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What Year Was It?
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The day was Aug 14. What year was it?
Blackout Hits Northeast United States
A major outage knocked out power across the eastern US and parts of Canada. 21 power plants shut down in just three minutes. Fifty million people were affected, including residents of New York, Cleveland, Detroit, Toronto and Ottawa.
See the answer below.
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What Year Was It Answer
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Blackout Hits Northeast United States
Answer: August 14, 2003
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August 17, 2026
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Common Earth Project Aims to End Chip Supply Chain Bottlenecks
University of Michigan researchers and Imec are launching "Common Earth" to strengthen semiconductor supply chains. The project targets alternatives to scarce materials and PFAS chemicals, reducing geopolitical, environmental and social risks to chip production.
IEEE Spectrum
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1 of 10 Applications: Eutectic Bonding
Swiss made Tresky die bonders can be fitted with temperature controlled chucks and protective gas suited to eutectic die bonding of chips with AuSn bumps for opto-electronic components.
Dr. Tresky AG
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SMIC lifts prices due to AI demand
SMIC raised prices for high-demand wafer capacity as AI demand boosted orders, lifting second-quarter revenue above $3 billion and profit to $479.2 million. The Chinese foundry expects continued AI-driven growth, higher shipments, and expanded capacity in the second half.
Taipei Times
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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
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Intel at a Memory Crossroads, Again
Intel is exploring new memory architectures as AI reshapes demand and shortages persist. CEO Lip-Bu Tan has highlighted stacked DRAM and advanced packaging, while initiatives such as XBM and ZAM could revive Intel’s memory ambitions.
EE Times
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OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
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No more cartridge exchanges
The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more.
xyztec
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Semiconductor Equipment Shifts To Build-to-Print Manufacturing
Semiconductor fabs are pushing equipment demand beyond OEM capacity, making build-to-print partners vital. Contract manufacturers help OEMs scale, preserve capital and design control, and support global fab expansion without costly new facilities.
EE Times
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Chip Industry Week In Review
AI infrastructure is evolving as smaller models cut compute needs, while optical interconnects, chiplets and advanced cooling enable larger systems. Companies are pouring billions into chips, packaging, quantum computing and workforce development.
Semiconductor Engineering
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SMIC weighs more capacity as AI-related chip demand exceeds forecasts
China's SMIC plans to add equipment as AI-driven demand pushes mature-node chip orders beyond forecasts. Capacity utilization reached 93.7%, while second-quarter revenue jumped 36.1% year over year to $3.01 billion, prompting further expansion and potential price increases.
South China Morning Post
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Plasma Treatment Before Anything Else
Optimize PCB and advanced packaging performance with cutting-edge plasma surface activation and precision cleaning. Boost adhesion and yield. Learn more!
Nordson Electronics Solutions
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Half-trillion Nvidia chip financing threatens China AI ambitions
Nvidia's $500 billion financing push could cement its AI dominance while pressuring Chinese chipmakers. Critics warn debt-fueled growth could spur overcapacity, financial risks and scrutiny as US-China tensions reshape data center supply chains.
Asia Times
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Rochester region sees semiconductor growth from CHIPS Act investments
Four years after the CHIPS Act, Upstate New York has secured billions in semiconductor investments, creating jobs and strengthening supply chains. Edwards Vacuum, NY SMART I-Corridor and Rochester's STELLAR Engine advance manufacturing, research and workforce development.
Rochester Business Journal
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Vertical Integration Becoming Pervasive
AI workloads are driving teams to design silicon around specific tasks, tightening hardware-software collaboration. Custom ASICs, RISC-V processors and heterogeneous architectures can boost performance, power efficiency and flexibility at scale.
Semiconductor Engineering
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Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
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| Today's Sponsor |
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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Test Your Knowledge
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In 2002, 30% of the cars sold were what type of vehicle?
See answer below.
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Quote of the Day
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"Nothing works better than just improving your product."
Joel Spolsky, Stack Overflow co-founder
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| Cartoon of the Day
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"Our asking price is $699,000. Our begging price is $58,000."
Copyright © Randy Glasbergen
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Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
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Test Your Knowledge Answer
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In 2002, 30% of the cars sold were what type of vehicle? Answer:
SUV's
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