October 17, 2025

Advanced Packaging: A Key Technology For The Next Generation Of Electronics Advanced packaging is reshaping semiconductor design by integrating chips, memory, sensors, antennas, and photonics into compact, high-performance systems. Using TSVs, 2.5D interposers, and AiP, it enables faster, energy-efficient, and reliable devices for 5G, IoT, and autonomy. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

A Guide to Building Chiplets Today While Shaping Tomorrow's Standards Semiconductor leaders are advancing chiplet integration to push SoC performance beyond reticle limits. UCIe, AIB, and BoW standards aim to enable universal, multi-die connectivity, with broad adoption expected between 2026 and 2030, shaping future chip design. EE Times

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

Sponsor Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. KYZEN

Chinese Research Team Breaks Precision Record with New Analog In-Memory Computing Chip Nanjing University researchers created a high-precision analog computing chip using geometry-based weight encoding, achieving a record 0.101% RMSE in vector–matrix multiplication. Built on CMOS, it maintained exceptional accuracy under extreme conditions. TrendForce

Worldwide Smartphone Market Grows 2.6% in Q3 2025 as Upgrades Accelerate, Driven by New Innovative Products, according to IDC Global smartphone shipments rose 2.6% YoY to 322.7M units in 3Q25, marking continued recovery led by premium and AI-enabled devices. Apple and Samsung drove record July-quarter growth, while Xiaomi, Transsion & vivo gained share across emerging and midrange markets. IDC

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

Technical Papers Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) Peer viewpoint: AI data centers are driving a semiconductor revolution MORE TECHNICAL PAPERS

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Gartner Says Worldwide PC Shipments Grew 8.2% in Third Quarter of 2025 Worldwide PC shipments reached 69M in Q3 2025, up 8.2% YoY, driven by Windows 10 EOS upgrades. North America grew just 1.6%, while AI PCs surged to 31% of shipments. Lenovo led top-five vendors with 16.6% growth, as the market shifts toward AI-enabled devices. Gartner

AI Chips Shifting from Round to Rectangular The AI chip boom is accelerating a shift from round wafers to rectangular panels, pushing toolmakers like Lam and Nikon to scale production. OSATs such as Amkor and ASE are expanding advanced packaging, challenging TSMC as panel-level packaging surges to $650M by 2030. EE Times

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Tech giant ASML posts stable profit, warns on China Dutch chip equipment maker ASML reported flat third-quarter net profit of €2.13 billion and €7.5 billion in sales, warning that China demand will drop sharply in 2026. The firm expects AI growth to lift annual sales to €44–60 billion by 2030. Taipei Times

TSMC raises full-year growth outlook TSMC raised its full-year revenue growth forecast to 35%, citing stronger-than-expected AI chip demand, despite market concerns over an AI bubble. The company posted record quarterly profit, boosted US investment, and plans accelerated deployment of 2-nanometer technology. Taipei Times

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

You Can Cool Chips With Lasers?!?! Maxwell Labs is developing photonic cooling to tackle chip "hot spots" by converting heat into light using anti-Stokes fluorescence. Targeted lasers cool precise regions, potentially boosting chip performance while recycling energy, surpassing traditional air or liquid cooling limits. IEEE Spectrum

Chance of AI market correction is 'pretty high,' says ex-Meta exec Nick Clegg as he pushes back on superintelligence Former Meta executive Nick Clegg warned of a "pretty high" chance of a market correction in AI, citing inflated valuations and frenzied dealmaking. He stressed AI's long-term impact remains real, though adoption will likely proceed slower than hype suggests. CNBC

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Current Problems Grow For Power Delivery Rising IR drop challenges modern chip design as thinner wires, higher current spikes, and tighter timing margins strain power delivery networks. Engineers must analyze PDNs early and optimize floorplans to balance voltage, thermal, and reliability trade-offs. Semiconductor Engineering

Sponsor The experts agree Performance and reliability top the priority list for semiconductor experts. Get our latest Research Report to explore how they’re addressing AI demands, integration challenges, and next-gen materials. Henkel AG & Co.