semiconductor
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Circuit-Technology-Center

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center
Industry Press
PackworldUSA to Showcase Advanced Heat Sealing Solutions for Tissue Banking at the AATB Annual Meeting 2025
Packworld USA
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE Advanced Materials
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Gen Power Semiconductors
Renesas Electronics Corporation
Syensqo launches industry-first portfolio of elastomers and lubricants fluids
Syensqo
Artificial Intelligence (AI) as a semiconductor growth engine
Yole Group
Teledyne e2v Achieves Initial Qualification of 16GB Space DDR4 Memory
Teledyne
HydroGraph Awarded New U.S. Patent for Graphene-Based Actuator Technology
HydroGraph
STMicroelectronics' half-bridge gate drivers ease design with GaN in low-voltage systems
STMicroelectronics
MORE INDUSTRY PRESS
Sponsor
ZEISS

See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy
Master-Bond
What Year Was It?
Capone Goes to Prison
What Year
Gangster Al Capone is sentenced to 11 years in prison for tax evasion and fined $80,000, signaling the downfall of one of the most notorious criminals of the 1920s and 1930s.
See the answer below.
Nordson-ASYMTEK
Sponsor
AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Pac-Tech
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
What Year Was It Answer
Capone Goes to Prison
Answer: October 17, 1931
October 17, 2025
image
Advanced Packaging: A Key Technology For The Next Generation Of Electronics
Advanced packaging is reshaping semiconductor design by integrating chips, memory, sensors, antennas, and photonics into compact, high-performance systems. Using TSVs, 2.5D interposers, and AiP, it enables faster, energy-efficient, and reliable devices for 5G, IoT, and autonomy.
Semiconductor Engineering
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
A Guide to Building Chiplets Today While Shaping Tomorrow's Standards
Semiconductor leaders are advancing chiplet integration to push SoC performance beyond reticle limits. UCIe, AIB, and BoW standards aim to enable universal, multi-die connectivity, with broad adoption expected between 2026 and 2030, shaping future chip design.
EE Times
Peer viewpoint: AI data centers are driving a semiconductor revolution
AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure.
Technical Paper
Sponsor
kyzen

Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
Chinese Research Team Breaks Precision Record with New Analog In-Memory Computing Chip
Nanjing University researchers created a high-precision analog computing chip using geometry-based weight encoding, achieving a record 0.101% RMSE in vector–matrix multiplication. Built on CMOS, it maintained exceptional accuracy under extreme conditions.
TrendForce
Worldwide Smartphone Market Grows 2.6% in Q3 2025 as Upgrades Accelerate, Driven by New Innovative Products, according to IDC
Global smartphone shipments rose 2.6% YoY to 322.7M units in 3Q25, marking continued recovery led by premium and AI-enabled devices. Apple and Samsung drove record July-quarter growth, while Xiaomi, Transsion & vivo gained share across emerging and midrange markets.
IDC
Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
Technical Papers
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
Peer viewpoint: AI data centers are driving a semiconductor revolution
MORE TECHNICAL PAPERS
Sponsor
Plasma-Etch

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
Gartner Says Worldwide PC Shipments Grew 8.2% in Third Quarter of 2025
Worldwide PC shipments reached 69M in Q3 2025, up 8.2% YoY, driven by Windows 10 EOS upgrades. North America grew just 1.6%, while AI PCs surged to 31% of shipments. Lenovo led top-five vendors with 16.6% growth, as the market shifts toward AI-enabled devices.
Gartner
AI Chips Shifting from Round to Rectangular
The AI chip boom is accelerating a shift from round wafers to rectangular panels, pushing toolmakers like Lam and Nikon to scale production. OSATs such as Amkor and ASE are expanding advanced packaging, challenging TSMC as panel-level packaging surges to $650M by 2030.
EE Times
Sponsor
XYZTEC

How to Wire Pull?
Learn how to perform an optimal pull test on wires or ribbons. This extensive guide also covers loop height measurement, vector pull, and SMD gull-wing leads pull. Download now.
xyztec
Tech giant ASML posts stable profit, warns on China
Dutch chip equipment maker ASML reported flat third-quarter net profit of €2.13 billion and €7.5 billion in sales, warning that China demand will drop sharply in 2026. The firm expects AI growth to lift annual sales to €44–60 billion by 2030.
Taipei Times
TSMC raises full-year growth outlook
TSMC raised its full-year revenue growth forecast to 35%, citing stronger-than-expected AI chip demand, despite market concerns over an AI bubble. The company posted record quarterly profit, boosted US investment, and plans accelerated deployment of 2-nanometer technology.
Taipei Times
Sponsor
Tresky

Ultrasonic Bonding in semiconductor industry - The fast and clean process
Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology.
Tresky
You Can Cool Chips With Lasers?!?!
Maxwell Labs is developing photonic cooling to tackle chip "hot spots" by converting heat into light using anti-Stokes fluorescence. Targeted lasers cool precise regions, potentially boosting chip performance while recycling energy, surpassing traditional air or liquid cooling limits.
IEEE Spectrum
Chance of AI market correction is 'pretty high,' says ex-Meta exec Nick Clegg as he pushes back on superintelligence
Former Meta executive Nick Clegg warned of a "pretty high" chance of a market correction in AI, citing inflated valuations and frenzied dealmaking. He stressed AI's long-term impact remains real, though adoption will likely proceed slower than hype suggests.
CNBC
Sponsor
CyberOptics

Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
Current Problems Grow For Power Delivery
Rising IR drop challenges modern chip design as thinner wires, higher current spikes, and tighter timing margins strain power delivery networks. Engineers must analyze PDNs early and optimize floorplans to balance voltage, thermal, and reliability trade-offs.
Semiconductor Engineering
Sponsor
Henkel-AG-Co

The experts agree
Performance and reliability top the priority list for semiconductor experts. Get our latest Research Report to explore how they’re addressing AI demands, integration challenges, and next-gen materials.
Henkel AG & Co.
Today's Sponsor
Ontos-Equipment-Systems
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
Test Your Knowledge
Which vitamin does the body get from sunshine?
See answer below.
Coresix-Precision-Glass
Quote of the Day
"Invention is the mother of necessity."
Thorstein Veblen
Sponsor
Ironwood-Electronics

Thermal Chuck & Socket Adapter
Connect adapter plate to the test socket, place device inside, & latch thermal chuck. Actively control 10 watt DUT from -40C to +155C Thermal System.
Ironwood Electronics
Industry Calendar
Nov 2, 2025
International Trade Partners Conference (ITPC)
SEMI
Nov 3, 2025
Wafer Fab Processing | Phoenix, AZ
Semitracks
Nov 18, 2025
SEMICON Europa 2025
SEMI
Nov 19, 2025
MEMS & Imaging Sensors Summit
SEMI
Dec 11, 2025
SEMICON Japan 2025
SEMI
FULL INDUSTRY CALENDAR
Advanced-Component-Labs
Cartoon of the Day
Cartoon
"I understand the importance of green technology, but explain to me again why we need solar-powered paperclips."
Copyright © Randy Glasbergen
Sponsor
Surfx-Technologies

Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
Balazs-Nanoanalysis
Test Your Knowledge Answer
Which vitamin does the body get from sunshine?
Answer: D