May 15, 2026

Chiplets Need A New Workflow Chiplets are reshaping semiconductor design as companies replace monolithic SoCs with multi-die systems. Engineers adopt unified early-stage workflows that combine architecture, packaging, verification, and reliability analysis to control complexity. Semiconductor Engineering

Sponsor Selective Laser Bonding for Fine Parts Localized laser heating enables precise bonding without heating the full substrate, reducing thermal stress and energy use in advanced packaging. See how it works. PacTech

TSMC expects global chip revenue to hit US$1.5tn TSMC forecasts global semiconductor revenue will surpass $1 trillion this year and reach $1.5 trillion by 2030, driven by AI demand, with AI inference becoming the main growth engine and high-performance computing accounting for 55% of revenue. Taipei Times

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor 2026 IEEE ECTC – May 26-29 in Orlando The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. ECTC

Applied Materials boosts its outlook as AI chipmakers scramble to add more production capacity Applied Materials raised its sales outlook as AI chip demand fueled stronger-than-expected earnings and revenue. The chip equipment maker forecast faster growth, citing surging AI infrastructure spending and rising demand for logic and memory chips. Silicon Angle

Cerebras IPO mints two billionaires, sets stage for potential AI wave Cerebras' blockbuster Nasdaq debut sent shares up 68%, lifting its valuation near $100 billion and creating new tech billionaires among its founders. Fueled by surging AI chip demand, the $5.55 billion IPO delivered major gains for investors and venture firms. CNBC

Sponsor Seam Seal Data Collection Robotic Cover Sealer (RCS) is a fully digital, automated seam seal process using AI. Complete data is provided on each package and lid. MicroCircuit Laboratories LLC

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Automakers Face Memory Shock as AI Uses Up Semiconductor Supply Automakers face a 2026 DRAM and NAND flash shortage as AI data centers absorb high-bandwidth memory supplies. EV and software-defined vehicle makers are revamping procurement strategies while tougher EU safety rules drive additional semiconductor demand. EE Times

When Encryption Meets Quantum Quantum computing threatens modern cryptography by breaking RSA & ECC, forcing engineers to redesign security in silicon & key management. With 'harvest now, decrypt later' attacks rising, NIST post-quantum standards and 2027–2030 compliance deadlines drive urgent migration. EE Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Chinese foundries SMIC, Hua Hong forecast second-quarter growth amid AI boom China's leading foundries SMIC and Hua Hong expect second-quarter sales growth driven by surging AI demand and a memory chip shortage. Both firms signal stronger outlooks, while Hua Hong hopes easing US export controls could improve equipment access and expansion. South China Morning Post

Chinese companies are ramping up homegrown AI chips, even if Nvidia is coming back Chinese tech giants Tencent and Alibaba expect rapid expansion of domestic chip production this year as export restrictions limit Nvidia access. Firms increase AI spending, scale homegrown GPUs, and explore server offerings amid uncertain approval for Nvidia H200 sales. CNBC

Sponsor 1 of 10 Applications: Die Sorting Die sorting with Swiss made Tresky die bonders is just one of many powerful applications. Switching between them is a matter of minutes, and training could not be simpler. Dr. Tresky AG

Accelerating Chipmaking Innovation for the Energy-Efficient AI Era Applied Materials launched the $5 billion EPIC Center to unite semiconductor R&D talent, tools, and partners in one platform. The initiative cuts siloed workflows, speeds lab-to-fab transitions, and advances angstrom-era AI chip development. IEEE Spectrum

Why Vision LLMs Force A Rethink Of Edge AI Hardware Vision LLMs shifting on-device are exposing the limits of TOPS-centric edge AI chips, as memory traffic, low utilization & irregular multimodal workloads constrain performance. Chipmakers now prioritize sustained efficiency through hardware-software co-design and packet-based execution. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Flash Getting Stacked High-Bandwidth Version Sandisk advances high-bandwidth flash (HBF) to place large AI model parameters inside GPU packages, reducing data movement. Working with SK hynix and OCP, it targets standardization, with samples planned for 2026 and inference devices expected in 2027. Semiconductor Engineering

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS