May 26, 2023
EV Group and Dymek Form JV Company in Malaysia to Enhance Regional Support
EV Group (EVG) announced that they have established a new joint venture company in Malaysia. The new company, called EV Group Malaysia Dymek Sdn. Bhd., will be charged ...
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May 22, 2023
EV Group Solutions for Heterogeneous Integration to be Highlighted at ECTC 2023
EV Group (EVG) announced that new developments in heterogeneous integration enabled by its advanced wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography ...
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April 19, 2023
EV Group and Notion Systems Team Up on Nanoimprint Lithography
EV Group (EVG) announced that they have entered into an agreement to develop the first fully integrated and automated nanoimprint lithography (NIL) solution with inkjet ...
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November 9, 2022
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
EV Group (EVG) announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated ...
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September 14, 2022
EV Group Revolutionizes 3D Integration with NanoCleave Layer Release Technology
EV Group (EVG) introduced NanoCleave™, a revolutionary layer release technology ...
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September 6, 2022
EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development
EV Group (EVG) announced that it has expanded its collaboration with the Industrial Technology Research Institute (ITRI), one of the world’s leading applied technology ...
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July 18, 2022
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone
EV Group (EVG) announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully ...
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June 20, 2022
EV Group Earns Triple Crown Win in TechInsights 2022 Customer Satisfaction Survey
EV Group announced that it has once again been voted by customers as one of the 10 BEST ...
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May 31, 2022
EV Group Lithography Solutions for HI and WLP to Be Highlighted at ECTC 2022
EV Group (EVG) announced that new developments in heterogeneous integration ...
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March 7, 2022
EV Group and Teramount Collaborate to Implement Packaging Technologies for Photonic Integrated Circuits
EV Group (EVG) and Teramount announce a collaboration on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber chip packaging. The collaboration ...
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