June 22, 2026

World's Smallest Semiconductor Nanotube Achieved at 1 Nanometer Researchers at The University of Tokyo fabricated the world's smallest semiconductor nanotube, a 1-nm single-walled MoS₂ structure. The advance confirms a 25-year-old theory and could enable ultra-miniaturized electronics, sensors, and quantum devices with atomic-scale precision. TrendForce

Sponsor The Next Step in Surface Prep! All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated surfaces without a vacuum chamber. Ontos Equipment Systems

Chip Industry Week In Review Amkor signed a 10-year TSMC deal for Arizona packaging. Trump said Apple will work with Intel as Intel reportedly lands Google TPU production. Amazon may sell Trainium chips, while firms unveiled advances in semiconductor scaling and integration. Semiconductor Engineering

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up Intel CEO Lip-Bu Tan strengthens the company's foundry push by appointing Seok-Hee Lee to lead advanced packaging and manufacturing. The hire supports Intel's 18A and 14A roadmap, expands system-level innovation, and reinforces efforts to win major foundry customers. TrendForce

Tiny capacitor, huge demand: the AI frenzy driving MLCC prices higher AI-driven demand for servers and EVs has triggered a global MLCC shortage, sending prices soaring and straining supplies. Shenzhen traders report sharp increases, while analysts warn structural shortages will worsen as tech giants expand custom AI chip production. South China Morning Post

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Defense Sends Clear Signal to Canadian Semiconductor Industry Canada is advancing its defense and semiconductor sectors with policies that boost domestic investment, strengthen supply chains, and safeguard IP. Industry leaders urge building sovereign capabilities and dominating critical technology niches to secure long-term global relevance. EE Times

US claims China has ASML tool US Commerce Secretary Howard Lutnick raised concerns with ASML executives that one of its EUV chipmaking machines may have reached China, potentially breaching export controls. ASML denied the claim, insisting it has never shipped EUV tools to China. Taipei Times

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology

Amazon's Newest Gambit: Selling AI Chips Amazon and Google plan to sell custom AI chips to external customers, challenging Nvidia's dominance. While their TPUs and Trainium accelerators may cut costs for specific workloads, Nvidia's ecosystem strength keeps it leading general-purpose AI infrastructure. EE Times

All Semiconductor Roads Lead to Taiwan Taiwan anchors the global semiconductor supply chain, producing over 60% of foundry revenue and 90% of leading-edge chips. It expands Hsinchu Science Park, attracts global firms and startups & deepens collaboration in AI, advanced packaging & strategic technology sovereignty. EE Times

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Global memory chip market to quadruple in 2026: data Global memory chip market is set to surge more than fourfold to $975 billion in 2026, driven by AI infrastructure investment. Strong demand for server DRAM and NAND is shifting revenue toward data centers and pushing prices higher. Yonhap News Agency

Tim Cook says prices of Apple devices will jump amid memory chip shortage Apple CEO Tim Cook warns that surging AI-driven demand for memory chips has created a global shortage, forcing unavoidable price increases across Apple devices, including upcoming iPhone 18, as rising costs squeeze margins and disrupt supply chains. ABC News

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

GaN Power Devices Go Vertical Researchers are advancing gallium nitride power devices for high-voltage use with improved substrates, vertical architectures, and doping. Yet manufacturing hurdles, carbon contamination, and weak dopant activation still limit GaN's challenge to silicon carbide. Semiconductor Engineering

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies