February 23, 2026

Laser Arrays May Simplify Co-Packaged Optics Lightmatter & partners are advancing co-packaged optics (CPO), integrating photonic & electronic ICs closer together while keeping lasers in pluggable modules for reliability. Monolithic, software-programmable laser arrays simplify alignment, boost efficiency & reduce energy in data systems. Semiconductor Engineering

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

VIEWPOINT 2026: Thomas Sonderman, CEO, SkyWater Technology Advanced packaging is no longer a supporting act in semiconductor innovation. Performance gains are not coming from smaller nodes or faster clock speeds alone; they must now be unlocked through intelligent integration of advanced packaging processes into chip design from the start. In 2026, packaging firmly shifts ... SkyWater Technology

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

Outsourced Semiconductor Assembly and Test (OSAT) Market Trends Shaping AI, Automotive, and 5G Chips | DataM Intelligence OSAT market is rapidly growing, driven by rising demand for advanced, high-performance chips. OSAT providers help semiconductor firms cut costs, accelerate innovation, and scale packaging and testing, with Asia-Pacific leading global expansion. Open PR

Chip Industry Week in Review Intel and Google patched flaws in Intel's Trust Domain Extensions after stress tests exposed risks to VMs and sensitive data. Niobium and Semifive advance a homomorphic encryption accelerator, while Hardwear.io and IISS warn AI-driven threats are outpacing defenses. Semiconductor Engineering

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Large Capacity Plasma Treatment System - FlexTRAK-SHS 9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging. Nordson Electronics Solutions

Hon Hai, HCL break ground on NT$13.1 billion chip plant in India Hon Hai Technology Group and India's HCL Group broke ground on their NT$13.1 billion (US$403 million) joint-venture OSAT facility in Greater Noida. India Chip Pvt Ltd will produce 20,000 display driver IC wafers monthly, aiming for 2028 operations. Taipei Times

AI Data Centers Turn to High-Temperature Superconductors AI data centers are straining global power grids, prompting hyperscalers like Microsoft, AWS, and Google Cloud to explore high-temp superconductors. These cryogenically cooled cables reduce resistive losses, increase efficiency, and enable compact, high-capacity power delivery. IEEE Spectrum

Sponsor Non-Contact Solder Jetting for Precision SB²® eliminates mechanical placement force, enabling stable solder balling for MEMS, fine-pitch, and advanced packaging applications. Explore the process. PacTech

OpenAI resets spending expectations, tells investors compute target is around $600 billion by 2030 OpenAI is now targeting $600 billion in compute spend by 2030, down from earlier $1.4 trillion plans, aligning infrastructure investments with projected $280 billion revenue. The company prepares a $100 billion funding round, with Nvidia, SoftBank, and Amazon backing it. CNBC

Nvidia reduces OpenAI plan to US$30 billion Nvidia plans to invest US$30 billion in OpenAI, scaling back from an earlier US$100 billion proposal, the Financial Times reported. CEO Jensen Huang affirmed the deal, calling OpenAI "one of the most consequential companies of our time." Taipei Times

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology, Inc.

The On-Device LLM Revolution The AI industry is shifting from cloud-centric GPUs to edge devices, running "Goldilocks" models (3B–30B parameters) locally. Edge AI demands real-time performance, power efficiency, and programmable silicon, challenging designers to deliver GPT-4-class results sustainably. Semiconductor Engineering

Chips Act spurs semiconductor investments in Europe Europe is boosting its semiconductor ecosystem ahead of the European Chips Act revision, mobilizing over €80 billion in investments. Malta and other member states attract private and public funding, driving chip design, pilot lines, and advanced manufacturing to compete globally. Science Business

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Did you know Ajinomoto and toilet maker Toto power the AI we use? Some of AI's most critical enablers come from unexpected industries. Japanese firms like Ajinomoto, maker of MSG, supply essential semiconductor substrates, while TOTO provides ultra-pure ceramics—both crucial for chips powering AI, data centers, and gaming GPUs. India Today

Sponsor FSO Hermetic Package HDHS® Technology Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination. MicroCircuit Laboratories, LLC