February 27, 2026

AI Starting To Simplify Design Of Programmable Logic AI is transforming FPGA and DSP design, automating RTL generation, workload mapping and optimization. Companies like Altera and AMD are advancing smarter tools, but programming logic still demands strong hardware expertise despite advances in AI-driven compilers. Semiconductor Engineering

Sponsor Epoxy & Adhesive DIE Bonding One of the most common methods of creating a connection between chip and substrate is the gluing process. Extreme precise epoxy & adhesive bonding processes for sustainable bonds. Tresky Automation

VIEWPOINT 2026: Paolo Fioravanti, CEO, Circuits Integrated Hellas As we approach 2026, the radio-frequency (RF) segment of the semiconductor industry is entering a period of sustained growth1, fueled by advanced 5G, non-terrestrial networks, satellite communications, and defense modernization. Market forecasts project the global RF semiconductor market to nearly double ... Circuits Integrated Hellas

Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity. Technical Paper

Sponsor Plasma Processing Wafers and Dies The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames. Surfx Technologies

AI Energy Gap And Chiplets: Why Data Movement Matters At Chiplet Summit 2026, experts said UCIe solves chiplet wiring but not the semantic coordination AI demands. Arteris and others urged architects to refine interconnects, streamline data flows and enable dynamic capability negotiation to lift efficiency and interoperability. Semiconductor Engineering

Rare earth shortages worsen in US aerospace, chips despite trade truce, sources say Suppliers to US aerospace and chipmakers face deepening shortages of Chinese rare earths, especially yttrium and scandium, forcing some firms to halt production and ration customers ahead of a planned Beijing summit between Donald Trump and Xi Jinping. Taipei Times

Sponsor Copper vs silver: a turning point for WBG die attach Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost. Henkel AG & Co.

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Hermetic Package Seam Seal with HDHS® Technology Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS. MicroCircuit Laboratories, LLC

How Stupid Would It Be to Put Data Centers in Space? Top tech leaders including Elon Musk, Jeff Bezos, Jensen Huang, Sam Altman and Sundar Pichai are backing orbital AI data centers. Analyst Andrew McCalip estimates a 1-gigawatt satellite network would cost $51 billion—about triple comparable Earth-based facilities. IEEE Spectrum

James Redstone Joins SIA as Director of Government Affairs The Semiconductor Industry Association appointed James Redstone as director of government affairs, charging him with advancing chip industry priorities on Capitol Hill and at the White House, as President John Neuffer praised his policy and manufacturing leadership. Semiconductor Industry Association

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

Nvidia still hasn't sold its U.S.-approved China AI chips — and it's worried local AI rivals could take over Nvidia has yet to revive China sales despite eased U.S. export curbs, generating no H200 revenue and facing uncertainty over imports. The chipmaker warns that newly public Chinese AI rivals are rapidly advancing and could challenge America's dominance in the global AI industry. CNBC

How IP Subsystems For Chiplets Will Unlock Your Next Wave Of Innovation Chipmakers are racing toward multi-die and chiplet architectures as AI workloads outstrip monolithic scaling. By splitting compute, memory and I/O across tightly integrated dies, they pursue trillion-transistor systems, boosting performance, efficiency and design flexibility. Semiconductor Engineering

Sponsor Thermally Conductive, Low Outgassing Epoxy Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively. Master Bond

Using Data And AI More Effectively In EDA Semiconductor and EDA firms are overhauling how AI taps design data, pushing for structured, machine-actionable information instead of more raw output. By boosting instrumentation, labeling and data sharing, they aim to power agentic AI and accelerate chip design workflows. Semiconductor Engineering

Verifying Scale-Up And Scale-Out In Data Centers Experts from Siemens EDA, Marvell and Astera Labs discussed data center expansion challenges, highlighting verification IP, network switching, ASIC design and product engineering strategies to accelerate build-outs and improve performance, efficiency and scalability. Semiconductor Engineering

Sponsor Chiplets and Advanced Packaging Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now. xyztec

Samsung Electronics reclaims No. 1 spot in global DRAM market in Q4 Samsung Electronics Co. reclaimed the top spot in the global DRAM market in the fourth quarter, as strong HBM sales lifted revenue 43 percent to $19.3 billion and a 36 percent share, overtaking SK hynix Inc. and Micron Technology Inc.. Yonhap News Agency

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems