Press Release - EV Group
June 9, 2021  -  Click the title to read the full press release.

EV Group Unlocks Production Scaling with Step-and-Repeat Nanoimprint Lithography System



EV Group (EVG) announced the EVG®;770 NT--its next-generation step-and-repeat nanoimprint lithography (NIL) system. The EVG770 NT enables precise replication of micro- ...

EV Group
June 9, 2021
EV Group Unlocks Production Scaling with Step-and-Repeat Nanoimprint Lithography System
EV Group (EVG) announced the EVG®;770 NT--its next-generation step-and-repeat nanoimprint lithography (NIL) system. The EVG770 NT enables precise replication of micro- ...
April 20, 2021
Die-to-wafer Bonding Accelerates Heterogeneous Integration (HI)
Flexible hybrid bonding technologies are key to speeding up the deployment of heterogeneous integration. This white paper reviews different D2W bonding approaches ...
February 2, 2021
ASM Pacific Technology and EV Group Join Forces
ASM Pacific Technology and EV GROUP announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous ...
January 20, 2021
VIEWPOINT 2021: Dr. Thomas Uhrmann, Director of Business Development, EV Group
Uhrmann_Thomas_60-75.jpg
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications like AI, AR/VR and autonomous driving require enormous computing power with processors optimized specifically for each application. At the same time, development cycles are getting shorter ...
January 20, 2021
EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters
EV Group (EVG) announced that it has established the EVG Academy, a training facility for customers that provides technical training on all classes of EVG equipment as well as on EVG's ...
December 14, 2020
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation
EV Group introduced the EVG®320 D2W die preparation and activation system, the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer ...
October 20, 2020
EV Group Addresses Key Process Gap in Heterogeneous Integration
EV Group (EVG) announced that it has successfully demonstrated a complete process flow for collective die-to-wafer (D2W) hybrid and fusion bonding with sub-two-micron ...
October 13, 2020
Maskless Lithography Addresses Shift Toward 3D Integration
This white paper examines how maskless exposure (MLE) technology overcomes limitations of traditional lithography in back-end processing, providing unsurpassed ...
September 23, 2020
EV Group Brings Maskless Lithography to High-volume Manufacturing with LITHOSCALE
EV Group introduced the LITHOSCALE® maskless exposure system - the first product platform to feature EVG's revolutionary MLE™ (Maskless Exposure) technology. LITHOSCALE was ...
July 22, 2020
EV Group Completes Construction of State-of-the-Art Cleanroom Facility
EV Group announced that it has completed construction of its new Cleanroom V building at its corporate headquarters in Austria. Built from top to bottom with the latest ...
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