Oct 19, 2026 Scaling Advanced Packaging: Why It Matters AI demand is boosting advanced packaging and thermal compression bonding equipment sales, but supply constraints, worker shortages and production complexity limit expansion. Manufacturers must standardize processes, train workers and improve readiness to scale. 3D InCites

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Chip Industry Week In Review Semiconductor companies advanced fabrication, packaging, testing and AI-driven design, with GlobalFoundries planning $21 billion in U.S. investment and Applied Materials opening a $5 billion R&D center. Meanwhile, China pursued memory & EUV capabilities as Nvidia's shipments declined. Semiconductor Engineering

A New Optical Ball Grid Array Package Development for Automotive Optical Sensor This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements. Technical Paper

Sponsor 1 of 10 Applications: Copper Pillar For flip chips with very small geometries, copper pillar technology is favored. Swiss made die bonders from Tresky handle these demanding applications with bravura. Dr. Tresky AG

After TSMC's 3Q26 Earnings: Key Brokerage Takeaways as 2028 Capex Forecasts Reach US$105B TSMC's bullish outlook drives brokerages to raise 2027–2028 capex forecasts, with UBS projecting $105 billion in 2028. Analysts expect 2nm growth, stronger pricing and CoWoS expansion, but warn that advanced-node production could pressure margins. TrendForce

SEMICON West 2026 Displays AI-Era Chipmaking, Workforce Development SEMICON West 2026 marked the semiconductor industry's trillion-dollar milestone, showcasing AI innovation, advanced packaging, wafer inspection and precision manufacturing. Industry leaders also stressed workforce development to support expanding fabs and sustain growth. EE Times

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

Technical Papers ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing MORE TECHNICAL PAPERS

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

SK Hynix needs a Trump 2027 deal to expand its Dalian NAND fab SK Hynix and Samsung must secure annual US licenses to ship advanced equipment to their Chinese factories, with approvals tied to American investment commitments. SK Hynix seeks Dalian equipment authorization while planning a new US NAND factory. Asia Times

Data Center Power a Prominent Highlight of OCP 2026 At OCP Global Summit 2026, Navitas, Infineon, and Texas Instruments showcased high-efficiency 800-V power delivery, hot-swap controllers, and real-time monitoring solutions. These technologies aim to stabilize AI data centers, improve power density & minimize costly downtime. EE Times

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

TSMC's global buildout faces crucial capital efficiency test TSMC expects overseas manufacturing to cut gross margins by nearly two percentage points in 2026, widening to three or four points later. Despite rising chip demand and strong profits, its global expansion increases investment and operating costs. Asia Times

ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique ASML is expanding into hybrid bonding, filing 27 related patent families as demand for advanced packaging grows. Chinese firms Huawei and CXMT are adopting the technology to boost chip density and performance despite restrictions on advanced lithography equipment. South China Morning Post

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

Scientists build a complete transistor from a single 2D crystal IBS researchers transformed a single-layer crystal into semiconductor, insulating and contact materials, enabling highly efficient transistors with near-theoretical switching performance, better electrical contacts and potential applications in ultralow-power, vertically integrated electronics. Nanowerk

AI Moves to System-Level Co-Design: How Can Taiwan Capture More Value Taiwanese industry leaders urge the country to move beyond chip manufacturing by integrating chip, AI, software and system design. They call for cross-disciplinary talent, startup support, and stronger robotics and physical AI ecosystems to capture greater value. EE Times

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

'I told you so': China's chip sector is making breakthroughs—and U.S. export controls are the reasons why Professor Kumar argues that U.S. chip export controls have backfired, accelerating China's semiconductor industry. Chinese companies are advancing in processors, memory chips and AI models, challenging American leadership despite Washington's increasingly restrictive policies. Fortune

Sponsor High-Speed, Reliable Plating with PACLINE® PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution. PacTech

TSMC eyes adding facilities in Texas TSMC is evaluating Texas wafer capacity with a customer to expand US manufacturing amid surging AI chip demand. The company plans to double 2-nanometer capacity next year, forecast 44% annual revenue growth, and reported record quarterly profit. Taipei Times