Oct 7, 2026 Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations Imec is advancing CFETs beyond GAA nanosheets for A3 nodes, stacking transistors to extend scaling. Its split-gate sCFET architecture boosts design flexibility, SRAM density and BEOL routability, supporting angström-era logic manufacturing. Semiconductor Engineering

Sponsor 1 of 10 Applications: Copper Pillar For flip chips with very small geometries, copper pillar technology is favored. Swiss made die bonders from Tresky handle these demanding applications with bravura. Dr. Tresky AG

JEDEC Unveils First Industry-Wide Silicon Photonics Reliability Standard, Setting Rules Across Four Key Areas JEDEC's JESD264 sets the first industry-wide reliability standard for silicon photonics, covering SiPh devices, components, assembly, laser integration and process control as Intel, TSMC and Samsung accelerate CPO and optical connectivity efforts. TrendForce

Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies This paper explores how hybrid and fusion wafer bonding have become foundational technologies in enabling both "More than Moore" heterogeneous integration and "More Moore" transistor scaling, and recent advancements driving future architectures. Technical Paper

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

AMD's Lisa Su Visits TSMC, AI Supply Chain Partners as Company Locks In Capacity 3–5 Years Ahead AMD CEO Lisa Su says the company will sharply expand AI chip supply in 2027 as demand outpaces capacity. AMD is extending Taiwan partnerships, boosting CoWoS and other packaging, and securing wafer, substrate and memory capacity worldwide. TrendForce

The AI Boom Has a Gigawatt Accounting Problem AI infrastructure commitments are soaring, but gigawatt targets can mask deployment limits. Semiconductor, memory, networking, cooling and power constraints, plus long construction and equipment lead times, can delay usable computing capacity. EE Times

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Technical Papers ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor MORE TECHNICAL PAPERS

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

AMD to 'substantially' up capacity: CEO AMD CEO Lisa Su says the company will expand supply through Taiwan’s semiconductor ecosystem in 2027 as AI chip demand outpaces capacity. AMD will deepen partnerships in advanced packaging, substrates and manufacturing to support growth. Taipei Times

Ten indicted for smuggling chips, fraud Taiwanese prosecutors indicted 10 people for allegedly using forged documents to smuggle controlled US-made chips to China and Hong Kong. The scheme disguised chip origins, generated NT$360 million in illicit profits, and potentially strengthened China’s military capabilities. Taipei Times

Sponsor Enabling A Chiplet Supply Chain Chiplet-based architectures are gaining popularity for their smaller die sizes and better yields, but challenges in power management, security, and supply chain complexity remain. Download now. Amkor Technology, Inc.

Overlooked crystal phase enables wafer-scale logic transistors POSTECH and KAIST researchers developed wafer-scale κ-phase In₂Se₃ transistors with low memory effects, high mobility and uniform switching. A low-temperature process enables 3D integration, while complementary inverters support advanced logic. Nanowerk

Can Embedded Passives Fix AI's Power Delivery Problem? Saras Micro Devices is embedding capacitors and inductors in AI chip package substrates with its STILE technology. The approach cuts power losses, improves voltage regulation and enables vertical power delivery, boosting AI system efficiency. 3D Incites

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

As China's AI race accelerates, 'model fatigue' becomes the next challenge China's AI sector faces model fatigue as rapid releases trigger price wars and overwhelm developers. Companies are shifting toward lower costs, specialized applications and ecosystem integration, but must deliver meaningful gains to sustain demand. South China Morning Post

Nvidia-backed Reflection AI challenges Chinese dominance in open-weight models Reflection AI launched Beam, an open-weight model aimed at challenging China's lead in open AI. Backed by Nvidia, Beam activates fewer parameters to cut inference costs while competing with Chinese models in coding, reasoning and agentic tasks. South China Morning Post

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

Samsung Electro-Mechanics wins 290 bln-won AI server capacitor supply deal in U.S. Samsung Electro-Mechanics has secured a 290 billion-won contract to supply MLCCs for AI servers through 2027. The deal marks its sixth long-term agreement this year, strengthening its leading position in the rapidly expanding global AI server MLCC market. Yonhap News Agency

Sponsor Void-Free Pressure Curing with Ultra Clean Results Trusted for bond integrity in optical modules and 3D packaging. Achieve void-free curing results in an oxygen-controlled, contamination-free atmosphere. Heller Industries

Extreme Environments Push Chips To Their Breaking Point AI-driven chip design is expanding into extreme environments as radiation, thermal shock and cryogenic conditions challenge electronics. Space, defense, quantum computing and particle physics are driving demand for radiation-hardened designs, simulations and physical validation. Semiconductor Engineering