Technical Paper: Automated Wafer TTV & Shape Metrology

Technical Paper

Automated Wafer TTV & Shape Metrology

Wafer thickness, TTV, flatness and warpage are important parameters to be monitored for wafer production as well as device processing. cyberTECHNOLOGIES' systems provide a comprehensive suite of tools to monitor the key physical characteristics of wafers or similar substrates.
cyberTECHNOLOGIES

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