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May 30, 2023 CEA-Leti to Report New Integration & Packaging Gains at ECTC CEA-Leti will present new integration and packaging technologies for next-generation LiDAR optical-network driving devices in autonomous vehicles at the Electronic Components ... CEA-Leti May 30, 2023 Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027 Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound ... SEMI May 30, 2023 IEDM 2023 Announces Call for Papers Under the theme "Devices for a Smart World Built Upon 60 Years of CMOS," the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers ... IEDM May 26, 2023 EV Group and Dymek Form JV Company in Malaysia to Enhance Regional Support EV Group (EVG) announced that they have established a new joint venture company in Malaysia. The new company, called EV Group Malaysia Dymek Sdn. Bhd., will be charged ... EV Group May 26, 2023 Imec and Brewer Science present process solutions for CVD oxide deposition processes at ECTC Brewer Science, Inc. is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd. Dr. Koen Kennes from imec is ... Brewer Science, Inc. May 26, 2023 SEMI North America Advisory Board Welcomes New Members SEMI announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems ... SEMI May 24, 2023 MSTC 2023 Opens With Latest MEMS and Sensors Advances Advances driving the next generation of medical, environmental and mobility applications will take center stage at the SEMI MEMS & Sensors Technical Congress (MSTC 2023) ... SEMI May 24, 2023 Mycronic receives order for a Prexision 8 Evo and a Prexision Lite 8 Evo Mycronic AB (publ) has received an order for a Prexision 8 Evo and a Prexision Lite 8 Evo from an existing customer in Asia. The order value is in the range of USD 31-34 million. ... Mycronic AB May 24, 2023 TechSearch's Market Forecast for BGAs and CSPs Reveals the Downside of the Covid Spending Spree TechSearch International's latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced ... TechSearch International May 23, 2023 Low-pressure, thin bond line TIM from Henkel brings best-in-class thermal management solution for next-gen ICs Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel today announced the commercial availability of Bergquist® Hi Flow THF 5000UT. The phase ... Henkel Corporation |
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