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Press Release Index
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Oct 30, 2026
MicroBias: Integrated micromagnets enable precise, miniaturized magnetic sensor systems
Fraunhofer Institute for Integrated Circuits
Oct 30, 2026
Advanced Process Solutions Elevates Clint Johnson to Vice President of Services and Operations
Advanced Process Solutions
Oct 30, 2026
Navigating complex development processes in the semiconductor industry with confidence
TÜV SÜD
Oct 30, 2026
AI is splitting the PCB industry in two
YOLE Group
Oct 29, 2026
STMicroelectronics introduces first automotive safety combination sensors for mass-market applications
STMicroelectronics Inc.
Oct 29, 2026
Littelfuse/C&K Introduces SDE Series Low-Profile, End-Stackable Surface-Mount DIP Switches
Littelfuse, Inc.
Oct 29, 2026
Nordson Test & Inspection Wins 2026 Best of West Award
Nordson Test & Inspection
Oct 29, 2026
Indium Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX China
Indium Corporation
Oct 28, 2026
Infinitesima appoints VP Corporate Affairs to support international expansion
Infinitesima
Oct 28, 2026
Bronwyn Brophy O'Connor to become CEO of Carl Zeiss Meditec Group
Carl Zeiss Meditec AG
Oct 28, 2026
Critical Manufacturing Expands Industrial Operations Platform with Purpose-Built AI Agents
Critical Manufacturing
Oct 28, 2026
Brewer Science to Showcase Advanced Materials Innovation at SEMICON Europa 2026
Brewer Science, Inc.
Oct 27, 2026
Nordson Test & Inspection to Unveil SonoFlex Acoustic Inspection System at SEMICON West 2026
Nordson Test & Inspection
Oct 27, 2026
Quasys Europe consolidates sales in semiconductor manufacturing
Quasys
Oct 27, 2026
QSolid Shows What German Quantum Technology Can Achieve
Fraunhofer Institute for Photonic Microsystems
Oct 27, 2026
Gemeni Storyboard adds local CSV-to-HTML visual planning
Gemini Integrated Electronics Ltd.
Oct 26, 2026
Siemens and NVIDIA advance AI-powered PCB inspection from Digital Twin to factor
Siemens
Oct 26, 2026
Silicon Nitride Crucibles for Silicon Crystal Growth
M-Kube Enterprise LLC
Oct 26, 2026
STMicroelectronics adds MasterGaN7 devices to integrated high-efficiency power family
STMicroelectronics Inc.
Oct 26, 2026
SEMI Forecasts 11.8% Growth in Silicon Wafer Shipments in 2026
SEMI
Oct 23, 2026
ETEL Announces METIS HP—a new high‑precision XY air bearing stage
ETEL
Oct 23, 2026
Wake-Up Receiver with Extended Range
Fraunhofer IPMS
Oct 23, 2026
STMicroelectronics simplifies authentication of Matter smart-home devices with ST MatterConnect
STMicroelectronics Inc.
Oct 23, 2026
Zeta Potential Analyzer Helps Evaluate Dispersion Stability in Conductive Inks for Printed Electronics
M-Kube Enterprise Pty Ltd
Oct 23, 2026
Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
Siemens
Oct 22, 2026
VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution
VON ARDENNE
Oct 22, 2026
JST Launches Upgraded IPA-based Apex Wafer Dryer
Oct 22, 2026
​​ZEISS Group appoints Axel Christian as President of ZEISS North America ​
ZEISS
Oct 22, 2026
Amkor and NVIDIA Advance Strategic Partnership for AI Infrastructure
Amkor Technology, Inc.
Oct 21, 2026
Almatec FUTUR Series AODD Pumps Now Feature Pre-Validated Data for UHP Reliability
Almatec
Oct 21, 2026
NEPCON ASIA 2026 Brings Together Technology Leaders and Manufacturers from Around the World
RX Global
Oct 21, 2026
STMicroelectronics expands space-grade portfolio with QML-V qualified quad LVDS receiver
STMicroelectronics Inc.
Oct 21, 2026
Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports
SEMI
Oct 20, 2026
Siemens transforms computational lithography for next-generation AI semiconductors with NVIDIA cuLitho
Siemens Industry Software, Inc.
Oct 20, 2026
xPUs and networking, the two pillars of AI infrastructure
YOLE Group
Oct 20, 2026
Indium Corporation's Andreas Karch Receives IEC 1906 Award for Global Standardization Contributions
Indium Corporation
Oct 20, 2026
JST Launches Upgraded IPA-based Apex Wafer Dryer
JST
Oct 19, 2026
Littelfuse Launches TP7.0SMD-XC Automotive TVS Diodes with Extremely Low Clamping Voltage
Littelfuse, Inc.
Oct 19, 2026
Kulicke & Soffa Earns 2026 SEMI Award for North America at SEMICON West
SEMI
Oct 19, 2026
Fujifilm to Expand CMP Slurry Production Capacity in the United States
FUJIFILM Corporation
Oct 19, 2026
Agileo Automation appoints Semitorr – CTW Solutions as distributor for North American fab market
Agileo Automation
Oct 16, 2026
Plasma for Stable Surface Processes in Chip Manufacturing
Plasmatreat GmbH
Oct 16, 2026
The Adaptsys Group to Show Advanced Automation Solutions at SEMICON Europa 2026
Adaptsys
Oct 16, 2026
Sono-Tek to Introduce SPT300WS Automated Ultrasonic Wafer Coating System at SEMICON Europa
Sono-Tek Corporation
Oct 16, 2026
Koh Young Showcases Advanced Packaging and Wafer-Level Inspection at SEMICON Europa 2026
Koh Young Technology Inc.
Oct 15, 2026
How SiC Sheets Meet the Demands of Advanced Semiconductor Engineering
M-Kube Enterprise LLC
Oct 15, 2026
STMicroelectronics reveals high-accuracy two-in-one altitude and underwater depth sensor
STMicroelectronics Inc.
Oct 15, 2026
Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates, SEMI Projects
SEMI
Oct 15, 2026
Seika Machinery Offers Portable DH-35A Meter for Trace Dissolved Hydrogen Measurement
Seika Machinery, Inc.
Oct 14, 2026
Aehr Test Systems to Announce First Quarter Fiscal 2027 Financial Results on November 2, 2026
Aehr Test Systems
Oct 14, 2026
Titanium Spring Solutions Support Precision Engineering for Advanced Electronic Equipment
M-Kube Enterprise Pty Ltd
Oct 14, 2026
Li-Fi TinySpot: Compact, Ultra-Low-Power Optical Data Link
Fraunhofer IPMS
Oct 14, 2026
Seika Machinery Highlights DKK-TOA MM-43X Multi-Function Water Quality Meter
Seika Machinery, Inc.
Oct 13, 2026
Chelsea Jewell to Present on Pre-Immersion Cleaning Chemistries at OCP Global Summit 2026
Kyzen Corporation
Oct 13, 2026
Indium Corporation Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026
Indium Corporation
Oct 13, 2026
Junkosha showcases collaborative cable engineering at SEMICON West
Junkosha
Oct 13, 2026
Green Circuits to Spotlight Quick-Turn PCB Assembly and Production Capabilities at SEMICON West 2026
Green Circuits
Oct 12, 2026
Indium Expert to Present Thermal Management Strategies for Next-Gen AI Applications at OCP Global Summit
Indium Corporation
Oct 12, 2026
MicroLED: From the living room to the AI data center
YOLE Group
Oct 12, 2026
ZEISS INNOVATION SUMMIT 2026 brings together international experts in Berlin
ZEISS
Oct 12, 2026
FUCHS Lubricants Co. to Showcase Lubrication Solutions at SEMICON West 2026
FUCHS Lubricants Co.
Oct 9, 2026
Littelfuse Unveils Ultra-Low Capacitance TVS Diode Arrays with Industry’s Lowest Clamping Voltage
Littelfuse, Inc.
Oct 9, 2026
At SEMICON West, Festo Puts Controlled Pneumatics to Work
Festo
Oct 9, 2026
AI Meets Advanced Packaging: APHI Summit Puts the Spotlight on Heterogeneous Integration
APHI Summit
Oct 9, 2026
Aehr Receives Follow-On Sonoma(TM) Production Orders
Aehr Test Systems
Oct 8, 2026
Gigaphoton Develops Gas Recycling System for ArF Excimer Lasers
Gigaphoton
Oct 8, 2026
SEMIEXPO Viet Nam 2026: Shaping Viet Nam's Semiconductor Future
SEMI
Oct 8, 2026
MVP Advances Semiconductor Inspection at SEMICON West 2026
Machine Vision Products, Inc.
Oct 8, 2026
IPG Photonics to Showcase Laser Technologies for Automotive Manufacturing at IZB 2026
IPG Photonics Corporation
Oct 7, 2026
KYZEN's Customer‑Focused Cleaning Solutions Win 2026 Service Excellence Award
Kyzen Corporation
Oct 7, 2026
Liquid Tape for Gas Diffusion Layer Fixation in Fuel Cells
DELO
Oct 7, 2026
Acid Resistant, Non-Drip Epoxy System Withstands Elevated Temperatures
Master Bond Inc.
Oct 7, 2026
Tresky eliminates the need for an optical beamsplitter during DIE bonding
Tresky Automation
Oct 6, 2026
TRUMPF makes glass substrates ready for the next generation of AI chips
TRUMPF
Oct 6, 2026
ICsense reports 30% revenue growth as demand for independent custom IC supply accelerates
ICsense
Oct 6, 2026
Paragraf Expands 2D Materials Portfolio to Power Energy-Efficient Technologies
Paragraf
Oct 6, 2026
KYZEN Promotes KJ Lee to General Manager for Asia
Kyzen Corporation
Oct 6, 2026
3D-Micromac Highlights Laser Sample Preparation for Failure Analysis at SEMICON West
3D-Micromac
Oct 6, 2026
Gigaphoton Begins Evaluation of L300KZ Excimer Laser for PLD
Gigaphoton Inc.
Oct 6, 2026
SUSS enters Wafer-Cleaning Market with launch of GreenTec Solutions Product Line and first GT200 System
SUSS MicroTec
Oct 6, 2026
Robotaxi: the comeback of a market on the road to scale
YOLE Group
Oct 5, 2026
TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips
TRUMP
Oct 5, 2026
Aismalibar North America to Showcase Advanced Thermal Management Materials at PCB West 2026
Aismalibar S.A.
Oct 5, 2026
ERS electronic Unveils Fully Automated 310 x 310mm Panel-Level Packaging System
ERS electronic GmbH
Oct 5, 2026
ITEN makes one million solid-state batteries, adds a 1,500 µAh SMD device.
ITEN
Oct 2, 2026
Fraunhofer RISC-V Secure Element Accelerates Secure Chip Development After Successful Silicon Validation
Oct 2, 2026
Aehr Test Systems to Participate in 18th Annual CEO Investor Summit 2026 in San Francisco
Aehr Test Systems
Oct 2, 2026
CEA-Leti and Quobly Strengthen Their Collaboration
CEA-Leti
Oct 2, 2026
YINCAE Shows Innovative Materials to SEMICON West 2026
YINCAE Advanced Materials, LLC
Oct 1, 2026
Thailand Unveils First National Semiconductor Strategy, Targets $80 Billion in Investment by 2050
Thailand Board of Investment
Oct 1, 2026
Nordson Electronics Solutions to Feature New Fluid Dispensing and Plasma Treatment Systems at SEMICON West
Nordson Electronics Solution
Oct 1, 2026
KYZEN Announces Retirement of Cesar Gazcon, Addition of Rolando Partida to Mexico Sales Team
Kyzen Corporation
Oct 1, 2026
EV Group Highlights Hybrid Bonding, Layer Transfer and Lithography at SEMICON West
EV Group
Sep 30, 2026
Littelfuse Launches AK-FL Series FlatSuppressX™ TVS Diodes for Aviation Power Systems
Littelfuse, Inc.
Sep 30, 2026
Infinitesima strengthens global applications team with a senior appointment
Infinitesima
Sep 30, 2026
Siemens and TSMC advance AI-powered semiconductor design automation
Siemens Industry Software, Inc.
Sep 30, 2026
High-end packaging: A market set to nearly quintuple by 2031
Yole Group
Sep 29, 2026
Koh Young Hires Brent Johnson as Western Regional Sales Manager
Koh Young Technology Inc.
Sep 29, 2026
STMicroelectronics delivers advanced context-aware sensors in ST Sustainable Technology framework
STMicroelectronics Inc.
Sep 29, 2026
ASM launches breakthrough Flowable Carbon technology for the next era of semiconductor scaling
ASM Assembly Systems
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Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip