Semiconductor Packaging News
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October 22, 2014
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Cuban Missile Crisis
Cuban Missile Crisis
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Cartoon of the Day
"I have a note from my doctor. I'm allergic to criticism!"
Copyright © Randy Glasbergen
Top Story
IBM Unloads Chip Biz To GF
After months of on-again, off-again negotiations, IBM agreed to hand over its Microelectronics unit to GlobalFoundries for $1.5 billion--meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. To really sweeten the deal ...
Semiconductor Engineering
Industry News
TI's Rosy Outlook Defies Microchip's Gloom
Texas Instruments reported third-quarter results above expectations. Net income rose 31% from a year earlier, and revenue rose 8%. The solid results came 10 ...
EE Times
Nanoscale Structures Enable Magnetic Mirrors Without Metals
Researchers at Sandia National Laboratory have developed a two-dimensional array of non-metallic nanoscale structures that interact with the magnetic ...
IEEE Spectrum
Semiconductor makers' BB ratio drops
The book-to-bill ratio for North America-based semiconductor equipment manufacturers, such as Applied Materials Inc, dropped below one, to 0.94 ...
Tapei Times
iPhones Drive Apple Record, iPads Drop 13%
Strong iPhone and Macintosh sales drove Apple to record revenues and profits despite a 13% drop in iPad sales. With its next-generation handset still ramping ...
EE Times
Chipmaker ARM's upbeat message fails to allay concerns
British chipmaker ARM Holdings' predictions of improving smartphone demand and strengthening royalty growth met with a cool stock market response after it fell ...
Gartner Says Advanced Analytics Is a Top Business Priority
Gartner, Inc. said advanced analytics is a top business priority, fuelled by the need to make advanced analysis accessible to more users and broaden the ...
Graphene aerogels promise enhanced energy storage performance
Lawrence Livermore researchers have turned to graphene aerogel to develop an enhanced electrical energy storage solution that eventually could be used to smooth ...
EE Times Europe
IBM enters new era with chip deal
Thousands of IBM workers are adjusting to a long-rumored plan that has hit home as reality: They won't be IBMers for long. But unlike the legion of employees ...
Poughkeepsie Journal
SEMI Posts September 2014 Book-to-Bill Ratio of 0.94
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in September 2014 and a book-to-bill ratio of 0.94 ...
Outrage over light verdict in ASE court case
Taiwan Kaohsiung District Court issued sentences to Advanced Semiconductor Engineering's management staff for intentionally leaking industrial waste into ...
The China Post
Securing The IoT
Semiconductor Engineering sat down to discuss whether the Internet of Things will be secure enough, or whether it will create new security issues, with ...
Semiconductor Engineering
IBM, GlobalFoundaries Strike Historic Fab Deal
IBM struck a historic and much-anticipated deal to transfer its chip fabs to GlobalFoundries, but the complex deal has its share of regulatory twists that ...
EE Times
Press Releases Submit
EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production
EV Group introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms, including mask aligners ...
EV Group
Samsung Electronics Starts Mass Production of 8-Gigabit DDR4 Based on 20 Nanometer Process Technology
Samsung Electronics Co., Ltd. announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module ...
Samsung Electronics Co., Ltd.
SiliconAid Solutions evolves support through Partnership with Ridgetop Group
SiliconAid Solutions, Inc., and Ridgetop Group., announced jointly they have continued and expanded their partnership to enable support for the evolving ...
Ridgetop Group
White Papers Submit
High Capability Die Attach Film for Small Die Applications
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Enhancing System Functionality & Performance with the Right Packaging Solutions
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Core PDN Analysis of Core & Coreless Substrates
Calendar Submit
Oct 22, 2014 - Conformal Coating & Precise Fluid Dispensing Process Technologies Workshop
Oct 23, 2014 - Technical Study: Concentration Monitoring & Control Techniques
Oct 28, 2014 - Intro to IC Design & Fabrication
Oct 28, 2014 - 'Wearable Electronics' - iMAPS New England Chapter Technical Meeting
Nov 3, 2014 - Understanding Semiconductor Technology & Business
Nov 12, 2014 - Understanding Semiconductor Technology & Business
Nov 13, 2014 - Overview of Semiconductor Manufacturing Austin, TX
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Quote of the Day
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Jean De la Fontaine
Test Your Knowledge
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Answer: 206
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