semiconductor
packaging news
Sponsor
Indium-Corporation

Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
Industry Press
Artificial Intelligence (AI) as a semiconductor growth engine
Yole Group
Teledyne e2v Achieves Initial Qualification of 16GB Space DDR4 Memory
Teledyne
HydroGraph Awarded New U.S. Patent for Graphene-Based Actuator Technology
HydroGraph
STMicroelectronics' half-bridge gate drivers ease design with GaN in low-voltage systems
STMicroelectronics
Indium Corporation to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTAI
Indium Corporation
SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes
SEMI
Renesas Expands Industrial Sensing Portfolio
Renesas Electronics Corporation
BEHRINGER Saws to Showcase the HBE-321A Dynamic Automatic Bandsaw at MT Series SOUTHEAST
BEHRINGER Saws, Inc.
MORE INDUSTRY PRESS
Sponsor
Pac-Tech

Turnkey Electroless Plating Solutions
PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success.
PacTech
ZEISS
What Year Was It?
The Long March
What Year
The embattled Chinese Communists break through Nationalist enemy lines and begin an epic flight from their encircled headquarters in southwest China.
See the answer below.
Brewer-Science
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Ormet-TLPS
Sponsor
Henkel-AG-Co

Peer viewpoint: semiconductor innovation for telecommunication networks
Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure.
Henkel AG & Co.
What Year Was It Answer
The Long March
Answer: October 16, 1934
October 16, 2025
image
TSMC Profit Surges 39% to Beat Estimates on AI Chip Demand
TSMC posted a Q3 net income of NT$452.3B, up 39.1% YoY, beating estimates as AI chip demand surged. Revenue hit NT$989.9B, led by advanced 7nm-and-smaller chips. CEO Wei raised 2025 growth forecasts to mid-30% and boosted capacity expansion to $40B amid strong AI traction.
CNBC
Sponsor
XYZTEC

Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
Silicon Photonics Breakthrough: High-Power Frequency Comb Achieved on Chip
Columbia University's Michal Lipson team created a high-power frequency comb light source directly on a silicon photonic chip, generating dozens of stable wavelengths from a single laser. The breakthrough could replace multiple lasers in AI and data-center optical modules.
TrendForce
Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Technical Paper
Sponsor
Balazs-Nanoanalysis

Analytical Solutions
Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
ASML looks to calm fears over 2026 growth as it warns of China sales decline
ASML reassured investors about 2026 growth, saying next year's sales won't fall below 2025 despite warning of a sharp China decline. The chipmaker expects 2024 revenue to rise 15% with a 52% margin, driven by AI-fueled demand and €5.4B in Q3 orders, lifting shares 3%.
CNBC
Intel's Panther Lake Emerges — Can 18A Drive an Advanced-Process Comeback?
Intel's Panther Lake, its first CPU built on the 18A node, could define Intel's comeback in advanced process tech. Featuring 18A CPU, TSMC-made GPU and I/O tiles, it targets Arrow Lake performance, Lunar Lake efficiency, and RTX 4050-level integrated graphics.
TrendForce
Sponsor
Amkor-Technology

Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
A study on HDFO packages uncovers copper RDL reliability, highlighting failure modes, resistance shifts, and critical current capacity. Read more.
Amkor Technology, Inc.
Technical Papers
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
Peer viewpoint: AI data centers are driving a semiconductor revolution
MORE TECHNICAL PAPERS
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Arm CEO says moving some AI workloads from the cloud will make it more sustainable
Arm CEO Rene Haas told CNBC that shifting AI inference from cloud to local devices can cut energy use, while AI training remains cloud-based. Partnering with Meta, Arm aims to enhance AI efficiency across hardware and software, boosting hybrid computing.
CNBC
GlobalWafers opens advanced 12-inch wafer plant in northern Italy
Taiwan-based GlobalWafers launched its advanced 12-inch "Fab300" silicon wafer plant in Novara, Italy, powered entirely by renewable energy. The facility, supported by €103 million in EU and Italian grants, strengthens Europe-focused production and R&D across key high-tech applications.
Taipei Times
Sponsor
Coresix-Precision-Glass

High-Quality, High-Volume Glass Wafers
Many do one or the other — we do both. Quality, cleanliness, parallelism, flatness, roughness, serialization, traceability, consistency. Every wafer in spec, every time.
Coresix Precision Glass
Texas Instruments On Its Path to 95% In-House Manufacturing by 2030
Texas Instruments aims to boost internal chip production to over 95% by 2030, investing $60B+ across U.S. fabs and global sites. With AI, gallium nitride & edge solutions, TI strengthens supply resilience, supports India's growing market & drives locally relevant, cost-effective innovation.
EE Times
This New Chip Is Just a Few Atoms Thick and Could Change Everything About Computers
Engineers at Fudan University created the world's first fully functional memory chip built from atom-thin 2D materials and integrated with silicon circuits. Their ATOM2CHIP process enables faster, low-power flash memory with a 94.3% yield, surpassing silicon's scaling limits.
ZME Science
Sponsor
Surfx-Technologies

Mycronic has acquired Surfx Technologies
Surfx provides atmospheric plasma solutions for metal oxide removal and cleaning of semiconductor surfaces. Technology critical for the most advanced packaging and semiconductor processes.
Surfx
Nexperia seizure: chip supply threatened amid fight over unit of China's Wingtech
Nexperia, the European chip arm of China's Wingtech, faces mounting pressure from US-China tech tensions as Dutch and Chinese export restrictions threaten its global supply role. Potential bans and seizures jeopardize automotive and industrial chip deliveries.
South China Morning Post
Commonality in Correlation Analysis
Low wafer yields often stem from design or process changes, but sometimes issues appear without changes. Aftkhar Aslam, CEO of yieldWerx, explains how AI/ML can analyze multi-step data to identify root causes, especially in complex chiplet assemblies.
Semiconductor Engineering
Sponsor
Akrometrix

Thermal Warpage Testing Services
If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs.
Akrometrix
Intel takes another crack at the AI chip market with its new Crescent Island GPUs
Intel unveiled its new AI-focused GPU, Crescent Island, targeting inference workloads with energy-efficient Xe3P architecture and 160 GB LPDDR5X memory. The move marks a renewed push to compete with Nvidia and AMD in the booming AI accelerator market.
Silicon Angle
Sponsor
Circuit-Technology-Center

BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center
Today's Sponsor
Nordson-ASYMTEK
Sponsor
Nordson-ASYMTEK

A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
Test Your Knowledge
Where was the first parking meter installed?
See answer below.
CyberOptics
Quote of the Day
We live in a society exquisitely dependent on science and technology, in which hardly anyone knows anything about science and technology.
Carl Sagan
Sponsor
XYZTEC

Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
Industry Calendar
Oct 16, 2025
Overview of semiconductor manufacturing seminar/Austin, TX
PT International LLC
Nov 2, 2025
International Trade Partners Conference (ITPC)
SEMI
Nov 3, 2025
Wafer Fab Processing | Phoenix, AZ
Semitracks
Nov 18, 2025
SEMICON Europa 2025
SEMI
Nov 19, 2025
MEMS & Imaging Sensors Summit
SEMI
FULL INDUSTRY CALENDAR
Tresky
Cartoon of the Day
Cartoon
"This matter requires immediate attention. I'll get someone to ignore it right away."
Copyright © Randy Glasbergen
Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
Advanced-Component-Labs
Test Your Knowledge Answer
Where was the first parking meter installed?
Answer: Oklahoma City, Oklahoma in 1935