Press Release Index
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4767 press listings.

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May 30, 2023
CEA-Leti to Report New Integration & Packaging Gains at ECTC
CEA-Leti will present new integration and packaging technologies for next-generation LiDAR optical-network driving devices in autonomous vehicles at the Electronic Components ...

May 30, 2023
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound ...

May 30, 2023
IEDM 2023 Announces Call for Papers
Under the theme "Devices for a Smart World Built Upon 60 Years of CMOS," the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers ...

May 26, 2023
EV Group and Dymek Form JV Company in Malaysia to Enhance Regional Support
EV Group (EVG) announced that they have established a new joint venture company in Malaysia. The new company, called EV Group Malaysia Dymek Sdn. Bhd., will be charged ...
EV Group

May 26, 2023
Imec and Brewer Science present process solutions for CVD oxide deposition processes at ECTC
Brewer Science, Inc. is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd. Dr. Koen Kennes from imec is ...
Brewer Science, Inc.

May 26, 2023
SEMI North America Advisory Board Welcomes New Members
SEMI announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems ...

May 24, 2023
MSTC 2023 Opens With Latest MEMS and Sensors Advances
Advances driving the next generation of medical, environmental and mobility applications will take center stage at the SEMI MEMS & Sensors Technical Congress (MSTC 2023) ...

May 24, 2023
Mycronic receives order for a Prexision 8 Evo and a Prexision Lite 8 Evo
Mycronic AB (publ) has received an order for a Prexision 8 Evo and a Prexision Lite 8 Evo from an existing customer in Asia. The order value is in the range of USD 31-34 million. ...
Mycronic AB

May 24, 2023
TechSearch's Market Forecast for BGAs and CSPs Reveals the Downside of the Covid Spending Spree
TechSearch International's latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced ...
TechSearch International

May 23, 2023
Low-pressure, thin bond line TIM from Henkel brings best-in-class thermal management solution for next-gen ICs
Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel today announced the commercial availability of Bergquist® Hi Flow THF 5000UT. The phase ...
Henkel Corporation

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