Press Release - 3D-Micromac AG
October 7, 2021  -  Click the title to read the full press release.

3D-Micromac Introduces New Laser System for Half- and Shingled-Cell Cutting



3D-Micromac AG introduced an advanced laser cutting system for half- and shingled solar cells – the microCELL™ MCS. The new microCELL MCS advanced laser system has been ...

3D-Micromac AG
October 7, 2021
3D-Micromac Introduces New Laser System for Half- and Shingled-Cell Cutting
3D-Micromac AG introduced an advanced laser cutting system for half- and shingled solar cells – the microCELL™ MCS. The new microCELL MCS advanced laser system has been ...
October 5, 2021
Monolithic Magnetic Sensors Manufactured by Selective Laser Annealing
This paper gives an overview of the design, function, operation, and production results for a laser-based annealing technology which enables the programming of ...
May 13, 2021
3D-Micromac Eliminates Critical Process Bottlenecks to microLED Display Manufacturing
3D-Micromac AG introduced microCETI™ -- the first laser micromachining platform that supports all laser processes in microLED display manufacturing with the high throughput ...
February 3, 2021
Changes in the Management Board of 3D-Micromac AG
3D-Micromac AG is pleased to announce that as part of its successful strategic realignment, a consortium of US investors has acquired a majority stake in the company. The founder ...
January 21, 2021
VIEWPOINT 2021: Uwe Wagner, Chief Technology Officer, 3D-Micromac AG
Wagner_uwe_60-75.jpg
The semiconductor industry has shown surprising resilience in the face of the global COVID-19 pandemic, with continued growth forecasted for 2021. The pace of semiconductor innovation has also not slowed down. However, as costs and technical challenges associated with new devices and packaging continue ...
November 13, 2020
3D-Micromac Unveils High-Throughput Selective Laser Annealing System
3D-Micromac AG introduced the first industrial selective laser annealing system for magnetic sensor formation--the microVEGA™ xMR. Incorporating a highly flexible ...
July 30, 2018
Lasers for High-speed Sample Preparation
New developments in laser micromachining enable the use of lasers in high-throughput sample preparation to improve microstructure diagnostics and failure analysis. ...
July 10, 2018
3D-Micromac Unveils Laser-based High-volume Sample Preparation Solution
3D-Micromac AG introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials ...
June 27, 2018
3D-Micromac Introduces Selective Laser Annealing System
3D-Micromac AG unveiled the microPRO™ RTP--its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing ...
May 21, 2018
3D-Micromac Receives Order for New microMIRA Excimer Laser Lift-off System from dpiX
3D-Micromac AG announced it has received an order for the company's new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-res ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address