March 20, 2026

Advanced Packaging Limits Come Into Focus As AI and HPC designs grow more complex, advanced packaging hits mechanical and process limits. Warpage, material mismatch, and yield issues constrain scaling, pushing innovation beyond interconnects toward system-level design and tighter packaging integration. Semiconductor Engineering

Sponsor Electrically Insulating, Toughened Epoxy Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping. Master Bond

Jensen Huang doesn't need a new chip. He needs a new moat. Nvidia CEO Jensen Huang is pivoting beyond chips, launching open-source NemoClaw at GTC to position Nvidia as AI's platform layer, aiming to secure long-term dominance as competition intensifies in inference and open-source ecosystems. CNBC

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor Hermetic Package Seam Seal with HDHS® Technology Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS. MicroCircuit Laboratories, LLC

2D Semiconductors Inch Forward Transition metal dichalcogenides like WSe2 and MoS2 enable high-performance GAA transistors with ultra-thin channels. Researchers tackle fabrication, adhesion, and contact hurdles through advanced growth, interface engineering, and CMOS-compatible integration innovations. Semiconductor Engineering

Canada's QMI Drives Quantum Advances, Global Collaboration Marcel Franz assumes leadership of the Stewart Blusson Quantum Matter Institute, bringing decades of experience at UBC and deep expertise in quantum materials. Backed by new federal funding, he aims to expand collaboration and accelerate advances in quantum technology. EE Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor The Global Leader in Warpage Metrology Solutions We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain. Akrometrix

Micron tech plans heavy spending on AI demand Micron Technology Inc forecast strong revenue and profit driven by AI demand but warned heavy capital spending will exceed $25 billion this year and rise further, as soaring memory shortages and high-bandwidth chip demand strain supply and boost prices. Taipei Times

Huawei capitalises on OpenClaw frenzy to boost computing demand for its chips Huawei Technologies is capitalising on the OpenClaw surge by launching AgentArts, expanding Kunpeng and Ascend platforms, and opening hardware ecosystems, aiming to accelerate enterprise AI adoption, boost computing demand & strengthen its position against global rivals. South China Morning Post

Sponsor Particle-Free Plasma Oxide Reduction Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder. Surfx Technologies

OpenClaw demand in China is driving up the price of used MacBooks Surging demand for OpenClaw pushes Chinese consumers toward secondhand Apple Macs, driving up resale prices. Buyers seek secure, high-performance machines for AI tasks, tightening supply, accelerating upgrades, and boosting chip prices. CNBC

Samsung Electronics to invest 110 tln won in AI chip R&D, facilities this year Samsung Electronics plans to invest over $73 billion in AI semiconductor R&D and facilities this year, marking a record increase. It aims to boost leadership, expand global production, and pursue acquisitions across robotics, medical tech, automotive electronics, and more. Yonhap News Agency

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography + Patterning 2026 Advanced SoC manufacturing pushes EUV lithography to its limits, driving adoption of high-NA tools, AI-driven modeling, and stitching-aware design. Industry efforts enhance pattern fidelity, boost yield, and expand process windows through machine learning and co-optimization. Semiconductor Engineering

Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles Virtual DOE and predictive modeling accelerate semiconductor integration by exposing risks early, but hinge on accurate, fab-calibrated models. SEMulator3D Analytics adds parameter ranking and calibration, boosting accuracy while cutting experiments, costs, and time to market. Semiconductor Engineering

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Liquid Cooling Drives Other Localized Cooling Liquid cooling tames high-power GPUs but eliminates airflow that once cooled nearby components, creating new hotspots. Engineers respond with board-level thermal analysis and targeted micro-cooling to protect adjacent chips, sustain reliability, and prevent failures. Semiconductor Engineering

Sponsor Advanced Packaging for Next-Generation Vehicle As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more. Amkor Technology, Inc.