February 17, 2026

Wafer Level Packaging Market Size - Global Forecast 2026 - 2035 The global wafer level packaging market will grow from $8.7 billion in 2025 to $24.6 billion by 2035, driven by AI, 5G, EVs, and data centers. Companies like Foxconn and Smartkem are investing to advance high-performance, compact semiconductor solutions worldwide. Global Market Insight

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VIEWPOINT 2026: Casey Krawiec, VP of Global Sales, StratEdge Corporation As a company specializing in the design, production, and assembly of high-frequency, high-power semiconductor packages for defense and aerospace applications, StratEdge experienced another strong year. Since 1985, we have been a leader in delivering high-performance packaging solutions for RF, microwave, ... StratEdge Corporation

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

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Chip Assembler ASE Sees Advanced Packaging Sales Doubling ASE Technology Holding expects advanced packaging sales to double to $3.2 billion this year, fueled by AI demand from Nvidia and other chipmakers. As TSMC outsources more work, ASE is expanding factories and capacity to capture growing AI-driven opportunities. EE Times

Rising Costs and Demand Drive China's LLM Price Jump: Zhipu GLM‑5 Hikes 30% in First 2026 Increase Chinese AI heats up as Lunar New Year nears: Zhipu AI launches GLM‑5 overseas and hikes Coding Plan prices 30%–100%, marking the first major 2026 LLM increase. Rising demand, heavier compute costs, and DeepSeek V4's innovations signal a new wave of AI competition. TrendForce

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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The Race Begins For Much Bigger Abstractions Data center expansion is enabling real-time digital and virtual twins that integrate vehicles, infrastructure, and complex systems. AI agents manage massive data streams, optimize interactions, and automate testing, reshaping automotive, chip, and industrial design. Semiconductor Engineering

New Calculations Reveal Extra Bound States Within Layered Semiconductor Materials Researchers used the Gaussian Expansion Method to model excitons and trions in 2D materials like MoS₂, discovering a new bound trion state with orbital angular momentum. They showed how strain & dielectric settings tune binding energies, advancing optoelectronic & quantum design. Quantum Zeitgeist

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TSMC considers an additional $100 billion investment into Arizona fabs to bolster American chipmaking efforts — move would help TSMC's chips avoid tariffs due to local production As part of a U.S.–Taiwan trade deal, TSMC and other Taiwanese firms will invest $250 billion in the U.S. to avoid chip tariffs. Unclear terms and rumors of another $100 billion expansion raise questions about TSMC's long-term capacity, strategy, and tariff exposure. Tom's Hardware

The $3 Trillion Blueprint: A Deep Dive into TSMC's AI-Driven Dominance Taiwan Semiconductor Manufacturing Company dominates the AI-driven tech cycle, controlling over 90% of advanced chip output. Fueled by 26% revenue growth and surging AI demand, it pushes into 3nm and 2nm production, investing heavily to anchor the global digital economy. Financial Content

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China's tech shock threatens the U.S. AI monopoly and is 'just getting started' China is rapidly closing the AI gap with the U.S., breaking America's perceived tech monopoly, warns TS Lombard economist Rory Green. Backed by state funding, Huawei chips, and low-cost production, China could build a global tech sphere and challenge U.S. dominance. CNBC

Looks like AI is an existential threat after all An AI writer explains his shift from optimism to caution on superintelligence. Once dismissive of existential risk, he now fears advanced LLMs that write code and act autonomously could unlock catastrophic threats—even if robot uprisings remain distant. Asia Times

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NAND Reimagined in High-Bandwidth Flash to Complement HBM High-bandwidth flash (HBF) stacks 3D NAND to deliver massive capacity and near-DRAM bandwidth for AI inference. SK Hynix and Samsung plan commercialization by 2027, pairing HBF with HBM to boost performance per watt and tackle the AI memory wall efficiently. EE Times

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