Oct 14, 2026 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates SEMI projects global 300mm fab equipment spending will rise 31% to $149 billion in 2026 and reach $227 billion by 2029. Construction and production expansions will accelerate worldwide, supporting growing AI, high-performance computing and semiconductor demand. SEMI

Sponsor Photonics Bonder for Sub-Micron Accuracy Tresky's Photonics Bonder delivers sub-micron die placement on a granite-based T-7000 platform for VCSELs, lasers and photodiodes. Tresky

Europe's Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle Europe's semiconductor industry faces a gap in advanced packaging for low-volume products. Fraunhofer IZM supports prototypes and small-scale production, while Swissbit urges shared platforms and earlier collaboration to speed technology transfer and commercialization. EE Times

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor Automatic Grading Without Assistance Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images. xyztec

Lisa Su Calls 2026 "Year of Inference" as AMD Lifts 2030 CPU TAM Forecast to $200B+ AMD CEO Lisa Su raised the CPU market forecast to over $200 billion by 2030, citing agentic AI demand and 50% annual growth. AMD also began Helios shipments in September and plans to launch its Helion AI rack in November. TrendForce

Preparing chip designers for the nanostack era IBM plans to release an early 0.7nm nanostack chip design kit in Q1 2027, enabling industry partners to explore 3D transistor architecture, optimize chip performance and energy efficiency, and prepare design tools for next-generation semiconductor manufacturing. IBM

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Technical Papers ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor MORE TECHNICAL PAPERS

Sponsor The Gallery of Progress From desktop to laptop to data center, every leap in performance begins with a packaging decision most people will never see. Explore the rooms of the exhibition and see our range of innovative applications. Henkel AG & Co.

CASPA CEO Summit Preview with President Jimmy Cheng CASPA will host its 35th annual CEO Summit on October 23–24, 2026, bringing together over 35 Silicon Valley CEOs and 2,000 attendees. Keynote speakers include Intel's Lip-Bu Tan and Cerebras' Andrew Feldman, alongside industry panels. EE Times

Huawei, once hobbled by US sanctions, passes 100 million Kirin chip milestone Huawei has shipped over 100 million Kirin-powered devices since 2023, mass-produced its Kirin 9050 chips using proprietary LogicFolding technology, and advanced Kirin 2027 testing. Meanwhile, its Ascend AI processors are gaining market share amid US export restrictions. South China Morning Post

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

Why this little known Chinese chipmaker has caused a global stock rout China's CXMT announced advances in high-density memory technology, triggering sharp declines in Micron, SK Hynix and Samsung shares. Despite US export restrictions, CXMT is expanding its DRAM market share and plans new server-memory products by 2026. CNBC

U.S. Chip Firms Bet Big on R&D Applied Materials expanded its EPIC semiconductor research center investment to $5 billion, driven by AI demand. The facility brings chipmakers together to accelerate material discovery, improve equipment development, and shorten commercialization timelines by several years. IEEE Spectrum

Sponsor Enabling A Chiplet Supply Chain Chiplet-based architectures are gaining popularity for their smaller die sizes and better yields, but challenges in power management, security, and supply chain complexity remain. Download now. Amkor Technology, Inc.

Why Samsung, SK Hynix and CXMT shares are under pressure despite strong AI demand Asian memory chip stocks tumbled as investors questioned the sustainability of AI-driven profits amid supply risks and high valuations. Samsung, SK Hynix and China's CXMT faced losses despite strong earnings, while slowing price growth threatened future margins. South China Morning Post

Samsung expands AI memory, storage strategies Samsung unveiled AI infrastructure strategies at OCP Global Summit 2026, focusing on high-performance memory, CXL-based memory expansion & next-gen SSDs. The company will also demonstrate a joint CXL memory expansion solution with AMD to overcome capacity limitations. Yonhap News Agency

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

Applied Materials opens new $5B chip research facility to accelerate collaborative semiconductor innovation Applied Materials opened its $5 billion EPIC Center in Silicon Valley, uniting chipmakers and researchers to accelerate semiconductor innovation. The facility aims to cut development cycles by 30%, advancing AI computing, energy efficiency and chip manufacturing. SiliconANGLE

Sponsor Medical Grade, Toughened Epoxy Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation. Master Bond

Security Becomes a Sign-off Item Europe's Cyber Resilience Act will require chipmakers to prove hardware security through auditable evidence, creating new opportunities for AI-driven verification tools. However, delayed standards and costly certification could challenge startups and complicate chip design. EE Times