May 8, 2026

TSMC to Build 9 New Plants this Year to Boost Global Footprint TSMC expands globally, building nine new plants this year across Taiwan, US, Japan, and Germany. It advances 3nm, 2nm, and 1.4nm fabs while boosting AI-driven advanced packaging capacity to support high-performance computing and semiconductor demand growth. Taiwan News

Sponsor High Temperature Resistant, Die Attach Epoxy Master Bond EP17HTS-DA is an electrically conductive die attach epoxy that meets NASA low outgassing specifications and offers high temperature resistance. Master Bond

2.5D + 3D = "3.5D"! Semiconductor firms are moving beyond Moore's law with 3.5D integration, blending 2.5D and 3D packaging to accelerate AI performance. The hybrid approach boosts bandwidth and efficiency while managing cost, yield, and thermal tradeoffs through selective stacking. Semiconductor Engineering

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

GlobalFoundries Reportedly Sees Silicon Photonics Revenue Doubling in 2026, Passing $1B by 2028 GlobalFoundries is accelerating silicon photonics growth as AI networking demand boosts pluggable and co-packaged optics. GF expects photonics revenue to double in 2026, exceed $1 billion by 2028, and drive stronger pricing in constrained markets. TrendForce

SKC Said to Speed Glass Substrate Mass Production by Year-End; Advances New Non-Embedding Tech for U.S. Client SKC and Absolics are nearing what could become the world's first commercial glass substrate production, advancing advanced packaging for AI and communications chips. AMD, AWS, Apple, Intel, and Samsung links highlight rising industry momentum. TrendForce

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

Nvidia CEO says AI partnership with Corning will 'revitalize American manufacturing' Nvidia CEO Jensen Huang highlighted a partnership with Corning to expand U.S. optical connectivity manufacturing, calling AI infrastructure the largest buildout in history. The deal boosts domestic supply chains, creates jobs & advances silicon photonics for future data centers. CNBC

Nvidia inks US$500 million deal with fiber-optic maker Corning Nvidia buys $500 million in Corning shares to deepen an AI infrastructure partnership. Corning will boost US fiber capacity over 50% with new plants, while both firms expand high-speed optical networks powering AI data centers and chips. Taipei Times

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

MediaTek launches AI data center MediaTek launches a 45MW AI data center in Miaoli to boost chip R&D, completing a 15MW first phase. Powered by Nvidia B200 chips and immersion cooling, it processes 138B tokens monthly despite component shortages, with expansion planned. Taipei Times

Stacking 2D materials on bulk semiconductors yields smarter, faster photodetectors A review shows 2D/3D van der Waals heterostructures combine atomically thin materials with bulk semiconductors to build faster photodetectors and neuromorphic vision systems while overcoming interface, band engineering and fabrication challenges. Nanowerk

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

The Emergence Of Electronics Digital Twins For Software-Defined Vehicles Electronics digital twins expand traditional twin models to simulate entire electronics and software systems in software-defined vehicles, accelerating AI-driven validation, cutting costs, enabling continuous updates, and improving safety across automotive and industrial ecosystems. Semiconductor Engineering

Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority In chiplet architectures, security shifts from monolithic SoC trust to platform-level governance. A Main Security Chiplet enforces centralized trust decisions, while lightweight roots of trust in each chiplet enable identity, secure boot, communication, and lifecycle protection across the system. Semiconductor Engineering

Sponsor Spring pin socket for DFN2 Designed for up to 500,000 actuation cycles, the socket is able to handle -1db@60GHz performance over a temperature range of -40C to +150C. Ironwood Electronics

Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity Chipmakers are shifting from transistor scaling to 2.5D/3D packaging, chiplets, and integration as AI workloads raise power density. Dense interconnects and voltage margins make power integrity a system-level electro-thermal challenge. Semiconductor Engineering

Sponsor Seam Seal Hermetic Packages with Auer Carriers and 3D Trays MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing. MicroCircuit Laboratories, LLC