Sep 24, 2026 From Qubits to Workflows: Rethinking Quantum Computing IBM is advancing a quantum-centric computing model that integrates QPUs with CPUs, GPUs and AI. By automating hybrid workflows, the company argues that quantum processors will become specialized accelerators within heterogeneous computing systems rather than replace machines. EE Times

Sponsor Thank You, SEMICON Taiwan! Thank you to everyone who visited Muehlbauer at the Bavarian Pavilion and joined our presentation "AI, Sub-Micron Vision & Autonomous Manufacturing." Muehlbauer – serving billions of people. every day. Muehlbauer

Reflections on a Remarkable Decade at SIA … and the Opportunities Ahead As SIA CEO, John Neuffer reflects on a semiconductor industry transformed during his tenure, with sales poised to top $1.5 trillion. He highlights chips’ growing role in AI, quantum computing, national security, innovation and U.S. leadership. Semiconductor Industry Association

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor 1 of 10 Applications: RFID Swiss made Tresky die bonders provide hassle-free bonding of flip chip circuits to flexible antenna substrates with highest flexibility and operator training within minutes. Dr. Tresky AG

Apple Executive Chair Tim Cook to Receive Semiconductor Industry's Top Honor SIA names Apple Executive Chair Tim Cook the 2026 Robert N. Noyce Award recipient for his contributions to semiconductor innovation, U.S. advanced manufacturing and Apple silicon. Cook will accept the honor Nov. 19 at the SIA Awards Dinner. Semiconductor Industry Association

Qualcomm Says Announced 2nm Chips Will Use TSMC, Keeps Door Open to Samsung Foundry Qualcomm says all announced 2nm chips will use TSMC, keeping Samsung Foundry in consideration for future products. New Snapdragon 8 Elite Gen 6 platforms exceed 5GHz, boost graphics and enable 30B+ parameter AI models on smartphones with UFS 5.0. TrendForce

Sponsor Trace Analytical for Semiconductor Industry Balazs™ provides the following analytical services with a commitment to absolute quality control: Water analysis, Chemical analysis, Gas analysis, Particle analysis, Material analysis, Part analysis, and Cleanroom Evaluation analysis. Balazs Nanoanalysis

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C. Ormet® TLPS

Silicon Wafer Prices to Surge 40% in 2027 as AI Demand Squeezes the Chip Supply Chain AI demand is pushing silicon wafer prices higher, with Taiwan's CTEE expecting polished wafers to rise 40% and epitaxial wafers 15%–25% in 2027. Rising spot prices may encourage semiconductor firms to secure long-term agreements amid expanding AI chip production. wccftech

China's storage makers aim to climb value chain with advanced packaging bets Biwin Storage Technology will invest US$672 million in advanced wafer-level packaging in China, expanding capacity and capabilities. Other Chinese memory suppliers are also moving up the value chain as AI demand drives growth in advanced packaging technologies. South China Morning Post

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape India's semiconductor push has moved from plans to production, with five packaging plants now operational. The government launched ISM 2.0 with $13.5 billion, targeting fabs, advanced packaging, design, R&D, equipment, materials, startups, and talent development. EE Times

ASML reports zero chip equipment sales in Europe during second quarter of 2026 Europe leads semiconductor equipment with ASML but lacks comparable chipmaking capacity, leaving supply chains exposed as Asian manufacturers dominate purchases. New fabs in Germany, France and Italy could improve resilience, but a competitive ecosystem will take years. Glabal Sources

Sponsor GHz Bandwidth Sockets for BGA & QFN Industry's smallest footprint with 0.2mm-1.27mm pitch – BGA, QFN(MLF), bandwidth to 94+GHz, 6 different lid options, optional 500,000 insertions. Ironwood Electronics

Vietnam's semiconductor industry development index promulgated Vietnam launched a semiconductor development index covering economic scale, technology, R&D, manufacturing, talent and infrastructure. The framework will help officials track progress, unify data and refine policies for industry growth through 2050. VnEconomy

Multi-Agent AI Systems Must Work Like An Orchestra Without A Conductor Industry leaders from Cadence, ChipAgents, Keysight EDA, Siemens EDA & Synopsys discussed agentic AI's evolving role in chip design, highlighting recent developments, practical challenges, and implementation issues during a closed-door Design Automation Conference roundtable. Semiconductor Engineering

Sponsor SB²® Solder Ball Jetting: Fast, Clean, Reliable Achieve fast, precise, and clean solder ball placement with SB²®—ideal for flip chip, reballing, and advanced packaging from wafer to panel level. Learn More. PacTech

Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design AI is transforming semiconductor design, but fragmented and poorly structured data limits its potential. The industry must first organize, contextualize, and trace design data to build reliable AI-driven EDA workflows and accelerate innovation. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Samsung, SK hynix's 800 trillion won chip cluster targets mass production by 2030 Samsung Electronics and SK hynix plan an 800 trillion won memory chip cluster in Honam, targeting mass production by June 2030. Gwangju will accelerate power, water and site infrastructure, enabling construction of four fabs to meet surging AI-driven demand. Korea Joong Ang Daily