August 17, 2026

Common Earth Project Aims to End Chip Supply Chain Bottlenecks University of Michigan researchers and Imec are launching “Common Earth” to address semiconductor supply chain vulnerabilities. The project seeks alternatives to scarce materials and forever chemicals, aiming to reduce geopolitical, environmental, and social risks threatening chip production. IEEE Spectrum

Sponsor 1 of 10 Applications: Eutectic Bonding Swiss made Tresky die bonders can be fitted with temperature controlled chucks and protective gas suited to eutectic die bonding of chips with AuSn bumps for opto-electronic components. Dr. Tresky AG

SMIC lifts prices due to AI demand SMIC raised prices for high-demand wafer capacity as AI demand boosted orders, lifting second-quarter revenue above $3 billion and profit to $479.2 million. The Chinese foundry expects continued AI-driven growth, higher shipments, and expanded capacity in the second half. Taipei Times

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Amkor Joins Arizona Economic Delegation to the Republic of Korea Amkor Technology is joining an Arizona delegation to Korea to strengthen semiconductor partnerships and investment. Its Arizona campus, set to become the first high-volume advanced packaging and test OSAT facility in the U.S., will create up to 3,000 jobs and bolster supply-chain resilience. 3DInCites

Intel at a Memory Crossroads, Again Intel is exploring new memory architectures as AI reshapes demand and shortages persist. CEO Lip-Bu Tan has highlighted stacked DRAM and advanced packaging, while initiatives such as XBM and ZAM could revive Intel’s memory ambitions. EE Times

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor No more cartridge exchanges The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more. xyztec

Arm co-founder Hermann Hauser’s AI warning: The revolution is real, but so is the bubble risk Tech veteran Hermann Hauser sees AI creating enormous value despite market turbulence and inflated valuations. He warns of costly computing challenges while highlighting photonic and in-memory technologies, urging Europe to build technological sovereignty and compete globally without becoming dependent on America. CNBC

Semiconductor Equipment Shifts To Build-to-Print Manufacturing Semiconductor fabs are driving equipment demand, straining OEM production capacity and specialized suppliers. Build-to-print contract manufacturing offers flexible external capacity, helping OEMs scale faster, preserve capital, maintain design control, and support global fab expansion without costly facility investments. EE Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Chip Industry Week In Review AI infrastructure is evolving as smaller models reduce compute needs while optical interconnects, chiplet packaging and advanced cooling support larger systems. Companies are investing billions in semiconductor R&D, packaging, quantum computing, and workforce development as global competition intensifies. Semiconductor Engineering

SMIC weighs more capacity as AI-related chip demand exceeds forecasts China’s SMIC plans to add equipment as AI-driven demand pushes mature-node chip orders beyond forecasts. Capacity utilization reached 93.7%, while second-quarter revenue jumped 36.1% year over year to $3.01 billion, prompting further expansion and potential price increases. South China Morning Post

Sponsor Plasma Treatment Before Anything Else Optimize PCB and advanced packaging performance with cutting-edge plasma surface activation and precision cleaning. Boost adhesion and yield. Learn more! Nordson Electronics Solutions

Half-trillion Nvidia chip financing threatens China AI ambitions Nvidia’s $500 billion financing initiative with major financial institutions could strengthen its AI dominance while squeezing Chinese chipmakers. Critics warn debt-fueled expansion may create overcapacity, financial risks and regulatory scrutiny, while US-China tensions further reshape global data center supply chains. Asia Times

Rochester region sees semiconductor growth from CHIPS Act investments Four years after the CHIPS Act, Upstate New York has attracted billions in semiconductor investments, created jobs and strengthened supply chains. Projects including Edwards Vacuum, NY SMART I-Corridor and Rochester’s STELLAR Engine are advancing manufacturing, research and workforce development. Rochester Business Journal

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

Vertical Integration Becoming Pervasive AI workloads are driving teams to design silicon around specific tasks, tightening hardware-software collaboration. Custom ASICs, RISC-V processors and heterogeneous architectures can boost performance, power efficiency and flexibility at scale. Semiconductor Engineering

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.