Press Release Index
  Page 1 of 311  
Jan 27, 2021
SECS/GEM Communication Package Announced for MPM Edison Stencil Printer
ITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides ...

Jan 27, 2021
D2S Unleashes the Petaflops Computing Era for Semiconductor Manufacturing
D2S introduced the seventh generation of its computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing ...

Jan 27, 2021
SEMICON Southeast Asia Postponed to August 2021 with Smart Technologies in Focus
With the world continuing to combat COVID-19, SEMI announced the postponement of SEMICON Southeast Asia (SEA) to 17-19 August 2021 to ensure the safety of exhibitors, partners ...

Jan 26, 2021
YES Adds Deca's Rapid Cure Technology to its Product Line
YES (Yield Engineering Systems, Inc.) announced that it has signed an agreement to license Deca Technologies' Rapid Cure technology. The Deca IP, a combination of UV and direct ...
Yield Engineering

Jan 26, 2021
DuPont and ITRI Jointly Inaugurate Semi Materials Lab
DuPont Electronics & Imaging and ITRI held a joint event celebrating the opening of a new laboratory for semiconductor materials R&D located in Hsinchu, Taiwan. The lab ...
DuPont Electronics & Imaging and ITRI

Jan 26, 2021
New ZEISS Compact Microscope Simplifies Digital Teaching and Daily Lab Work
ZEISS has introduced a new compact microscope for digital teaching and routine lab work just in time for the International Day of Education, which took place. ZEISS Primostar 3 ...

Jan 25, 2021
FCBGA packaging reaches new heights to US$12 billion by 2025
Yole's Advanced Packaging Monitor has been published every beginning of March (Q1), June (Q2), September (Q3) and December (Q4)... This monitor subscription provides quarterly ...
Yole Développement

Jan 25, 2021
What can we expect from autonomous vehicles?
There is a lot of evidence to show that ADAS (Advanced Driver Assistance Systems) can make vehicles safer, with many consumers expressing a desire to see these ...
UTAC Group

Jan 25, 2021
SET European reseller of the OntosTT atmospheric plasma system
The world's leading supplier of high precision flip-chip bonders SET will now supply in Europe the OntosTT stand-alone atmospheric plasma system, designed and mad ...
SET Smart Equipment Technology

Jan 22, 2021
SEGGER's J-Link OB plays crucial role in new BBC 'HiFive Inventor' educational kit
SEGGER's J-Link on-board debug probes can be found on hundreds of different evaluation boards and single-board computers around the globe. But few are as prominent as the BBC Doctor ...

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address