Technical Paper: Laser Assisted Bonding (LAB) for Fine Pitch Cost Effective Interconnection

Technical Paper

Laser Assisted Bonding (LAB) for Fine Pitch Cost Effective Interconnection

For flip chip packaging with advanced Si nodes, fine bump pitch, fine LW/LS as well as large die sizes with high aspect ratios, LAB technology is the optimal methodology to implement reliable assembly yield without any ELK damage issues.
JCET Group Co., Ltd.

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