Sponsor

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos

Essential Practices for Gold Mitigation of Electronic Components

Sponsor

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.

Industry Calendar

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Sep 21, 2026
Advanced CMOS/FinFET Fabrication
Semitracks

Sep 28, 2026
IMAPS Symposium 2026: Intelligent Packaging for the AI Era
IMAPS

Sep 30, 2026
The European conference on microelectronic trends, roadmaps and strategic alignment
FMD

Oct 1, 2026
Si Photonics Packaging Summit
IMAPS

Oct 1, 2026
3DIC 2026
IEEE

Oct 13, 2026
SEMICON West 2026
SEMI

Oct 27, 2026
NEPCON ASIA 2026
RX

Nov 1, 2026
International Trade Partners Conference - ITPC 2026
SEMI

Nov 10, 2026
SEMICON Europa 2026
SEMI

Dec 9, 2026
SEMICON Japan 2026
SEMI

Dec 12, 2026
International Electron Device Meeting 2026
IEEE

Jun 1, 2027
Electronic Components & Technology Conference
IEEE

Jun 20, 2027
IEEE/JSAP Symposium of VLSI Technology & Circuits 2027
VLSI

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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH