Semiconductor Packaging News
We search for industry news, so you don't need to.


Error Information
The request could not be completed due to a user authentication failure.

Error Time
Wed Oct 26 17:00:54 EDT 2016

Top Story October 26, 2016
Intel, ARM Battle over IoT
The battle for the Internet of Things heats up this week as Intel and ARM fire off competing announcements to establish their microprocessor architectures on its broad frontiers. Intel announced its first Atom SoC with real-time capabilities tailored for automotive and industrial markets. Less than two miles away from Intel's headquarters, ARM kicked off its annual ...
EE Times

Industry News
Watch Out For 200mm Fabs: Fab Outlook To 2020
One year after the debut of the industry's first 200mm Fab Outlook report, SEMI has just issued an October 2016 update with the improved and expanded report ...
Semiconductor Engineering
Smartwatch Market Declines 51.6% in the Third Quarter as Platforms and Vendors Realign
The worldwide smartwatch market experienced a round of growing pains in the third quarter of 2016 (3Q16), resulting in a year-over-year decline in shipment ...
Microsoft Is Building a Quantum Computer That May Never Work
Microsoft is working on a quantum computer that uses what are called "non-abelian anyons," a quasiparticle that physicists aren't even sure exist. Quantum computers ...
Apple still isn't seeing much growth
Apple expects sales to increase slightly in the holiday quarter, marking a return to growth after three consecutive quarters of decline for both the company ...
Samsung chip supplier AMS warns of customer setback, shares plunge
Austrian sensor chip maker AMS AG has warned of a setback with one of its customers which could hit revenues and force a writedown in its accounts, sending its ...
​Intel has a new chip to bring brains to your car
Intel probably already supplies the brains for your PC. Now it wants to do the same for your next car with new members of its Atom processor family. That auto ...

Manufacturing Bits: Oct. 25
Power semiconductors based on gallium nitride (GaN) are heating up in the market. Typically, suppliers are shipping devices using a GaN-on-silicon process. ...
Semiconductor Engineering
Sell Now, Equipment Makers
If you have the chance to sell your company while its stock is at a record high, then you'd be crazy not to explore the opportunity. The board of Hitachi Kokusai ...
SK Hynix says chip market conditions to be favourable for Q4
* Says 2016 capital expenditures likely to be around 6 trillion won * Says positive DRAM market conditions to continue in Q4 on strong demand, limited supply growth ...
Component shortages expected in PC market after November
With smartphone vendors having been aggressively placing short-term orders for the fourth quarter, several component suppliers have been delaying their shipments ...
IP Market: CPU Still The Largest But Security Leads In Growth
The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten ...
Semiconductor Engineering

Press Releases
Edwards Launches New Smart Thermal Management System at Europa Today
Edwards launched a new Thermal Management System (TMS) at SEMICON® Europa today. The new Smart TMS adds feedback control to accurately maintain gas temperature ...
EnSilica opens specialist Design Center for RF and low power sensing applications
EnSilica has further expanded its network of specialist design centers with the establishment of a new facility near Oxford (UK) focusing on RF and low power sensing ...
SHENMAO Exhibits at MEPTEC Semiconductor Packaging Roadmap Symposium
SHENMAO Technology, Inc. distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping ...
SHENMAO America, Inc.
VERMES Microdispensing introduces the new MDS 3010+-/3020+ series
The highest precision new microdispensing systems of the MDS 3010+ - / 3020+ series dispense minimal amounts in the subnano-range and are suitable for a wide range ...
VERMES Microdispensing
Test Your Knowledge
Was the first flexible, rolled film for still photographs introduced before or after the first motion picture was made?
See answer below.
White Papers
Heat sinking through socket contact technologies
New Backside Protection Film Boosts WLCSP Reliability
Ultrasonic Inspection of Bonded Wafers
3D Glass Solutions Enables System on a Chip
Jetting Technology Improves Your Process
Panel Level Packaging Consortium
Integrated Fan-out Technology
Quote of the Day
"I think computer viruses should count as life. I think it says something about human nature that the only form of life we have created so far is purely destructive. We've created life in our own image."
Stephen Hawking
What Year Was It?
Shootout at the OK Corral
Shootout at the OK Corral
The Earp brothers face off against the Clanton-McLaury gang in a legendary shootout at the OK Corral in Tombstone, Arizona.
The day was Oct 26. What year was it?
Oct 25, 2016: SEMICON Europa
Nov 1, 2016: "Hermetic Packaging of Implantable Bio-Medical Devices: Development, Evolution...Future"
Nov 14, 2016: Overview of Semiconductor Manufacturing/ Portland, Or
Nov 14, 2016: MEPTEC Semiconductor Roadmaps Symposium/ San Jose, CA
Nov 17, 2016: Overview of Semiconductor Manufacturing! Austin, TX
Nov 30, 2016: Wire Bonding Certification
Dec 5, 2016: Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules
Cartoon of the Day
"If we provide great customer service, people will pester us with a bunch of stupid questions. Do we really want that?"
Copyright © Randy Glasbergen
Test Your Knowledge Answer
Was the first flexible, rolled film for still photographs introduced before or after the first motion picture was made?
Answer: 4 years before.