semiconductor
packaging news
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Industry Press
SEMICON Southeast Asia 2026 Officially Launches in Kuala Lumpur
SEMI
Indium Corporation to Present High-Performance AI Application Solutions at SEMICON SEA 2026
Indium Corporation
ZEISS receives SBTi validation for its climate targets
ZEISS
TechniQuip introduces FlightDeck Operating System
TechniQuip
Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
EV Group
Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI
Siemens
esmo group Launches X-change Cart for Single-Operator Load Board Handling
esmo group
Shenzhen SAM Electronic to Showcase SM-800 FOUP Cleaner at SEMICON Southeast Asia 2026
Shenzhen SAM Electronic Equipment Co.
MORE INDUSTRY PRESS
Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP4UF-80 is a thermally conductive, electrically insulating adhesive that offers high mechanical strength and is used for underfill applications.
Master Bond
kyzen
What Year Was It?
English Channel Tunnel Opens
What Year
A rail tunnel under the English Channel was officially opened, connecting Britain and the European mainland for the first time since the Ice Age.
See the answer below.
Plasmatreat-GmbH
Sponsor
Plasma-Etch

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
Surfx-Technologies
Sponsor
Balazs-Nanoanalysis

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
What Year Was It Answer
English Channel Tunnel Opens
Answer: May 6, 1994
May 7, 2026
Anthropic CEO says 80-fold growth in first quarter explains 'difficulties with compute'
Anthropic CEO Dario Amodei said demand surged 80-fold versus planned 10-fold growth, straining compute. The company secured SpaceX Colossus 1 capacity and expanded deals to scale Claude's rapid adoption, while pursuing funding at a $900 billion valuation.
CNBC
Sponsor
Circuit-Technology-Center

Simplify Your Most Challenging BGA Rework
When complex BGA repairs demand precision and reliability, turn to the trusted resource used by leading military contractors for all their rework.
Circuit Technology Center
Elon Musk's Terafab chip factory in Texas could cost up to $119 billion, filing shows
Elon Musk plans a massive Terafab chip plant in East Texas, costing at least $55 billion initially and up to $119 billion. SpaceX, Tesla, xAI, and Intel will collaborate to build it, aiming to secure chip supply and boost AI production.
CNBC
Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends.
Technical Paper
Sponsor
XYZTEC

High Force and Large area bond tester
The most powerful bond tester to test IGBTs, power modules and large batteries up to 1000 kgf. Sigma HF/L offers flexible positioning and operates with the fastest axis speed. Learn more.
xyztec
Could China's embrace of AI shape how its used globally?
China rapidly embraces AI agents like OpenClaw, with crowds seeking setup help as companies integrate tools into super-apps. Over 600 million users drive massive adoption, surpassing U.S. token use, turning China into a large-scale real-world AI testing ecosystem.
Taipei Times
AMD gives upbeat sales forecast as it cashes in on AI data center demand
AMD issued a stronger-than-expected Q2 revenue forecast of $11.2 billion, driven by surging AI data center demand. The company is gaining share against Nvidia, with rapid growth in data center and CPU sales despite memory supply constraints.
Taipei Times
Sponsor
Amkor-Technology

Enabling A Chiplet Supply Chain
Chiplet-based architectures are gaining popularity for their smaller die sizes and better yields, but challenges in power management, security, and supply chain complexity remain. Download now.
Amkor Technology, Inc.
Technical Papers
Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
MORE TECHNICAL PAPERS
Sponsor
Pac-Tech

High-Speed, Reliable Plating with PACLINE®
PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution.
PacTech
Chip Fab-in-a-Box Could Democratize Semiconductors
InchFab, founded by MIT graduate Mitchell Hsing, develops $5–15 million container-sized mini fabs using smaller wafers. The system enables chip prototyping and training globally, helping regions build semiconductor expertise before investing in large-scale fabrication facilities.
IEEE Spectrum
FPGA Maker's Strategic Pivot into Firmware World
Lattice Semiconductor will acquire firmware developer AMI for $1.65 billion in cash and stock, combining low-power FPGAs with server firmware to build secure AI and cloud infrastructure management solutions and shift from component supplier to system-level provider.
EE Times
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
After the frenzy, the fallout: why the chips are down for Shenzhen’s tech traders
AI-fueled semiconductor gains are bypassing Shenzhen's Huaqiangbei traders as DDR4 chip prices crash nearly 40%. Speculators who bought late now face steep inventory losses, weak consumer demand, and a painful split from the global chip rally.
South China Morning Post
Hardware From Specifications Using AI
Experts caution that AI-driven hardware design from specification to silicon remains uncertain, as past efforts failed due to verification limits, poor modeling, and abstraction tradeoffs. While AI may aid IP integration and modeling, correct-by-construction designs are unlikely soon.
Semiconductor Engineering
Sponsor
MicroCircuit-Laboratories-LLC

FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
Using AI To Monitor Dashboards In Chips And Systems
Chipmakers are using AI to merge fragmented dashboards, combining sensor data to spot thermal, power and performance faults in real time. AI agents trace root causes, automate fixes, and speed chip design, verification and system-level optimization.
Semiconductor Engineering
Apple eyes Samsung for iPhone chips after decade with TSMC
Apple is exploring using Samsung and Intel as chip foundry partners to reduce reliance on TSMC as AI demand strains supply, holding early talks and visits but placing no orders yet, signaling a possible phased dual-sourcing strategy.
The Korea Herald
Sponsor
Ironwood-Electronics

Optimizing Force in Socket Interconnect
IC Socket trends impacted by technology and market factors including miniaturization, higher pin counts, faster operating speeds, higher operating temperatures and higher current.
Ironwood Electronics
China's chipmakers pour revenue into R&D, outpacing US ratios
Chinese chip designers allocate a higher share of revenue to R&D than US rivals as Beijing drives AI self-reliance. Moore Threads and MetaX spend 50% and 45%, far above AMD and Intel, though US firms still lead in absolute spending.
South China Morning Post
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Today's Sponsor
Ontos-Equipment-Systems
Sponsor
Ontos-Equipment-Systems

The Next Step in Surface Prep!
All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated
surfaces without a vacuum chamber.
Ontos Equipment Systems
Test Your Knowledge
Who is known as The Father of Geometry?
See answer below.
Henkel-AG-Co
Quote of the Day
Knowledge that is not used is abused.
American Indian Proverb
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Industry Calendar
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
May 12, 2026
Wire Bonding Workshop
IMAPS
May 13, 2026
San Diego Chapter of IMAPS
IMAPS
FULL INDUSTRY CALENDAR
Ormet-TLPS
Cartoon of the Day
Cartoon
"You needed another deduction, so I billed you twice."
Copyright © Randy Glasbergen
Sponsor
DL-Technology

Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online.
DL Technology
CyberOptics
Test Your Knowledge Answer
Who is known as The Father of Geometry?
Answer: Euclid of Alexandria is called the Father of Geometry. He received his education at Plato's Academy in Greece and moved to Egypt to teach. He taught during the reign of Ptolemy I Soter, the first Macedonian ruler.