June 18, 2026

Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit Imec's CMOS 2.0 roadmap redefines chip scaling by splitting circuits at the transistor level and reconnecting them in dense 3D architectures. The design tackles AI bottlenecks, boosting bandwidth, cutting energy use, and tightly integrating logic, memory, and I/O. EE Times

Sponsor Rapid Package Seam Seal Changeover The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less. MicroCircuit Laboratories, LLC

Accelerating Sustainability with SEMI Smart Manufacturing: An Industry 4.0 Technology Roadmap for Semiconductor Device Makers to Improve Sustainability SEMI's Smart Manufacturing Initiative unveiled a roadmap that uses Industry 4.0/5.0 technologies, digital twins, and AI to help semiconductor fabs cut emissions, water use, and hazardous waste while boosting ROI, yields, and operational efficiency. SEMI

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor A Universal AI-Powered Segmentation Model A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming. Nordson Test and Inspection

TSMC's latest chip packaging breakthrough promises lower costs and better performance TSMC is developing CoPoS, a panel-based chip packaging technology designed to cut manufacturing costs, improve efficiency, and support larger AI processors. Expected by 2028, CoPoS could complement CoWoS and help power next-gen AI chips with greater performance. Yahoo! Finance

Ball game's over—the US is out of the AI chip market in China China is resisting renewed dependence on U.S. chips despite approval of Nvidia H200 sales. Analysts warn broader U.S. restrictions may erode American firms' competitiveness while accelerating China's drive for semiconductor self-sufficiency. Brookings

Sponsor Trusted Solutions for Complex BGA Rework BGA rework demands precision and proven processes to ensure reliable results. Circuit Technology Center specializes in high-reliability BGA rework and repair. Circuit Technology Center

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Ultra-Thin Wafer Handling Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps. Brewer Science

US holds off on adding DeepSeek to blacklist The Trump administration has delayed plans to blacklist DeepSeek, CXMT, and more than 100 Chinese firms, seeking to avoid heightened tensions with Beijing. The pause, the longest in over a decade, has fueled concerns that U.S. export-control enforcement is losing momentum. Taipei Times

United States Outsourced Semiconductor Assembly and Test (OSAT) Market Growth Is Critical for the Future of Advanced IC Packaging, Miniaturization and Supply Chain Resilience DataM Intelligence's latest OSAT market report examines regional trends, segment performance, competition, revenue growth, and CAGR forecasts. It highlights key growth drivers, emerging opportunities, and strategies shaping future market expansion. Open PR

Sponsor Particle-Free Plasma Cleaning Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

Built-In Memory. Built-In Confidence. Memory shortages and rising DRAM prices are creating new challenges for edge AI, increasing costs and delaying deployments. NVIDIA positions its Jetson platform as a solution, combining LPDDR5 memory & optimized software to reduce supply-chain risks & speed development. EE Times

AI Isn't the Real Bottleneck in Autonomy; Wireless Is Autonomous drones, robots and edge systems rely on wireless links prioritizing reliability and low latency over peak throughput. Autonomy expands into infrastructure safety and defense; resilient radios ensure control and mission continuity. EE Times

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

Signoff of Synthesis-Optimized Registers Synopsys/ Suresh Barla shows how chip designers achieve sign-off confidence in complex designs by optimizing RTL for power performance and area managing verification challenges and ensuring netlists meet sign-off quality across large multi-block chips. Semiconductor Engineering

Designing Chips That Can Explain Themselves Industry experts highlighted how on-chip data analytics is becoming essential for improving semiconductor resilience, faster fault detection & better system optimization. The discussion explored emerging challenges, design strategies, and technologies that enhance chip reliability. Semiconductor Engineering

Sponsor A Hybrid PLP Technology Based On A 650 X 650 mm Platform Multiple fan-out wafers or subpanels are assembled on a carrier panel with reduced cost in the RDL process. Read more. Amkor Technology, Inc.

Intel's new manufacturing tech enters initial production Intel has launched risk production for its 18A-P process, delivering higher performance and improved power efficiency over 18A. The milestone strengthens manufacturing roadmap as AI-driven demand lifts CPU sales and supports a strong revenue outlook. Reuters

Sponsor Superior Flexibility & Speed - MRSI-H-LD Experience advanced photonics with MRSI-H-LD: high-speed, high-precision for lasers, transceivers & more. Optimize manufacturing today! MRSI Systems