April 29, 2025
Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes.
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March 11, 2025
Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.
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December 18, 2024
New Industry Technical Paper on Optimizing Cleaning Strategies
ZESTRON is proud to announce that Ravi Parthasarathy, Principal Engineer | Advanced Applications, presented his latest technical paper, "Optimizing Cleaning Strategies for ...
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December 3, 2024
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging
ZESTRON is pleased to release the whitepaper "Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield." Whitepaper Abstract: Lead frame ...
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August 14, 2024
ZESTRON Hosts Webinar on Cleaning Strategies and Corrosion Mitigation
ZESTRON is pleased to announce an upcoming webinar, "Advancing Reliability in Automotive Power Electronics: Cleaning Strategies and Corrosion Mitigation." This informative ...
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August 7, 2024
Join ZESTRON's Upcoming Webinar, Optimizing Removal of Conformal Coating Residues
ZESTRON is pleased to announce an upcoming webinar titled "Optimizing Removal of Conformal Coating Residues: Efficient, Cost-effective, and Safe Methods." This educational ...
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July 15, 2024
Register for ZESTRON's Upcoming Webinar on "Unveiling Defluxing Strategies ..."
ZESTRON is pleased to announce an upcoming webinar titled "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs." ...
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July 8, 2024
ZESTRON Welcomes Daniel Chacon to the LATAM Sales Team
ZESTRON is pleased to announce Daniel Chacon's appointment as the newest member of the LATAM Sales Team. Daniel Chacon joins ZESTRON with a wealth of experience in sales ...
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May 17, 2024
ZESTRON Announces Upcoming Webinar on Optimizing HBM Wafer Surface Treatment
ZESTRON is excited to announce an upcoming webinar titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges." ...
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May 2, 2024
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
ZESTRON proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning ...
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