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Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
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What Year Was It?
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U.S. Airmail Service Begins
Air mail service begins, but initially letters only flew between the cities of New York, Philadelphia and Washington D.C.
See the answer below.
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Particle-Free Plasma Cleaning
Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more.
Surfx Technologies
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What Year Was It Answer
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U.S. Airmail Service Begins Answer: May 15, 1918
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May 15, 2026
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Chiplets Need A New Workflow
Chiplets are reshaping semiconductor design as companies replace monolithic SoCs with multi-die systems. Engineers adopt unified early-stage workflows that combine architecture, packaging, verification, and reliability analysis to control complexity.
Semiconductor Engineering
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Selective Laser Bonding for Fine Parts
Localized laser heating enables precise bonding without heating the full substrate, reducing thermal stress and energy use in advanced packaging. See how it works.
PacTech
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TSMC expects global chip revenue to hit US$1.5tn
TSMC forecasts global semiconductor revenue will surpass $1 trillion this year and reach $1.5 trillion by 2030, driven by AI demand, with AI inference becoming the main growth engine and high-performance computing accounting for 55% of revenue.
Taipei Times
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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
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Seam Seal Data Collection
Robotic Cover Sealer (RCS) is a fully digital, automated seam seal process using AI. Complete data is provided on each package and lid.
MicroCircuit Laboratories LLC
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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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Automakers Face Memory Shock as AI Uses Up Semiconductor Supply
Automakers face a 2026 DRAM and NAND flash shortage as AI data centers absorb high-bandwidth memory supplies. EV and software-defined vehicle makers are revamping procurement strategies while tougher EU safety rules drive additional semiconductor demand.
EE Times
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When Encryption Meets Quantum
Quantum computing threatens modern cryptography by breaking RSA & ECC, forcing engineers to redesign security in silicon & key management. With 'harvest now, decrypt later' attacks rising, NIST post-quantum standards and 2027–2030 compliance deadlines drive urgent migration.
EE Times
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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1 of 10 Applications: Die Sorting
Die sorting with Swiss made Tresky die bonders is just one of many powerful applications. Switching between them is a matter of minutes, and training could not be simpler.
Dr. Tresky AG
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Why Vision LLMs Force A Rethink Of Edge AI Hardware
Vision LLMs shifting on-device are exposing the limits of TOPS-centric edge AI chips, as memory traffic, low utilization & irregular multimodal workloads constrain performance. Chipmakers now prioritize sustained efficiency through hardware-software co-design and packet-based execution.
Semiconductor Engineering
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Flash Getting Stacked High-Bandwidth Version
Sandisk advances high-bandwidth flash (HBF) to place large AI model parameters inside GPU packages, reducing data movement. Working with SK hynix and OCP, it targets standardization, with samples planned for 2026 and inference devices expected in 2027.
Semiconductor Engineering
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| Today's Sponsor |
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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Test Your Knowledge
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What rings the globe 23-1/2 degrees south of the North Pole?
See answer below.
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Quote of the Day
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You cannot shake hands with a clenched fist. Indira Gandhi
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A Universal AI-Powered Segmentation Model
A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming.
Nordson Test and Inspection
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| Cartoon of the Day
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"Sometimes it's smooth sailing, sometimes it gets rough and stormy and sometimes you sink to the bottom with your crew. That's why it's called leadership."
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What rings the globe 23-1/2 degrees south of the North Pole? Answer: The Arctic Circle
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