|
|
Technical Paper |
Vacuum Fluxless Reflow Technology for Fine Pitch Interconnect Bumping ApplicationsA process for fine pitch bumping involving vacuum and formic acid reflow (VFAR) suitable for high volume manufacturing is described. A joint study between Heller Industries and Intel Corporation. Heller Industries, Inc. Complete this form to download this Technical Paper. |
More Technical Papers
Full Technical Paper List |
We search for industry news so you don't need to. | ||
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|