Semiconductor Packaging News
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October 31, 2014
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Adventures of Sherlock Holmes Published
Adventures of Sherlock Holmes Published
The Adventures of Sherlock Holmes, by Arthur Conan Doyle, is published. The book was the first collection of Holmes stories, which Conan Doyle had been publishing in magazines since 1887.

The day was October 31, but what year was it?
Cartoon of the Day
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"I think we can charge more if we calculate our billable hours in dog years."
Copyright © Randy Glasbergen
Top Story
Overall Growth of Opto, Sensors, Discretes Market Back on Track
The worldwide market for optoelectronics, sensors and actuators, and discrete semiconductors appears to be returning to a new state of "normal" after struggling ...
IC Insights
Industry News
Worldwide Tablet Market Grows 11.5% in Q3
The worldwide tablet grew 11.5% year over year in the third quarter of 2014 with shipments reaching 53.8 million units according to preliminary data from ...
IDC
Microchip Technology says dip in semiconductor demand to be 'very mild'
Microchip Technology Inc, which three weeks ago forecast a broad downturn in semiconductor demand, said that the worst was over and the dip would be minor ...
Reuters
Why Xiaomi Is World's 3rd Largest Mobile Co.
China's Xiaomi's emergence as the world's third largest smartphone vendor in the last quarter should have surprised no one. However, it's a milestone significant ...
EE Times
TSU opposes UMC’s wafer investment plan in China
The Taiwan Solidarity Union (TSU) voiced its opposition to United Microelectronics Corp's (UMC) plans to invest in a 12-inch wafer manufacturing plant ...
Taipei Times
In glow of Apple, NXP pitches tap-to-pay technology to car makers
NXP Semiconductors is taking advantage of the recent excitement around Apple Inc's new mobile payment system with the tap-to-pay technology built into ...
Reuters
Freescale CEO: 'IoT isn't just buzz'
Coming after the solid third quarter results that produced higher operating margins and improving cash flow, Freescale Semiconductor's CEO Gregg Lowe ...
EE Times Europe
Lenovo closes $2.91 billion acquisition of Motorola unit from Google
China's Lenovo Group Ltd said it has closed its $2.91 bln acquisition of the Motorola handset unit from Google Inc, paving the way for a fresh assault on the ...
Reuters
Are Models Holding Back New Methodologies?
Semiconductor Engineering sat down to discuss the state of the industry for modeling at abstractions above RTL, a factor which has delayed adoption of Virtual ...
Semiconductor Engineering
TSMC to trail Samsung by 14pp in FinFET in 2015, says Barclays
Taiwan Semiconductor Manufacturing Company (TSMC) will have a 39% share in the FinFET process segment in 2015 compared to Samsung Electronics' 53%, ...
Digitimes
Applied-TEL Deal Faces Delays
Applied Materials' proposed move to acquire rival Tokyo Electron Ltd. faces a possible delay. The blockbuster deal could get pushed out until next year ...
Semiconductor Engineering
Samsung Electronics third-quarter operating profit down 60.1 percent on year
Samsung Electronics Co Ltd said third-quarter profit fell 60.1% from a year earlier to the lowest in more than three years, as earnings for the mobile ...
Reuters
UMC Takes Bigger Slice of 28nm Business
UMC, the world's third-largest chip foundry, said that it has grabbed a larger piece of the 28 nanometer business that is dominated by Taiwan Semiconductor ...
EE Times
Has Moore’s Law Become Moot for PCs?
Desktop computers are no longer the polestar of the computing firmament, as people have embraced smartphones and tablets by the million. These portable ...
IEEE Spectrum
Analyst says GlobalFoundries will close IBM plants
Computer chip industry analyst Jim McGregor said it is only a matter of time before GlobalFoundries shuts down the two computer chip manufacturing plants ...
Albany Business Review
ASM Pacific Posts Record Sales
Announcement of Unaudited 2014 Third Quarter Results for the three months eneded September 30, 2014. Record turnover ...
ASM Pacific Technology
Press Releases Submit
Spectral Surface Mapping with Microscopic Resolution
CRAIC Technologies is proud to announce Spectral Surface Mapping(TM) capabilities for its UV-visible-NIR microspectrophotometers. S2M(TM) gives ...
CRAIC Technologies
Economical Triple-Channel Programmable Power Supply from Keithley Outperforms Competitive Supplies
Keithley Instruments announced the addition of an economical triple-channel power supply to the company’s Series 2200 line of programmable DC power supplies. The ...
Keithley Instruments
Heraeus Receives Award from International Rectifie
Heraeus Materials Singapore has received a Distinguished Supplier Award 2014 from International Rectifier in recognition of "Total Commitment, Delivery and Quality Performance" ...
Heraeus Materials Singapore Pte Ltd
White Papers Submit
Precise High-throughput Solder Dispensing
High Capability Die Attach Film for Small Die Applications
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Enhancing System Functionality & Performance with the Right Packaging Solutions
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Calendar Submit
Nov 3, 2014 - Understanding Semiconductor Technology & Business
Nov 12, 2014 - Understanding Semiconductor Technology & Business
Nov 13, 2014 - Overview of Semiconductor Manufacturing Austin, TX
Dec 4, 2014 - 'Root Cause Analysis' Seminar
Jan 19, 2015 - Overview of Semiconductor Manufacturing/ Hsinchu, Taiwan
Jan 22, 2015 - Overview of Semiconductor Manufacturing/ Singapore
Feb 5, 2015 - Overview of Semiconductor Manufacturing/ San Jose, CA
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Quote of the Day
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Peter Fleming
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