June 11, 2021|
StratEdge High-performance Semiconductor Packages to be on Display at IMS202
StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 1014 at the International Microwave Symposium ...
April 28, 2021|
StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices
StratEdge Corporation announces the release of its SMK Series surface mount DC to 26 Gigahertz (GHz) packages for test and measurement, VSAT, point-to-point, point-to-multipoint ...
March 11, 2021|
StratEdge Increased Manufacturing Capacity of Glass Sidewall Thermally Enhanced Packages
StratEdge Corporation announces the increased capacity for manufacturing the small outline thermally enhanced alumina/glass sidewall packages for power semiconductors. The ...
February 9, 2021|
StratEdge's High-Performance Power Amplifier Packages on the Red Planet
StratEdge Corporation announces that its SE20 power amplifier packages are playing a key role in transmitting signals with information gathered from NASA's Mars rover missions ...
January 27, 2021|
VIEWPOINT 2021: Casey Krawiec Vice President of Global Sales StratEdge Corporation
As a company that specializes in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter wave, and high-speed digital devices, especially those used in military, defense, and aerospace applications, StratEdge has essential service designation. As such ...
November 19, 2020|
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
October 7, 2020|
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS
StratEdge Corporation announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the Virtual ...
October 5, 2020|
Optimizing High Power GaN Device Performance With Eutectic Die Attach
StratEdge paper details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability. Learn more about specialized packages ...
September 22, 2020|
StratEdge Reports A Strong Third Quarter
StratEdge Corporation announces a strong third quarter with a marked increase recently in requests for 5G-related quotes and contract orders when compared to the rest ...
August 14, 2020|
StratEdge White Paper, 'Eutectic Die Attach Optimizes High Power GaN Devices,' is Now Available
StratEdge Corporation announces that the white paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is now available on the StratEdge website. The article ...