Nov 4, 2026 Global Semiconductor Sales Increase 24.1% from Q2 2026 to Q3 2026 Global semiconductor sales rose 24.1% from Q2 to Q3 2026, reflecting strong market demand and growth in the semiconductor industry worldwide, according to the Semiconductor Industry Association. Semiconductor Industry Association

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

China Reportedly Obtains Smuggled HBM via Server Packages; Huawei 960DT Faces Domestic HBM Shortage Smugglers bypass U.S. export curbs by extracting HBM from repackaged server chips for Huawei, as shortages strain China's AI chipmakers, drive up prices and restrict access to advanced AI computing resources. TrendForce

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

Sponsor actnano Materials with Nordson Equipment actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more! Nordson Electronic Solutions

Samsung Reportedly to Exit 8-Inch Foundry by 2030 as TSMC Also Cuts Capacity Samsung plans to exit 8-inch foundry production by 2030, shifting resources to advanced processes. The move tightens mature-node capacity and pressures fabless chipmakers to find alternatives. TrendForce

Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? India's expanding OSAT industry creates opportunities for smaller firms in specialized semiconductor packaging, but they must secure anchor customers, maintain utilization, recruit skilled engineers and overcome qualification delays. EE Times

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Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

AMD stock jumps 8% on earnings as data center revenue nearly doubles AMD exceeded third-quarter earnings expectations, with revenue rising 45% and data center sales nearly doubling year over year. CEO Lisa Su forecast stronger AI-driven growth in 2027, sending shares up 8% in extended trading. CNBC

CrowdStrike launches AI kill switch that it says can stop internal agents that go rogue CrowdStrike launched an AI kill switch that enables businesses to detect and shut down rogue AI agents, block network access and prevent relaunches. The company also announced Anthropic integration and plans to acquire two AI security startups. CNBC

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Marvell Technology to acquire Lumentum Holdings in historic US$115 billion deal Marvell's $115 billion all-stock acquisition of Lumentum expands its AI infrastructure portfolio with advanced optical technologies, targeting faster data center connectivity despite valuation and regulatory concerns. Taipei Times

Nvidia orders data centers to reduce China exposure Nvidia is reportedly restricting data center partners from serving Chinese customers, requiring at least 51 percent of cloud services to target non-Chinese companies. The move affects future contracts amid escalating US-China competition for AI dominance. Taipei Times

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

GlobalWafers to issue US$500m in bonds to Micron GlobalWafers will raise up to $500 million from Micron through convertible bonds, funding U.S. expansion, boosting advanced wafer capacity and strengthening their 10-year partnership and supply chain resilience. Taipei Times

Five Things You Didn’t Know About Co-Packaged Optics Co-packaged optics can ease AI data-center connectivity bottlenecks, boosting bandwidth and energy efficiency. Hybrid bonding and 3D stacking will enable integration, making precision manufacturing vital by 2028–2030. EE Times

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology

Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity Marvell's Lumentum acquisition combines silicon, lasers and photonics to accelerate AI connectivity, meet data-center demand, ease integration bottlenecks and challenge Broadcom in optical networking. EE Times

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Macronix Builds Hardware Security into NOR Flash Ahead of EU Cyber Resilience Act The EU's Cyber Resilience Act is driving demand for hardware-level security in connected devices. Macronix's ArmorFlash integrates encryption, authentication and tamper protection into NOR flash, helping manufacturers secure devices, updates and data while reducing design complexity. EE Times