Sep 3, 2026 Advanced Packaging: The Foundation of Next-Generation Semiconductor Innovation Semiconductor scaling is moving beyond transistor density as advanced packaging drives performance. Heterogeneous integration, hybrid bonding, substrates, power delivery, cooling and yield increasingly shape how compute and memory work together. 3D Incites

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TSMC says unable to keep pace with AI boom despite fivefold expansion TSMC is accelerating global expansion, building 25 fabs and packaging facilities this year amid surging AI demand. Industry leaders warn of persistent capacity constraints, urging international production, stronger supply-chain collaboration & broader semiconductor ecosystem investment. Taipei Times

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

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Extending 18A With Significant Power And Performance Gains Intel Foundry's Intel 18A-P process delivers over 9% higher performance at the same power or 18% lower power at equal performance. New RibbonFET devices, Power Boost, interconnect improvements and DTCO enhance efficiency for AI, mobile and data-center workloads. Semiconductor Engineering

Google Says Memory Tops 75% of Server BOM; TPU-Software Dual Strategy Targets Memory Wall Google says AI is becoming memory-bound as multimodal and MoE models grow. At SEMICON Taiwan, it outlined TPU 8i and 8t plus TurboQuant to cut memory demands, while soaring DRAM and NAND costs raise infrastructure spending. TrendForce

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Technical Papers ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging ■ Revolutionizing IC Packaging with High-Density RDL Technology MORE TECHNICAL PAPERS

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China's DUV Could Reach High-Volume Production in 2–5 Years; EUV Reportedly Unlikely Within a Decade China is advancing homegrown chipmaking equipment, with UBS estimating it could reach high-volume immersion DUV production within five years but remain a decade or more from EUV. Rising patents and domestic demand signal steady progress toward self-sufficiency. TrendForce

Broadcom delivers strong earnings view as CEO touts growth with AI labs Broadcom projects AI revenue will double to $115 billion in fiscal 2027, driven by rising demand from Google, OpenAI, Anthropic and Meta. The chipmaker also reported 86% quarterly revenue growth and more than tripled net income. CNBC

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies

The age of quantum Fujitsu showcased a 64-qubit superconducting quantum computer at Semicon Taiwan in Taipei, drawing visitors' attention. The display highlighted the company's advances in quantum computing and underscored growing industry interest in next-generation computing technologies. Taipei Times

TSMC to develop site in Baipu park TSMC plans a 3-hectare advanced packaging hub in Kaohsiung to accelerate materials and equipment validation, boost R&D, train talent and connect suppliers globally. AI demand drives capacity growth, while Taiwan's semiconductor revenue is projected to approach US$300 billion. Taipei Times

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AI Efficiency Could Cost Us the Next Generation of Experts AI automation can weaken human expertise by removing the junior tasks that build experience. Lessons from nuclear controls and aviation show why organizations must preserve hands-on practice to maintain skills and respond effectively when automated systems fail. IEEE Spectrum

China's No 2 foundry Hua Hong invests US$2b in new fab to meet surging AI-driven demand Hua Hong plans to invest US$2 billion in a new 12-inch specialty fab in Wuxi, adding 55,000 wafers monthly as China's AI demand surges. The expansion strengthens domestic chip capacity while helping offset US technology restrictions. South China Morning Post

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China's AMEC unveils 6 chip-making machines in a day, boosting self-reliance ambitions AMEC unveiled six semiconductor equipment tools as it expands into deposition and silicon-carbide manufacturing. The Chinese maker is ramping R&D, capacity and acquisitions to meet rising domestic demand and boost semiconductor self-sufficiency. South China Morning Post

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Security Sign-Off Is Coming For Chips — But Standards May Not Be Enough Intel Foundry's Intel 18A-P boosts performance by over 9% at the same power and cuts power by more than 18% at matched performance. New RibbonFET devices, Power Boost, improved interconnects, and DTCO enhance efficiency across AI, mobile, and data-center applications. Semiconductor Engineering