Sep 23, 2026 Intel EMIB Substrate Yields Reportedly Hit 45%, Suppliers Eye 60% by 1Q27 Intel's EMIB-T substrate yields reportedly rose from 30% in 2Q26 to 45%, with suppliers targeting 50% in 4Q26 and 60% in 1Q27. Google and AWS are testing EMIB as Intel expands advanced packaging, despite substrate bottlenecks and growing demand. TrendForce

Sponsor The Next Step in Surface Prep! All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated surfaces without a vacuum chamber. Ontos Equipment Systems

Korea's HBM-Related Exports to Malaysia Soar 5.7-Fold in One Year as AI Packaging Demand Rises South Korea's HBM exports to Malaysia surged 5.7-fold in a year as AI packaging demand strains Taiwan's capacity. Malaysia is expanding advanced packaging, with Intel, ASE and AMD-linked operations supporting a growing alternative supply hub. TrendForce

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor Epoxy for Dam-and-Fill Applications Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications. Master Bond

China's chip push gains momentum as breakthroughs spread from manufacturing to AI processors China's semiconductor industry is broadening across design, manufacturing, equipment, memory and advanced packaging. CXMT's DRAM, Huawei's AI chips and rising exports signal progress, while US restrictions keep advanced manufacturing a major hurdle. The Manila Times

Stretchable electronics perform differently depending on how they are stretched Researchers from Tsinghua University and Nanyang Technological University used molecular dynamics and machine learning to reveal how strain alters charge mobility in pentacene crystals. Their findings guide robust, flexible organic electronics for wearable sensors and computing. Nanowerk

Sponsor ECTC Call for Papers Due October 5 ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials. ECTC

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Accelerating the Transition to Intel 18A for Secure National Security Microelectronics U.S. defense agencies are accelerating semiconductor modernization for AI, sensing, electronic warfare, secure communications and real-time processing. Supply-chain risks are driving domestic capabilities and trusted access to advanced-node chips. 3D InCites

Singapore's Nexstrom wants to bring 2D semiconductors to chip fabs Nexstrom is developing equipment to grow ultrathin TMD semiconductors directly on 300mm wafers, aiming to overcome leakage, power, and heat challenges from shrinking silicon transistors. The startup joins TSMC, Intel, and IMEC in advancing 2D chip technologies. TechCrunch

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

GUC Announces 2nm 16 Gbps HBM4E IP Global Unichip has introduced design-ready HBM4E PHY and Controller IP for AI ASICs, achieving 16 Gbps speeds on TSMC's N2P process. The technology supports CoWoS-L and SoIC-X architectures, improving bandwidth, power efficiency, signal integrity and 3D integration. EE Times

China's Huawei trims mobile chip gap with Apple as Tau Scaling Law pays off Huawei's Kirin 9050 Pro has narrowed its performance gap with Apple’s chips to about three years, Bernstein says. Built on 7nm-class technology, the processor uses LogicFolding to boost transistor density, performance and efficiency despite China's manufacturing restrictions. South China Morning Post

Sponsor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Nordson Test & Inspection

How AI Is Accelerating PCB Design and Prototyping AI-assisted PCB design tools from Quilter and Cadence automate placement, routing and performance analysis, cutting prototyping time. Engineers can test more configurations, catch issues earlier, improve routing efficiency and focus on innovation. EE Times

From Test Compression To Hierarchical Connectivity: Scaling SoC Test For AI And HPC Devices Modern AI and HPC chips are pushing traditional test architectures beyond their limits. Synopsys’ TestMAX Unified Compression and Streaming Fabric address rising test data, routing complexity, bandwidth demands, diagnosis challenges, and costs through scalable, efficient testing. Semiconductor Engineering

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

Alibaba shares jump as new AI chip, data center buildout plans unveiled Alibaba unveiled its Zhenwu V900 AI chip and plans to expand global data center capacity beyond 20 gigawatts by 2032. The company is also developing new Qwen models, intensifying its push into AI infrastructure and computing power. CNBC

Sponsor Oxide Reduction for Reliable Power Electronics Manufacturing As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in power electronics production. Download here. Plasmatreat GmbH

SK hynix unveils semiconductor technology vision at U.S. forum SK hynix outlined its semiconductor growth strategy at its 2026 Global Forum in California, highlighting its HBM roadmap and next-generation memory technologies. CEO Kwak Noh-jung emphasized strong AI-driven demand and plans to expand production and R&D capabilities. Pulse