August 3, 2026

CEA-Leti Pushes Stacking Roadmap as AI Runs Into Memory and Power Limits CEA-Leti's Pascal Vivet says 3D integration and chiplets will power next-generation AI by bringing memory closer to processors, cutting energy use and boosting performance. He urges designers to solve thermal, power and manufacturing hurdles for AI's growing memory demands. EE Times

Sponsor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Nordson Test & Inspection

TSMC Reportedly Develops EMIB-like Packaging with Kinsus to Prevent Potential Customer Shift to Intel TSMC is reportedly developing an EMIB-like advanced packaging technology with Kinsus to ease CoWoS capacity constraints and defend market share as Intel gains EMIB traction. The move aims to retain key AI customers amid intensifying packaging competition. TrendForce

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Technical Paper

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Chip Industry Week In Review The Design Automation Conference energized Long Beach with breakthroughs in AI automation, multiphysics simulation, compute-in-memory, chiplets, physical AI and AI agents. Industry leaders highlighted smarter orchestration to accelerate chip design and manufacturing. Semiconductor Engineering

Kumamoto Fab Restart Update: TEL, Sony Resume Operations; TSMC's JASM Fab 1 Under Inspection after M7.1 Quake Japan's magnitude 7.1 Kumamoto earthquake disrupted semiconductor production, but recovery is gaining pace. Tokyo Electron, Sony and Renesas have announced restart plans, while TSMC continues inspecting JASM Fab 1 and restoring operations as quickly as possible. TrendForce

Sponsor Enabling A Chiplet Supply Chain Chiplet-based architectures are gaining popularity for their smaller die sizes and better yields, but challenges in power management, security, and supply chain complexity remain. Download now. Amkor Technology, Inc.

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

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Jensen Huang Says the Chip Industry's Usual Boom-Bust Cycle Won't Hit for a While, a Bullish Signal for AI Stocks Nvidia CEO Jensen Huang says AI is driving a new industrial chip cycle, with semiconductor demand potentially expanding five to ten times. Despite spending concerns, strong earnings from Nvidia and Intel suggest the AI infrastructure boom remains in early stages. Yahoo! Finance

China taps US AI models to train defense systems Chinese military researchers are using outputs from U.S. AI models, including OpenAI and Anthropic systems, to distill and train domestic AI for defense applications. The effort heightens concerns over IP theft, security risks and intensifying U.S.-China tech rivalry. Taipei Times

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Hon Hai subsidiary begins commercial operations of 5MW AI cluster Hon Hai's Visionbay.ai launched Taiwan's largest 5-megawatt AI cluster using Nvidia HGX B300 systems, with over 90% capacity utilized. The platform earned Nvidia Exemplar Cloud validation and aims to expand AI infrastructure across Asia-Pacific with Blackwell & Vera Rubin technologies. Taipei Times

MediaTek eyes bigger share of AI market MediaTek targets up to 20% of the customized AI accelerator market next year, expanding its data center push. The company plans major investments, advanced packaging partnerships, and new AI chips while expecting strong revenue growth from cloud & premium smartphone demand. Taipei Times

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Dwindling cash and soaring memory costs: Tech's AI buildout has ballooning price tag Big Tech companies are pouring hundreds of billions into AI infrastructure, straining cash flows and balance sheets. Rising data center costs and memory chip shortages are increasing pressure, forcing firms like Amazon, Meta, Alphabet, and Apple to rethink spending strategies. CNBC

SK Hynix, Samsung shares skyrocket to clock best days as AI rally roars back Asian chip stocks surged after strong Amazon and Microsoft earnings revived AI optimism. SK Hynix and Samsung posted record gains as TSMC, Japanese chipmakers and SoftBank rallied, reversing a semiconductor sell-off fueled by AI valuation worries. CNBC

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ASE raises capital spending by 23.5% ASE Technology raised its 2026 capital spending to US$10.5 billion, targeting AI-driven advanced packaging expansion. The chip packaging leader is accelerating LEAP capacity, reporting strong profits and expecting continued revenue growth as AI infrastructure demand intensifies. Taipei Times

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