Press Release - TechSearch International
February 23, 2021  -  Click the title to read the full press release.

TechSearch International Quantifies Heterogeneous Integration Market Growth



The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables ...

TechSearch International
February 23, 2021
TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables ...
December 3, 2020
TechSearch Int'l Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024. Growth is driven by increased ...
September 2, 2020
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches ...
August 11, 2020
Global Semiconductor Packaging Materials Market to Reach $20.8B by 2024
The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024, a 3.4% ...
May 6, 2020
5G Infrastructure, AI Accelerators, and Server Market Provide Growth, Despite Pandemic
Despite the economic downturn caused by the fight against the Covid-19 virus, there are some potential growth areas this year. Growth in advanced packaging continues ...
December 2, 2019
Chiplets: A Key Enabler for the Next 10-20 Years
Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies ...
October 15, 2019
2019 Edition of the Heterogeneous Integration Roadmap
IEEE announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements ...
September 9, 2019
Infrastructure Ready or Not Companies are Shipping 5G Phones to Spur Sales
Many smartphone manufacturers are offering 5G handsets in a bid to increase mobile phone sales. Several 5G-compatible smartphones are in mass production ...
September 5, 2019
High-Performance IC Substrate Manufacturing at an Inflection Point
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving ...
May 29, 2019
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLPs (FO-WLPs). Despite lower growth for smartphones ...
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