Press Release - StratEdge Corporation
June 11, 2021  -  Click the title to read the full press release.

StratEdge High-performance Semiconductor Packages to be on Display at IMS202



StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 1014 at the International Microwave Symposium ...

StratEdge Corporation
June 11, 2021
StratEdge High-performance Semiconductor Packages to be on Display at IMS202
StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 1014 at the International Microwave Symposium ...
April 28, 2021
StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices
StratEdge Corporation announces the release of its SMK Series surface mount DC to 26 Gigahertz (GHz) packages for test and measurement, VSAT, point-to-point, point-to-multipoint ...
March 11, 2021
StratEdge Increased Manufacturing Capacity of Glass Sidewall Thermally Enhanced Packages
StratEdge Corporation announces the increased capacity for manufacturing the small outline thermally enhanced alumina/glass sidewall packages for power semiconductors. The ...
February 9, 2021
StratEdge's High-Performance Power Amplifier Packages on the Red Planet
StratEdge Corporation announces that its SE20 power amplifier packages are playing a key role in transmitting signals with information gathered from NASA's Mars rover missions ...
January 27, 2021
VIEWPOINT 2021: Casey Krawiec Vice President of Global Sales StratEdge Corporation
krawiec_-casey_60-75_1.jpg
As a company that specializes in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter wave, and high-speed digital devices, especially those used in military, defense, and aerospace applications, StratEdge has essential service designation. As such ...
November 19, 2020
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
October 7, 2020
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS
StratEdge Corporation announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the Virtual ...
October 5, 2020
Optimizing High Power GaN Device Performance With Eutectic Die Attach
StratEdge paper details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability. Learn more about specialized packages ...
September 22, 2020
StratEdge Reports A Strong Third Quarter
StratEdge Corporation announces a strong third quarter with a marked increase recently in requests for 5G-related quotes and contract orders when compared to the rest ...
August 14, 2020
StratEdge White Paper, 'Eutectic Die Attach Optimizes High Power GaN Devices,' is Now Available
StratEdge Corporation announces that the white paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is now available on the StratEdge website. The article ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address