December 19, 2025

What's Next for 2.5D Packaging? Interposers and silicon bridges are evolving as AI drives denser, costlier advanced packaging. Thicker, multi-layer interposers boost performance but add yield challenges, while bridges, organic, photonic, and future glass options aim to cut costs and expand functionality. Semiconductor Engineering

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Reliability Risks Shift To The Materials Stack As 3D integration and larger panels reshape advanced packaging, materials drive performance and reliability. With limited long-term data on new chemistries, the industry adopts co-optimization, process control, and early modeling to reduce failure risks. Semiconductor Engineering

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor How LAPLACE® Laser Assisted Bonding Saves Energy LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo. PacTech

TSMC Reportedly Accelerates Arizona 2nd Fab, Eyes 3Q26 Tool Install, 2027 3nm Production TSMC is accelerating U.S. chipmaking, planning to move tools into its second Arizona fab in mid-2026, enabling 3nm production in 2027. The shift pulls timelines forward, supports Apple and Nvidia demand, and advances a $165B push to localize manufacturing. TrendForce

Micron gives rosy sales forecast as AI spurs demand Micron Technology projected fiscal Q2 revenue of $18.3–$19.1 billion, far above analyst estimates, as soaring AI demand and memory shortages let the company charge more. Shares jumped 10%, reflecting robust sales and aggressive $20 billion investment plans. Taipei Times

Sponsor "Build Up" I/C Packages -- USA Fabrication High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more. Advanced Component Labs, Inc.

Technical Papers Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks MORE TECHNICAL PAPERS

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

Micron stock pops 10% as AI memory demand soars: 'We are more than sold out' Micron Technology surged 10% as strong AI-driven demand for its memory chips pushed fiscal first-quarter results past expectations. The company raised guidance, forecasted $100 billion high-bandwidth memory market by 2028, and boosted capital expenditures to $20 billion. CNBC

The U.S. CHIPS Act Takes Another Hit The U.S. Commerce Department ended SMART USA's $285M CHIPS Act contract despite meeting goals, disrupting digital-twin semiconductor research and workforce training. Lawmakers warn the move could weaken long-term industry-academic collaboration nationwide. IEEE Spectrum

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Canada Tempers AI Aspirations with Data Sovereignty Canada is pairing AI ambition with data sovereignty, pushing security from chip to cloud, common governance and built-in redundancy. Industry urges risk-based rules, trusted partners and local infrastructure, bolstered by Microsoft's major digital investment. EE Times

Rivian Replaces Nvidia with Own AI Chip EV maker Rivian unveiled its in-house Rivian Autonomy Processor (RAP1), replacing Nvidia chips to power Level 4 self-driving. Built on TSMC's 5-nm node, RAP1 boosts efficiency, integrates LiDAR, and may expand to Volkswagen through their $5.8B joint venture. EE Times

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Benefits and Limits Of Using ML For Materials Discovery Machine learning is accelerating materials discovery from data screening to molecule design, but experts stress AI depends on high-quality data and human judgment, as bias, limited context, and poor interpretability can undermine models without expert oversight. Semiconductor Engineering

Advanced Packaging: Driving Innovation, Performance, And New System Capabilities Advanced packaging is driving semiconductor growth as scaling slows. AI, HPC and automotive demand could push revenues toward $79.4 billion by 2030. Experts highlighted packaging, chiplets, interconnects and thermal innovations to lead Europe. Semiconductor Engineering

Sponsor New PLP solution improves underfill yields Underfill yields were greater than 99% and cycle time decreased 30% with the ASYMTEK Vantage system for panel-level packaging (PLP). Learn more. Nordson Electronics Solutions

MetaX and Moore Threads' IPOs underscore Chinese chipmakers' growing challenge to Nvidia Chinese AI chip IPOs are sparking investor frenzy as MetaX and Moore Threads soar on debut. Backed by Beijing's drive for semiconductor self-sufficiency, export curbs on Nvidia are speeding domestic GPU development and fueling long-term market optimism. CNBC

Sponsor Targeted Sample Preparation for Deeply Buried ROI in Advanced Packages New fault isolation technique using 3D X-ray microscopy & LaserFIB to pinpoint, isolate & open a 20 µm wirebond without damage to adjacent wires. ZEISS Microscopy