semiconductor
packaging news
Sponsor
MicroCircuit-Laboratories-LLC

FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC
Ontos-Equipment-Systems
Press Release
October 2, 2023  -  Click the title to read the full press release.

Microtechnology conquers space for more precise earth observation



Earth observation is like a super detective for our planet. It shows us what's happening on Earth and even influences our daily lives, for example, through more accurate ...

Fraunhofer Institute for Photonic Microsystems
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Sponsor
Nordson-ASYMTEK

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions
kyzen