Press Release - TechSearch International
November 22, 2022  -  Click the title to read the full press release.

TechSearch International Analyzes Impact of Slowing Demand on FC and WLP



TechSearch International's latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP ...

TechSearch International
November 22, 2022
TechSearch International Analyzes Impact of Slowing Demand on FC and WLP
TechSearch International's latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP ...
July 27, 2022
TechSearch Int'l Examines High-Performance Package Options
TechSearch International's latest analysis describes high-performance package options with an update on TSMC's new offerings, including ...
May 18, 2022
TechSearch International's Analysis Examines Impact of World Events, Material Shortages
2021 was a record year for the semiconductor industry and OSAT revenues, but the outlook ...
March 1, 2022
Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers
SEMI and TechSearch International announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated ...
February 15, 2022
TechSearch International's Analysis Shows Build-up Substrate Shortage Could End in 2026
The shortage of build-up substrates will be worse this year than in 2021, and the gap between supply and demand looms even larger in 2023. Many substrate makers are adding ...
August 9, 2021
TechSearch International's Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What's driving the insatiable demand? ...
June 28, 2021
What's in the Apple Watch Series 6?
TechSearch International's teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer ...
June 2, 2021
TechSearch International's BGA and CSP Market Analysis
The industry saw strong production growth in 2020 and Q1 2021 was a record quarter compared to a year ago. Demand for PCs, especially laptops, tablets, wearables ...
March 25, 2021
TechSearch International Analyzes Substrate Shortages and Explores Potential Solutions
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity ...
February 23, 2021
TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables ...
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