Oct 20, 2026 Why Physical AI Is So Hard To Engineer Physical AI is transforming robotics, vehicles, and industrial automation by combining sensing, real-time computing, and autonomous control. Engineers must prioritize safety, reliability, hardware-software co-design, and upgradeable architectures to enable widespread deployment. Semiconductor Engineering

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

NVIDIA Reportedly Pushes TSMC 3nm NVHBM Base Dies for Samsung, SK hynix, Micron, Uniting Foundry Rivals NVIDIA is urging Samsung, SK hynix and Micron to use TSMC's 3nm process for NVHBM base dies to standardize performance. Samsung is validating its 2nm process as a backup amid tight capacity and yield gaps. TrendForce

5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing Study examines how EtherCAT-networked automation enables high-speed sorting of increasingly small and fragile semiconductor dies. The equipment combines micron-level motion accuracy, gentle handling, inline testing, flexible packaging formats and production-scale throughput. Technical Paper

Sponsor A Hybrid PLP Technology Based On A 650 X 650 mm Platform Multiple fan-out wafers or subpanels are assembled on a carrier panel with reduced cost in the RDL process. Read more. Amkor Technology, Inc.

Intel Claims Industry's Only High-Volume 300mm InP Silicon Photonics Capability as CPO Gains Momentum Intel is scaling 300mm indium phosphide silicon photonics for AI and HPC optical interconnects as NVIDIA, Broadcom and TSMC advance co-packaged optics. Testing speed and cost remain key hurdles to mass production and broader adoption. TrendForce

Video Interview: Applied Materials CEO on the Economics Behind Its $5B EPIC Bet Applied Materials unveiled its $5 billion EPIC Center to accelerate semiconductor innovation through industry collaboration. The company targets increased market share, stronger service revenue, and expanded R&D capacity by 2030, driven by AI demand and co-innovation. EE Times

Sponsor Convenient Desktop Plasma System The PE-100 utilizes a capacitive parallel plate design for the most effective plasma generation available. Our systems offer uniform plasma with a low environmental impact at a great value. Plasma Etch

Technical Papers ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing MORE TECHNICAL PAPERS

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

Scientists create lead-free ferroelectric vortices directly on silicon HZB researchers demonstrated stable polar vortices in lead-free barium and strontium titanate superlattices grown on silicon. The advance could enable compact, electrically controllable ferroelectric devices & expand integration of complex materials into semiconductor technologies. Nanowerk

Shipments of AI servers expected to grow: TrendForce TrendForce expects global AI server shipments to rise 32.2% to 2.82 million units this year. Major cloud providers will drive market value to $920 billion next year, while nine leading providers' combined capital expenditure exceeds $1.5 trillion. Taipei Times

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Qualcomm Wins Key Claims Against Arm, but Damages Total Just $2 A U.S. jury found Arm breached its licensing agreement with Qualcomm and interfered with its custom Oryon CPUs commercialization. The verdict protects Qualcomm's chip business, while a judge considers suspending royalty payments to Arm for five years. EE Times

Google says it can build data centers the right way. Some experts and residents are skeptical Google plans to fund 1,400 megawatts of wind, 200 megawatts of solar, and 300 megawatts of battery storage for its Minnesota data center, aiming to reduce environmental concerns, strengthen Xcel Energy’s grid, and advance its 2030 carbon-free energy goal. CNBC

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

From Macro to Micro, and Back This year's Nobel prizes highlight how small components shape complex systems, inspiring AI-driven chip design that bridges abstraction layers. By predicting system-wide effects and identifying optimal low-level choices, AI could improve chip performance, and design verification. EE Times

Amkor Korea commences expansion of Gwangju semiconductor facility Amkor has begun construction of a 3 trillion won advanced chip packaging facility in Gwangju, South Korea, targeting AI and high-performance computing markets. The project aims to create 2,000 jobs, with production starting in 2027. Global Sources

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

TSMC-Fueled Power Demand... Taiwan's Semiconductor Industry to Use Twice as Much in 10 Years Taiwan's semiconductor-related electricity consumption is projected to more than double to 110 billion kWh by 2035, reaching 30% of national demand. Expanding advanced chip manufacturing and AI servers will intensify pressure to secure reliable, affordable power supplies. The Asia Business Daily

Sponsor Medical Grade, Dual Curable Adhesive Master Bond LED415DC90Med is a dual cure adhesive designed for high-speed manufacturing of medical electronic devices. Master Bond

Scaling Advanced Packaging: Why It Matters AI demand is boosting advanced packaging and thermal compression bonding equipment sales, but supply constraints, worker shortages and production complexity limit expansion. Manufacturers must standardize processes, train workers and improve readiness to scale. 3D InCites