Press Release - SET (Smart Equipment Technology)
November 21, 2022  -  Click the title to read the full press release.

SET launches the FC150 PLATINUM Advanced R&D Flip-Chip Bonder



As SEMICON Europa 2022 kicks off in Munich, Germany, SET officially launches the FC150 PLATINUM for the telecom, quantum, automotive, defense, HPC, AI, VR markets. This ...

SET (Smart Equipment Technology)
November 21, 2022
SET launches the FC150 PLATINUM Advanced R&D Flip-Chip Bonder
As SEMICON Europa 2022 kicks off in Munich, Germany, SET officially launches the FC150 PLATINUM for the telecom, quantum, automotive, defense, HPC, AI, VR markets. This ...
November 25, 2019
SET Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production
SET, Smart Equipment Technology, announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full ...
January 18, 2016
SET, Smart Equipment Technology Joins IRT Nanoelec 3D Integration Program
SET, Smart Equipment Technology announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics ...
November 21, 2011
FC300R High Accuracy Bonder with Robotics
Ideal for high accuracy C2W bonding for 3D integration, the FC300R features Face-to-Back or Face-to-face Alignment (flip-chip). The system, with high ...
November 9, 2011
Process & Equipment Enhancements for C2W Bonding
This paper reviews three major areas of process or equipment development: bonding throughput enhancement, the removal and prevention of surface ...
June 16, 2011
3D-IC Integration Using C2C or C2W Alignment
3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances ...
May 27, 2011
Chip to Wafer Technologies for High Density 3D Integration
A revolutionary technology based on C2W direct metallic bonding to overcome certain limitations in 3D integration. It consists of attaching ...
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