May 23, 2023
Low-pressure, thin bond line TIM from Henkel brings best-in-class thermal management solution for next-gen ICs
Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel today announced the commercial availability of Bergquist® Hi Flow THF 5000UT. The phase ...
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May 9, 2023
Henkel debuts ultra-high thermal conductivity pressure-less sintering die attach adhesive
Henkel announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal die attach adhesives. With 165 W/m-K ...
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April 10, 2023
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award
Henkel announced that it has earned the Material Supplier of the Year distinction from the 3D InCites community as part of its recent ...
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March 21, 2023
Henkel delivers versatile, high thermal die attach adhesive for Power IC applications
As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches to die thermal control and electrical performance are required. ...
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February 22, 2023
VIEWPOINT 2023: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel
We started 2022 on the heels of what I call a 'magical year' in the semiconductor packaging market, with unprecedented demand from all sectors — consumer electronics, 5G, and automotive — converging in 2021. It was a record-setting performance for the industry that will be hard to reproduce. Because of this ...
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December 1, 2022
Non-conductive Die Attach Film for Lead Frame and Laminate Packages
Henkel announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the ...
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November 16, 2022
Electrically conductive adhesive from Henkel designed to accommodate compact camera module complexity
Henkel continues to lead in consumer electronic material solutions and announced its latest innovation, an electrically conductive ...
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November 1, 2022
Mobile Antennas and Power Devices that Break the Mold
New liquid mold compound encapsulants are enabling advances in active mold packaging using laser direct structuring. This technique holds great potential for 5G mmWave ...
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September 20, 2022
Henkel unveils semiconductor capillary underfill for advanced silicon node flip chip applications
Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging ...
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August 29, 2022
Henkel Korea Inaugurates Songdo Plant, Delivering World Class Production Capacity
Henkel Korea has announced the completion of its state-of-the-art Songdo Plant within the Songdo High-tech Industrial Cluster in Incheon, which will become the Asia-Pacific ...
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