Press Release - SET
September 8, 2021  -  Click the title to read the full press release.

Hybrid bonding partnership SET-SUSS MicroTec



SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology. ...

SET
September 8, 2021
Hybrid bonding partnership SET-SUSS MicroTec
SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology. ...
September 7, 2021
SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec announces a joint development agreement (JDA) with SET, a leading supplier of high precision flip-chip bonders. The main focus of the JDA is the development ...
January 4, 2021
Full Wafer Double Sided Monolithic Lens Fabrication
In this paper, we discuss the capability of SUSS UV-imprint lithography together with an optically tailored, UV-curable epoxy resin from DELO to manufacture double-sided ...
December 16, 2020
SUSS MicroTec Opens New Production Facility in Taiwan
SUSS MicroTec is opening the doors of its new production facility in HsinChu, Taiwan. The company is responding to increased industry demand due to booming applications ...
December 14, 2020
SUSS MicroTec Announces New Mask Aligner for Imprint
SUSS MicroTec announces the launch of its latest generation mask aligner, the MA8 Gen5. The new semi-automated tool is specifically aimed at imprint lithography, a key enabling ...
September 9, 2020
SUSS MicroTec and DELO Announce Collaboration on Imprint Lithography
SUSS MicroTec and DELO cooperate in the optimization of imprint manufacturing processes for the production of wafer-level optics (WLO). These optics are essential for emerging ...
June 10, 2020
SUSS MicroTec and micro resist technology GmbH Partner in Advancing Nanoimprint Lithography
SUSS MicroTec and micro resist technology GmbH announce a joint venture to further advance the deployment of Nanoimprint Lithography (NIL) in the production of future ...
May 21, 2020
Smart Recovery after Handling Failure
SUSS tools offer a new scheduling feature that addresses the handling challenges caused by higher substrate warpage and brittle substrates.
April 15, 2020
New Fusion Bond Solution Available
High precision fusion bonding, and integrated metrology capability are new features for the SUSS automated permanent wafer bonding platform XBS200.
April 15, 2020
SUSS MicroTec Successfully Purchases the Inkjet Printer Division of Meyer Burger
SUSS MicroTec announces the closing of the acquisition of PiXDRO, the inkjet printing division of Meyer Burger (Netherlands) B.V. On December 20, 2019, the intention ...
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