|
|
Technical Paper |
Series B : Adhesion and Bondibility of Al2O3-coated Bonding WireUsing Atomic Layer Deposition (ALD), we applied a nanoscale Al2O3 ceramic coating to metal bonding wires, enhancing adhesion, insulation, and corrosion resistance, significantly improving wire reliability. OxWires Co., Ltd Complete this form to download this Technical Paper. |
More Technical Papers
Full Technical Paper List |
We search for industry news so you don't need to. | ||
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|