Press Release - MRSI Systems
September 15, 2021  -  Click the title to read the full press release.

MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret



Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled "DIE PLACEMENT HEAD WITH TURRET" and numbered ZL 201680048482.5 ...

MRSI Systems
September 22, 2021
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event ...
September 17, 2021
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled "DIE PLACEMENT HEAD WITH TURRET" and numbered ...
September 15, 2021
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled "DIE PLACEMENT HEAD WITH TURRET" and numbered ZL 201680048482.5 ...
August 17, 2021
MRSI opens a new Product Demo Center in China, will present at Infostone Conference
MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center. MRSI will ...
July 12, 2021
MRSI, Mycronic Opens New Demo Center in Shenzhen, China
MRSI Systems (Mycronic Group) has opened the doors to their new "Product Demo Center" in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park ...
March 15, 2021
MRSI to Offer Live Die Bonding Demos at Laser World of Photonics March 17-19
MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New Interational Expo Center (Booth #W2.2587) in Shanghai ...
February 11, 2021
MRSI-S-HVM Submicron Die Bonder won award "Infostone 2020 The Most Competitive Optical Communications Product"
MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM ...
December 15, 2020
MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute
MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between the companies. ...
October 1, 2020
MRSI launches MRSI-705 high-volume configuration
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 ...
September 9, 2020
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and WLP
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address