semiconductor
packaging news
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Industry Press
eBeam Initiative Survey Predicts Continued Growth in Photomask Market This Year
eBeam Initiative
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Siemens
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE Advanced Materials, LLC
Aehr Test Systems to Announce First Quarter Fiscal 2026 Financial Results
Aehr Test Systems
Nordson Test & Inspection Unveils Latest Inspection and Metrology Solutions at SEMICON West 2025
Nordson Test & Inspection
EV Group Highlights Hybrid Bonding, Lithography and More at SEMICON West
EV Group
Indium Corporation Features Next-Generation Materials for Semiconductor Assembly at IMAPS
Indium Corporation
scia Systems Showcases New Innovations at SEMICON West 2025
scia Systems GmbH
MORE INDUSTRY PRESS
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
EV-Group
What Year Was It?
O.J. Simpson Acquitted
What Year
At the end of a sensational trial, former football star O.J. Simpson is acquitted of the brutal 1994 double murder of his estranged wife, Nicole Brown Simpson, and her friend, Ronald Goldman.
See the answer below.
Ontos-Equipment-Systems
Sponsor
Coresix-Precision-Glass

High-Quality, High-Volume Glass Wafers
Many do one or the other — we do both. Quality, cleanliness, parallelism, flatness, roughness, serialization, traceability, consistency. Every wafer in spec, every time.
Coresix Precision Glass
Tresky
Sponsor
Balazs-Nanoanalysis

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
What Year Was It Answer
O.J. Simpson Acquitted
Answer: October 3, 1995
October 3, 2025
image
Huawei to Boost AI Chip Output Despite Additional US Curbs
Huawei is ramping up its AI chip ambitions, aiming to double Ascend 910C output to 600,000 units in 2026 and produce 1.6 million dies overall. The company plans four new Ascend chips, leveraging self-developed HBM technology amid U.S. sanctions.
Asia Times
Sponsor
ZEISS

Emerging Tech for 3D Packaging Enables More-than-Moore Era
AI-based 3D X-ray microscopy & LaserFIB enable fast, precise analysis for reliable package development with high throughput & success rates.
ZEISS Microscopy
Intel Rumored to Explore Foundry Deal with Archrival AMD Amid Big Tech Backing
Intel, backed by U.S. support and partners like NVIDIA and SoftBank, is in early talks with AMD about chip production, a move that could symbolize rivals' cooperation. Intel is also exploring deals with Apple and others to stabilize its foundry business.
TrendForce
In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Technical Paper
Sponsor
Amkor-Technology

Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.
From chip power to state leverage
Taiwan briefly imposed export controls on 47 products, including semiconductors, to pressure South Africa over its office relocations, then lifted them after Pretoria sought talks, demonstrating Taipei's ability to leverage its semiconductor dominance as a strategic diplomatic tool.
Taipei Times
Chip export controls show fangs
Taiwan imposed export controls on 47 semiconductor products to South Africa after Pretoria downgraded its office, pressing it to resume talks. The move shows Taiwan's tougher sovereignty stance and shift toward technology-driven diplomacy.
Taipei Times
Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Technical Papers
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
Peer viewpoint: AI data centers are driving a semiconductor revolution
MORE TECHNICAL PAPERS
Sponsor
Ironwood-Electronics

How to Select RF Test Socket
The classic function of a socket is to provide a replaceable connection mechanism from the IC (Integrated Circuit) to the circuit board with minimal signal loss.
Ironwood Electronics
OpenAI officials tour Samsung Electronics' chip plant
OpenAI executives toured Samsung's Pyeongtaek fab after signing a collaboration LOI to source low-power memory for its Stargate project. Samsung pledged support for soaring AI demand, with capacity to supply up to 900,000 DRAM wafers per month.
Yonhap News Agency
Smarter Packaging: How AI is Reshaping Assembly and Materials Control
Advanced packaging is turning to AI to reduce defects, predict equipment failures, and trace faults across multi-die assemblies. By blending sparse process data with equipment telemetry, AI enables predictive maintenance, excursion control, and faster, more accurate yield optimization.
Semiconductor Engineering
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
Why current AI models won't make scientific breakthroughs, according to a top tech exec
Hugging Face co-founder Thomas Wolf said current AI models like ChatGPT are unlikely to deliver major scientific breakthroughs, arguing they predict likely words rather than novel ideas. He envisions AI serving as a research "co-pilot" for human scientists instead.
CNBC
Taiwan rejects U.S. proposal for ’50-50′ chip production, says trade talks focused on tariffs
Taiwan rejected Washington's proposal to split semiconductor production 50-50, insisting talks focused on tariffs and export levies. Officials defended Taiwan's chip dominance, warning the plan could undermine TSMC, the island's "Silicon Shield," critical to its global and defense standing.
CNBC
Sponsor
Master-Bond

Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
Master Bond
Accounting for uncertainty to help engineers design complex systems
MIT researchers have developed a new framework that helps engineers design complex systems—like drones or autonomous vehicles—by modeling interconnected components under uncertainty, capturing tradeoffs and likely outcomes to create more robust, reliable designs.
MIT News
Samsung, SK Hynix shares leap after OpenAI chip deal
Shares of Samsung Electronics and SK Hynix surged after partnering with OpenAI to support its Stargate AI data center project. Samsung hit a four-year high, SK Hynix reached an all-time peak, boosting their combined market value by $37 billion.
Reuters
Sponsor
Pac-Tech

LAPLACE® LAR 600A Saves Energy
Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes.
PacTech
OpenAI Meets Foxconn, TSMC, Heads to Korea to Explore Samsung, SK hynix
OpenAI CEO Sam Altman visited Taiwan to discuss the U.S. "Stargate" AI project with Foxconn and TSMC, covering AI server supply and in-house chip production. Plans include five U.S. data centers and expanded semiconductor ties with South Korea.
TrendForce
Sponsor
XYZTEC

No more cartridge exchanges
The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more.
xyztec
Today's Sponsor
Circuit-Technology-Center
Sponsor
Circuit-Technology-Center

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
Test Your Knowledge
How many volts does a chest X-ray put out?
See answer below.
Surfx-Technologies
Quote of the Day
"Middle age begins with the first mortgage and ends when you drop dead."
Herb Caen
Sponsor
CyberOptics

Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
Industry Calendar
Oct 6, 2025
Fundamentals of EUV/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Basic Electronics and Troubleshooting/Phoenix,AZ/During SEMICON West
PT International LLC
Oct 6, 2025
Wet Processing for the Semiconductor Industry/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Fundamentals of Atomic Layer Deposition(ALD)/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Plasma Etching, ALE, & RIE
PT International LLC
FULL INDUSTRY CALENDAR
kyzen
Cartoon of the Day
Cartoon
"Salary, stock options and bonuses are nice, but I'd also like permission to put a tip jar on my desk."
Copyright © Randy Glasbergen
Sponsor
Akrometrix

Thermal Warpage Testing Services
If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs.
Akrometrix
Indium-Corporation
Test Your Knowledge Answer
How many volts does a chest X-ray put out?
Answer: 90,000 to 130,000 electron volts