Sep 10, 2026 Quantum Scaling Is Becoming a Control-Electronics Problem Researchers are shifting quantum-control electronics into cryogenic environments to overcome wiring and cooling limits. S-Transistors’ superconducting technology cuts power, multiplexes signals and supports scalable, heterogeneous infrastructure for larger quantum systems. EE Times

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The Race to 2028: Samsung, SK hynix Set High-NA EUV Timelines for DRAM as Micron Stays Tight-Lipped Samsung and SK hynix target High-NA EUV for DRAM by 2028, seeking fewer patterning steps, lower costs and stronger HBM performance. Micron also signals plans to expand next-generation EUV as memory makers race to preserve their technology edge. TrendForce

How AI Could Cut Semiconductor Package Design Cycles from Months to Days This paper explores how AI-powered semiconductor package design tools can accelerate development, reduce errors, optimize performance and sustainability, and enhance engineer productivity, transforming package design cycles from months to days. Technical Paper

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OpenAI Says It Is Working with Samsung on Next-Gen Chips; Ties Could Expand Beyond Memory OpenAI and Samsung are deepening cooperation on custom AI chips, with Samsung supplying HBM4 for OpenAI's first accelerator. The partnership could expand into foundry and advanced packaging as OpenAI advances its multigeneration chip roadmap. TrendForce

Kioxia Holdings says SK Hynix tie-up not happening Kioxia CEO Hiroo Ota rejected closer manufacturing ties with SK Hynix, citing antitrust concerns and joint facilities with Sandisk. He urged stable memory prices to protect AI demand, while Kioxia expands capacity and targets long-term contracts amid strong NAND demand. Taipei Times

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Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

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Global notebook shipments tipped to drop 8%, MIC says Global notebook shipments are projected to fall 8% to 167.9 million units this year and another 4.7% next year, as weak demand and component shortages persist. AI PC adoption should rise, reaching 76.1% penetration by 2028. Taipei Times

TSMC's market share edges higher TSMC increased its foundry market share to 72.5% in Q2, driven by strong AI and smartphone chip demand. Samsung fell to 5.9%, while SMIC rose to 5.4% as overall foundry revenues continued expanding. Taipei Times

Sponsor ECTC Call for Papers Due October 5 ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials. ECTC

Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion Amkor Technology will expand its Arizona advanced packaging campus with 60,000 square meters of cleanroom capacity, raising total investment to $12 billion. The phase 2 project will strengthen U.S. semiconductor manufacturing and support over 3,500 jobs. 3D Incites

Bridging the HPC Software Gap for Practical Quantum Computing Quantum hardware is advancing, but software infrastructure still limits HPC integration. Alice & Bob and Hyperion Research call for co-design, standardized interfaces and tighter classical-quantum integration as fault tolerance and commercial returns remain years away. EE Times

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Google to invest record $15 billion in AI infrastructure in the 'Texas of Europe' Google will invest at least €13 billion in Finland through 2028, its largest European investment, expanding AI data centers while supporting energy projects. The company also signed a 22-year power agreement with Fortum to strengthen infrastructure. CNBC

Imec Advances Superconducting Semiconductor Technology for Next-Generation Computing Imec advances superconducting computing with three-metal-level NbTiN circuits reaching 3.8 million Josephson junctions/cm² and 30nm wiring. The CMOS-compatible platform targets scalable AI, HPC, quantum, photonic and neuromorphic system designs. BISinfotech

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Can GPUs Continue To Dominate AI Compute? Nvidia maintains AI compute dominance as GPUs hold 70% of installed capacity, while custom silicon reaches 30%. Its Vera Rubin platform, Groq LPU integration and full-stack architecture aim to boost efficiency, latency and market share. Semiconductor Engineering

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Token Costs Are Becoming The New EDA Budget Battle Semiconductor Engineering brought EDA leaders together to assess agentic AI in chip design. The roundtable explored recent advances, adoption challenges, and industry views on how AI agents could reshape design automation. Semiconductor Engineering