’s Law Less Important to the Tech Industry?
The central organizing principle of much of the tech industry is Moore's Law. In one very important sense, it may be of less value than it ...
The New York Times
Sony Invests in Stacked Image Sensor Manufacturing Capacity
Sony Corp. has said it plans to invest 35 billion yen (about $340 million) to increase its production of stacked CMOS image sensors in ...
EE Times
Life After 28nm: Think Network-on-Chip
As Moore's Law reverses and 20, 16, and 14 nanometer processes become more expensive, SoC cost reductions must come from design innovations ...
EE Times
Freescale, with Solid Q2 Growth, Milks Auto IC Boom
Freescale Semiconductor announced solid second-quarter financial results, with the company's net sales at $1.19 billion, compared with ...
EE Times
Press Releases Submit
ASM Pacific Technology Announces Record Orders Received in 1st half 2014
ASM Pacific Technology and its subsidiaries achieved a turnover amounting to HK$5.9 billion in the six months ended June 30 2014 ...
ASM Pacific Technology
Miyachi Unitek Introduces UB29 Linear DC Micro Welder
Miyachi Unitek Corporation introduces the new UB29 linear DC micro welder, which offers precision control for micro-miniature resistance ...
Miyachi Unitek
White Papers Submit
Dispenser Provides Volumetric Scan and Process Feedback
Vertical Level Socket Testing
Designing in Thermal Control for Power Modules
High Thermal Conductive Underfill
Plasma Clean to reduce Wire Bond Failures
PoP Package Warpage Contributors' Characterization & Impact Analysis
Recent Advances in Die Attach Film
Calendar Submit
Jul 29, 2014 - 'Human Error Prevention' Seminar
Aug 21, 2014 - Technical Study: Cleaning Bottom Termination Components
Sep 3, 2014 - Semiconductor Reliability Short Course (San Jose)
Sep 8, 2014 - Failure and Yield Analysis Short Course (San Jose)
Sep 15, 2014 - Understanding Semiconductor Technology & Business
Sep 18, 2014 - Failure and Yield Analysis Short Course (San Jose)
Sep 18, 2014 - Cleaning Before Conformal Coating
Today's Sponsor
Quote of the Day
You cannot shake hands with a clenched fist.
Indira Gandhi
Test Your Knowledge
What is usually thrown the farthest in a track and field competition?
Answer: The javelin
Coffee Break
Security Questions
Security Questions
Setting up security questions proves to be too difficult for this guy.

Home  |  About Us  |  Advertising  |  Advertising Rates  |  Calendar  |  Press Releases
Contact Us  |  Free Subscription  |  News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Editor / Business Manager

Visit Circuitnet for the latest electronics assembly news and information.