May 22, 2026

With Chiplets, What Role Does Economics Play? Industry leaders question whether chiplets cut costs, as advanced packaging and fabrication complexity erode yield benefits. Datacenters push adoption beyond reticle limits, but consumer and automotive markets remain wary amid uncertain standards. Semiconductor Engineering

Sponsor Burn-In & Test Sockets Industry's smallest footprint up to 500, 000 insertions, bandwidth up to 50+ GHz, 2.5, <25 mΩ contact resistance, -55C to +180C, 4A to 8A @80C rise. Ironwood Electronics

Scaling the Next Generation of Multi-Die Systems The semiconductor industry is pushing chiplet architectures into production, confronting interconnect, packaging, power, and thermal limits. A new conference highlights multi-die systems, EDA bottlenecks, AI-driven design, advanced packaging, and photonics solutions. EE Times

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

Sponsor Medical Grade, Toughened Epoxy Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation. Master Bond

Nvidia quarterly revenue beats Wall Street forecasts Nvidia reported record quarterly revenue of $81.6 billion, up 85% year-on-year, driven by surging AI hardware demand. Net profit tripled to $58.3 billion, while data center sales hit $75.2 billion. It forecast $91 billion next quarter. Taipei Times

Anthropic, Microsoft in talks for AI chip deal after $5 billion investment Microsoft is negotiating to supply its custom AI chips to Anthropic, marking a potential win as it trails Amazon and Google in AI silicon. The Maia chips aim to boost Azure competitiveness amid Anthropic's surging compute demand. CNBC

Sponsor High Capacity & Power Plasma Systems The BT-1 high capacity plasma systems features 5 shelves & high power plasma up to 5000 watts! Reactive Ion Etching chamber configurations with liquid cooling are also available. Plasma Etch

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Samsung chip employees to receive average US$338,000 bonus under strike deal Samsung Electronics chip employees will receive average bonuses of 509 million won after management and unions reached a government-mediated deal, averting an 18-day strike. The agreement links pay to semiconductor profits amid the AI-driven chip boom. Taipei Times

Nanya inks long-term DRAM supply contracts Nanya Technology says AI-driven demand is pushing customers to sign multi-year DRAM contracts, signaling a shortage lasting into next year. The firm is expanding capacity with a new plant, while rising prices boost revenue and support strong sales momentum. Taipei Times

Sponsor The Global Leader in Warpage Metrology Solutions We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain. Akrometrix

AMD Plans $10B Investment in Taiwan to Boost AI Infrastructure AMD will invest over $10 billion in Taiwan to expand AI chip and server production while ramping 2-nm EPYC 'Venice' CPUs at TSMC. The move accelerates next-generation AI infrastructure amid surging demand and ongoing semiconductor supply constraints. EE Times

Beyond Ideal Crystals: The Case For Scale In Atomistic Modeling Engineers are advancing atomistic simulations by balancing accuracy and cost with DFT and LCAO methods accelerated by GPUs. New machine learning models and interatomic potentials now scale efficiently, enabling larger, more realistic multiscale materials simulations. Semiconductor Engineering

Sponsor Rapid Package Seam Seal Changeover The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less. MicroCircuit Laboratories, LLC

Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics Low-temperature tin-bismuth solders are gaining traction in chiplet packaging by lowering reflow temperatures, reducing warpage and cutting CO2 emissions for components. But brittleness and electromigration concerns still limit use in AI chips. Semiconductor Engineering

AI & Energy: Bending The Curve AI is reshaping semiconductor roadmaps and data center design as compute demand and energy use surge. Power and cooling limits now cap scaling, forcing cross-layer optimization across chips, software, packaging, and infrastructure strategies. Semiconductor Engineering

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Enabling Production-Ready AI For Semiconductor Manufacturing Semiconductor inspection faces scaling limits as rule-based tools miss defects and trigger false rejects. AI adoption slowed by fragmented workflows, but unified platforms now streamline annotation, training and deployment for fab model rollout. Semiconductor Engineering

Sponsor Chiplets and Advanced Packaging Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now. xyztec