February 23, 2021|
TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables ...
December 3, 2020|
TechSearch Int'l Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024. Growth is driven by increased ...
September 2, 2020|
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches ...
August 11, 2020|
Global Semiconductor Packaging Materials Market to Reach $20.8B by 2024
The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024, a 3.4% ...
May 6, 2020|
5G Infrastructure, AI Accelerators, and Server Market Provide Growth, Despite Pandemic
Despite the economic downturn caused by the fight against the Covid-19 virus, there are some potential growth areas this year. Growth in advanced packaging continues ...
December 2, 2019|
Chiplets: A Key Enabler for the Next 10-20 Years
Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies ...
October 15, 2019|
2019 Edition of the Heterogeneous Integration Roadmap
IEEE announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements ...
September 9, 2019|
Infrastructure Ready or Not Companies are Shipping 5G Phones to Spur Sales
Many smartphone manufacturers are offering 5G handsets in a bid to increase mobile phone sales. Several 5G-compatible smartphones are in mass production ...
September 5, 2019|
High-Performance IC Substrate Manufacturing at an Inflection Point
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving ...
May 29, 2019|
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLPs (FO-WLPs). Despite lower growth for smartphones ...