Press Release - Henkel Corporation
September 20, 2022  -  Click the title to read the full press release.

Henkel unveils semiconductor capillary underfill for advanced silicon node flip chip applications



Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging ...

Henkel Corporation
September 20, 2022
Henkel unveils semiconductor capillary underfill for advanced silicon node flip chip applications
Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging ...
August 29, 2022
Henkel Korea Inaugurates Songdo Plant, Delivering World Class Production Capacity
Henkel Korea has announced the completion of its state-of-the-art Songdo Plant within the Songdo High-tech Industrial Cluster in Incheon, which will become the Asia-Pacific ...
August 10, 2022
Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
Henkel and Chip Integration Technology Center (CITC) announced that the organizations have formalized an agreement to collaborate on the development of high-thermal die ...
May 17, 2022
Henkel Opens New Technical Application Center in Silicon Valley
Henkel announced the opening of its Application Center in Santa Clara, CA designed to support ...
February 1, 2022
VIEWPOINT 2022: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel
Trichur_Ram_70-55_2.jpg
In my 20 years in the semiconductor industry, I have never experienced such an intersection of demand drivers and workforce challenges as seen in late 2020 and throughout 2021. While automotive electrification, big data, mobile and 5G were all predicted to grow at a steady pace over the next several years ...
November 9, 2021
High Thermal Non-Conductive Die Attach
Tight die-to-die placement and higher voltage designs require a non-conductive die attach paste that can meet tough reliability and thermal requirements. Check out ...
September 15, 2021
Maximizing Protection of Flip Chip Interconnects
Higher flip chip I/O requirements and processing complexities are making robust bump protection increasingly important and harder to achieve. Learn how material ...
July 21, 2021
Henkel's LOCTITE® STYCAST® OS 5101 for Optical Lens and Component Bonding
Tackling the reliability and data rate demands of 100 gigabit ethernet (GbE) and 400 GbE optical transceivers in next-generation cloud and hyperscale data centers, Henkel has ...
June 24, 2021
Die Attach for 5G Designs
How capable is your die attach material for 5G devices? Increasingly integrated designs, more die per package and higher reliability demands are pushing conventional ...
April 6, 2021
Semiconductor Device Innovation Driving Automotive Advances
Today's automobiles are computers on wheels, with some vehicles containing more than 3,500 semiconductors! How are auto engineers ensuring reliability of these ...
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