February 18, 2026

ASML's High-NA EUV Which Giants Betting Big; Intel, Samsung, SK hynix or TSMC? As Intel, Samsung, and SK hynix race toward 1.4nm, they line up to adopt ASML's High-NA EUV for 2027–28 production. Meanwhile, TSMC skips the costly tool, underscoring a high-stakes split in next-gen chip strategy. TrendForce

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VIEWPOINT 2026: Irving Wang, Director of Marketing, MRSI Mycronic 2025 has been a great year for MRSI, Mycronic both in terms of revenue growth and new market development. We have benefited significantly from the booming demand for optical interconnect in AI clusters. Looking ahead, we see the growth driven by the AI cluster expansion continuing in 2026 and at least for a few ... MRSI Mycronic

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

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Nvidia China Gamble Meets Washington's Regime In January 2026, the Trump administration reopened China's market to U.S. chipmakers, shifting export rules to case-by-case reviews. Nvidia and AMD now face strict compliance measures and a 25% revenue-sharing tariff on key AI chips, reshaping supply chains. EE Times

Japan's Chip Push in Spotlight: IBM Backs Rapidus as Funding Momentum Builds As TSMC advances in Japan, Rapidus gains momentum with IBM's backing and a new Chitose office to drive 2nm production by 2027. Armed with cutting-edge thermal AI tools and surging private funding, Rapidus pushes to secure Japan's next-gen chip leadership. TrendForce

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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India to Add 20,000 GPUs as AI Mission 2.0 Expands Compute and Chip Push At the India AI Impact Summit in New Delhi, Ashwini Vaishnaw announced India will add 20,000 GPUs to its 38,000-strong capacity under AI Mission 2.0, boosting R&D and startups while advancing tech trade cooperation with the United States. EE Times

Meta expands Nvidia deal to use millions of AI chips in data center build-out, including standalone CPUs Meta Platforms will deploy millions of chips from Nvidia, including Grace CPUs and next-gen Vera Rubin systems, to scale AI data centers. CEO Mark Zuckerberg said the move accelerates Meta's push to deliver personal superintelligence worldwide, lifting shares of both companies. CNBC

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AMD partners with TCS on AI tech Advanced Micro Devices Inc has partnered with Tata Consultancy Services Ltd to deploy AI data center technology in India, challenging Nvidia Corp. Anthropic PBC and Infosys Ltd are developing industry-specific AI solutions, intensifying competition in India's expanding AI market. Taipei Times

We're Measuring Data Center Sustainability Wrong Current metrics optimize only 30% of IT emissions Google and Microsoft tout major energy efficiency and nuclear investments for AI, yet current sustainability metrics capture only 30% of IT emissions. Incomplete frameworks like Europe's Corporate Sustainability Reporting Directive risk locking in flawed measurements for years. IEEE Spectrum

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Former Altera CEO Joins French AI Chip Startup Former Sandra Rivera has joined French AI inference chip startup Vsora as board chair, aiming to raise its profile ahead of this year's launch of the Jotunn8 data center AI accelerator led by Khaled Maalej's experienced tape-out team. EE Times

India's Adani to invest $100 billion in AI data centers over the next decade Adani Group announced a $100 billion investment to build renewable energy-powered, AI-ready data centers by 2035, aiming to create the largest integrated platform. The move could generate a $250 billion AI ecosystem and accelerate India's role in the global artificial intelligence race. CNBC

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Research Bits: Feb. 17 Chinese memory leaders GigaDevice Semiconductor and Montage Technology surge on the global memory supercycle, lifting shares after Hong Kong listings. Founded by US-trained engineers, the Shanghai firms spotlight China's drive for chip self-sufficiency and homegrown innovation. Semiconductor Engineering

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