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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
July 11, 2023 - Click the title to read the full press release.
3D-Micromac AG announced that new developments with its laser micromachining solutions used in manufacturing power ...
3D-Micromac
February 6, 2025
VIEWPOINT 2025: Uwe Wagner, Chief Executive Officer, 3D-Micromac AG
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July 31, 2024
3D-Micromac Receives Laser-Trimming-System Order from Infineon for new Dresden Smart Power Fab
3D-Micromac AG announced that Infineon Technologies Dresden GmbH & Co. KG has ordered one of 3D-Micromac's first microVEGA™ FC laser-trimming systems for Infineon's ...
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July 11, 2023
3D-Micromac to present breakthroughs in laser micromachining at SEMICON West
3D-Micromac AG announced that new developments with its laser micromachining solutions used in manufacturing power ...
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May 5, 2023
Improving SiC Power Devices with Laser Ohmic Contact Formation
Learn about the impact of laser-based OFC on the electrical characteristics of SiC-Ni interfaces and its effect on surface structures, including with thin wafers.
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April 13, 2023
3D-Micromac Shortens Atom Probe Tomography Sample Preparation Time to Minutes
3D-Micromac AG introduced the microPREP™ PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and ...
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January 5, 2023
VIEWPOINT 2023: Uwe Wagner, CEO, 3D-Micromac
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. However, the microLED fabrication process ...
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December 8, 2022
3D-Micromac and SCHOTT Join Forces to Improve AR Waveguide Yields and Costs
3D-Micromac AG announced that it has entered into a joint-development partnership (JDP) with SCHOTT, a leading international technology group and inventor of specialty glass ...
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November 29, 2022
3D-Micromac CEO to Present at TechBlick MiniLED and MicroLED Displays Conference
3D-Micromac AG announced that its CEO, Uwe Wagner, is presenting at the TechBlick "Mini- & Micro-LED Displays: Markets, Manufacturing Innovations, Applications, Promising ...
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November 10, 2022
3D-Micromac Receives Order for Multiple Laser Lift-Off Systems for microLED Device Manufacturing
3D-Micromac AG announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production ...
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June 29, 2022
3D-Micromac to Supply Solar Cell Laser Cutting Systems to Bottero S.P.A.
3D-Micromac AG announced that it has received a multi-system order for its microCELL™ MCS high-throughput laser cutting solution to support Enel Green Power's TANGO 3-Gigawatt ...
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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