April 16, 2026

AI Growing Impact On Chip Design And EDA Tools Experts from Synopsys Converge panel, including leaders from Synopsys, Intel, AMD, Nvidia, Microsoft, and UC Berkeley, discuss how AI is reshaping chip design and driving changes in EDA tools during a live Semiconductor Engineering discussion. Semiconductor Engineering

Sponsor What drives the AI transformation? AI delivers headlines, but for Senior ASIC Leader at Cisco Systems Vishal Kirti, blazing new tech trails begins with the one element that makes it all possible: silicon. Henkel AG & Co.

SEMI Europe Policy Forum Brussels 2026 to Focus on Chips Act 2.0 in Shaping the Future of Europe's Semiconductor Industry SEMI Europe's Policy Forum Brussels 2026 on June 3 will unite leaders to tackle geopolitical shifts reshaping semiconductors, promote a Chips Act 2.0, and strengthen Europe’s supply chain resilience, competitiveness, and global strategic position. SEMI

The Evolution of Inspection and Metrology in the AI Era AI's rise drives demand for advanced processors, shifting the industry to chiplet architectures with high-bandwidth memory. This transformation introduces new challenges in semiconductor manufacturing, especially in inspection and metrology. Technical Paper

Sponsor FSO Seam Seal Hermetic Packages with AI. Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories. MicroCircuit Laboratories, LLC

Intel Reportedly to Brief Staff on TeraFab Involvement in Coming Weeks, While Key Foundry Details Remain Limited Intel is set to detail its role in Musk's TeraFab chip venture, calling it a strategic alliance to support AI, robotics, and space systems. While leadership and scope are emerging, key questions on cost, timeline, and manufacturing yields remain unresolved. TrendForce

Tesla stock adds nearly 8% as Elon Musk touts chip progress Tesla shares jumped nearly 8% after Elon Musk said the AI5 chip hit a key engineering milestone and nears production. The company plans chip factories with SpaceX, Intel joined the project, while UBS upgraded the stock and raised its target. CNBC

Sponsor SQ7000+TM Multi-Function for 3D AOI, SPI & CMM The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system. Nordson Test & Inspection

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

ASML raises 2026 sales forecast as AI demand fuels growth ASML raised its full-year sales forecast to 36–40 billion euros as AI-driven chip demand surges. The company sees supply constraints persisting while customers like TSMC, Samsung and SK Hynix expand capacity, despite weaker near-term quarterly outlook and China headwinds. Taipei Times

JSR opens advanced process solution lab JSR Corp launched an advanced planarization research center in Taiwan to speed development of CMP materials for TSMC's next-generation chips. The facility enables local testing, strengthens collaboration, and supports gate-all-around 2nm and future AI-driven semiconductor demand. Taipei Times

Sponsor UV DIE Bonding Special Technology Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology. Tresky Automation

Crypto Faces Increased Threat from Quantum Attacks Google Quantum AI reveals that smaller-than-expected quantum machines could crack RSA and elliptic curve cryptography, intensifying urgency for post-quantum security. Meanwhile, Algorand jumps 44% as investors back its quantum-resistant design. IEEE Spectrum

Chip giants AMD, Qualcomm and Arm back driverless car startup Wayve with fresh funds Wayve raised $60 million from Qualcomm, AMD and Arm, strengthening strategic ties as it advances mapless autonomous driving technology. The startup aims to integrate with any automaker while competing with Waymo & expanding global testing & commercial partnerships. CNBC

Sponsor Copper Stud & CTE Nano Tech Underfill AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles. AI Technology, Inc.

US controls chips in the AI race, but China controls the scoreboard Global AI competition is shifting from model supremacy to token-based inference economics. China now leads in token consumption and scales cheap compute infrastructure, while US export controls lag behind a system where developers follow lower-priced, high-volume inference. South China Morning Post

How Europe Actually Finances Semiconductor Investments The European Chips Act mobilizes billions for semiconductor growth, but projects must pass EIB bankability checks balancing financial viability, technical risk, and EU strategy. The bank catalyzes private investment, yet funding gaps persist between startups and massive fab expansions. EE Times

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Why More CPUs Are Needed For Agentic AI Shifting from generative to agentic AI will increase data center compute demands as autonomous agents run 24/7 simultaneous multi-source queries without human input. Jeff Defilippi of Arm highlights need for new compute architectures, agent orchestration and higher-bandwidth chips. Semiconductor Engineering

Sponsor SEMIEXPO Heartland — April 29–30, 2026, Detroit, Michigan Explore Smart Manufacturing & Mobility in the Midwest, a growing semiconductor hub with $44B+ in investments. Connect, innovate, & lead the future! Click here to register. SEMI