January 30, 2026

Multi-Die Assemblies Require More Detailed Test Plan Earlier Engineering teams tackling multi-die assemblies are shifting left, verifying connectivity and DFT at the RTL stage to manage exploding complexity. Designs now require detailed interconnect, thermal, memory, and IP mapping, with early detection critical to prevent costly failures. Semiconductor Engineering

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

VIEWPOINT 2026: Jochen Schuermans, Founder & CEO, Roartis Known for specialisation in development of customized adhesive, micro-encapsulation, coating and sinter solutions for electronic assemblies, Roartis has again, in 2025, realized its best year ever. We feel that differentiation in technology, especially when offering customisation, fast, can really add significant value ... Roartis

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

Sponsor Particle-Free Plasma Oxide Reduction Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

Does Your RISC-V Core Meet The Standard? RISC-V verification is growing complex as architectural conformance and implementation checks diverge. The ecosystem is turning to compliance suites, formal methods and AI tools to ensure ISA correctness interoperability, performance and reliability. Semiconductor Engineering

Canada Accelerates Quantum Aspirations Canada is ramping up quantum computing with a new Quantum Champions Program, backing four firms with up to CAD$92 million. With DARPA ties, the Quantum Computing Sandbox adds tech support and cloud access to speed domestic innovation nationwide. EE Times

Sponsor Tough Engineering Changes? Where Can You Turn? Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably? Circuit Technology Center

Technical Papers Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG MORE TECHNICAL PAPERS

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

Apple sales surge 16% on 'staggering' iPhone demand Apple exceeded expectations in its fiscal Q1, posting 16% revenue growth and $42.1 billion net income, driven by strong iPhone 17 sales and a 38% surge in Greater China. Services rose 14%, iPad revenue beat forecasts, while Macs and wearables lagged. CNBC

From Meta to Samsung, global tech unleashes spending to chase AI Tech giants are ramping AI investments, driving a global surge in chip, server, and memory demand. Meta plans $135B spending, while SK Hynix and Samsung expand production, intensifying memory shortages that could disrupt electronics, PCs, and automotive industries. Taipei Times

Sponsor The Global Leader in Warpage Metrology Solutions We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain. Akrometrix

Scientech orders stretching to 2028 Scientech Corp has secured orders through 2028, driven by surging demand for AI and high-performance chip packaging equipment. The company is expanding production, doubling capacity, and opening a U.S. office to support customers, boosting revenue and market share. Taipei Times

Jensen Huang endorses Micron CEO "Sanjay" as Taiwan cement AI memory alliance Taipei became the focal point of the AI supercycle Thursday as President Lai Ching-te hosted Micron CEO Sanjay Mehrotra at the Presidential Office, mere hours after NVIDIA CEO Jensen Huang arrived, signaling intensified tech engagement on the island. Digitimes

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Opening The Door To STCO: Hierarchical Device Planning Hierarchical device planning lets IC teams partition complex multi-chiplet packages early, run multi-physics analysis, and co-optimize chiplets, interposers, and substrates system-wide to cut costs, boost performance, and manage soaring pin counts. Semiconductor Engineering

Building Trust At The Silicon Level: Secure Storage Solution For OTP IP As chip designs grow more complex, software-only security falls short against physical attacks. Synopsys' Secure Storage Solution for OTP IP blends antifuse OTP, SRAM PUF and crypto to deliver hardware-rooted, device-unique key protection globally. Semiconductor Engineering

Sponsor Improve WLCSP Reliability with Advanced 3D X-ray Microscopy Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL and Cu-pillar microbumps. Read more. ZEISS Microscopy

Why Nvidia's AI boom couldn't happen without Dutch chip equipment maker ASML Nvidia's AI dominance relies on ASML, the Dutch company that produces the world's only extreme ultraviolet (EUV) lithography machines. With record bookings and a near-monopoly in advanced chipmaking, ASML underpins global semiconductor innovation and AI growth. CNBC

Sponsor Hermetic Package Seam Seal with HDHS® Technology Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS. MicroCircuit Laboratories, LLC