Sep 30, 2026 NVIDIA Reportedly Explores Glass Substrates, 2028 Adoption Possible NVIDIA is reportedly evaluating glass substrates for next-generation AI packaging, pushing suppliers in Taiwan, South Korea and Japan to accelerate development. Process yield and customer qualification remain key hurdles before volume adoption. TrendForce

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

IBM Details Quantum, AI Developments in India IBM and IIT Madras’ quantum course drew 208,785 Indian enrollments in 2026, while IBM expanded quantum, AI, processor and post-quantum security work. The company also outlined plans for larger quantum processors, PQC acceleration and open hardware initiatives. EE Times

5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing Study examines how EtherCAT-networked automation enables high-speed sorting of increasingly small and fragile semiconductor dies. The equipment combines micron-level motion accuracy, gentle handling, inline testing, flexible packaging formats and production-scale throughput. Technical Paper

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TSMC OIP: Chip Industry Growth Blows Past Forecast TSMC says global semiconductor revenue could reach $1.7 trillion in 2026, driven by more than $1 trillion in AI spending. New tape-outs across N5, N3 and N2 technologies have also quadrupled, highlighting accelerating advanced-chip demand. Semiconductor Engineering

TSMC Reportedly Eyes Texas Expansion That Could Top US$265B; VIS-NXP Mulls Second Singapore Fab TSMC may build a second U.S. hub with up to six advanced fabs, potentially in Dallas, as AI demand, customer pressure and tariffs spur localization. Meanwhile, VIS-NXP is evaluating a second Singapore phase amid strong, tight mature-node capacity. TrendForce

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

Technical Papers ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications MORE TECHNICAL PAPERS

Sponsor Thank You, SEMICON Taiwan! Thank you to everyone who visited Muehlbauer at the Bavarian Pavilion and joined our presentation "AI, Sub-Micron Vision & Autonomous Manufacturing." Muehlbauer – serving billions of people. every day. Muehlbauer

AMD chief to visit S. Korea next month: sources AMD CEO Lisa Su is expected to visit South Korea in October to meet semiconductor leaders, government officials and Samsung Electronics. The discussions will focus on AI semiconductors, strengthening partnerships and expanding AMD’s collaboration with South Korea's chip industry. Yonhap News Agency

AMD buys firm founded by researcher Li Feifei AMD will acquire AI startup World Labs for about US$8.2 billion, bringing founder Li Feifei on board as chief scientist. The deal strengthens AMD's AI capabilities in spatial intelligence and world models for robotics and virtual simulations. Taipei Times

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

OpenAI cancels release of newest model OpenAI has shelved Astra 6.1 after internal tests found safety and authorization shortcomings. A UK study also found GPT-6 Astra breached guardrails more often, intensifying concerns over AI security as OpenAI faces scrutiny over unauthorized government website access. Taipei Times

AI Data Centers Make Power, Cooling Critical to Scaling AI is reshaping data centers into strategic infrastructure, making power, cooling, networking, memory bandwidth and advanced packaging critical. Rack-level design, HBM, chiplets and energy efficiency now drive AI deployment and chip competition. EE Times

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

EU Cyber Resilience Act: Three Misconceptions That Put Embedded Products at Risk The EU Cyber Resilience Act tightens cybersecurity rules for connected products, including closed networks. Manufacturers must report vulnerabilities from September 2026 and meet requirements in 2027, securing products throughout their lifecycles. EE Times

Why Verification Needs a Thread, Not More Fragments Modern systems demand verification that connects requirements, design, tests, environments, and results across domains. As complexity grows, traceability becomes essential, helping engineers preserve context, manage changes, and build confidence throughout the lifecycle. Semiconductor Engineering

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Moores Lab AI: Applying Agentic AI Across Chip Design Moores Lab AI is using semiconductor expertise and AI to accelerate chip design, verification and debugging. Its platform reportedly reduces initial testing from months to 48 hours, while addressing AI's reliability challenges in zero-tolerance semiconductor development. Semiconductor Engineering

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

SK hynix to provide up to 50% of R&D costs upfront for partner firms SK hynix will strengthen supplier support across development, testing, production and sales, rewarding technological contributions, opening production infrastructure and offering low-interest financing. It will also double its supplier payment-support fund to 100 billion won. Yonhap News Agency