February 5, 2026

Why Move To 2nm? As 2nm nodes arrive, chipmakers are rethinking scaling by using chiplets and advanced packaging to balance power, performance, and cost for AI-driven workloads, trading monolithic designs for flexible, multi-die systems optimized across nodes, regions, and constraints. Semiconductor Engineering

Sponsor 6 Common Mistakes of BGA Rework BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ... Circuit Technology Center

VIEWPOINT 2026: Ramachandran "Ram" K. Trichur , Global Market Segment Head, Henkel The semiconductor packaging growth story continues to be written by the demanding, complex requirements of AI and high-performance computing (HPC) in the cloud and at the edge. The automotive sector, which is expected to rebound after recent challenges, is also driving innovation through advanced ... Henkel

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications. Technical Paper

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

IBM, Synopsys Move Toward 1.4-nm Node with Heat-Modeling Tech IBM is pushing toward the 1.4-nm chip node using new thermal modeling technology developed with Synopsys and DARPA support. The ML-powered tool predicts atomic-level heat with high speed and accuracy, optimizing chip performance for AI, 3D-ICs, and advanced packaging. EE Times

HBM Expert Says Korea–China Memory Gap Exceeds 5 Years and May Even Widen Amid EUV Constraints China is not closing the gap with South Korea's memory giants, a veteran says. Former SK hynix DRAM leader Shim Dae-yong argues the gap is underestimated and exceeds five years, constrained by EUV access, yields, materials and co-development limits. TrendForce

Sponsor Buy Ceramic Dispensing Needles Online Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online. DL Technology

Technical Papers Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG MORE TECHNICAL PAPERS

Sponsor IMAPS Device Packaging Conference Explore the latest emerging technologies and applications that are driving advancements in semiconductor packaging. March 2-5 in Phoenix, AZ. IMAPS

AMD 1Q Sales to Slip Despite $100M MI308 China Boost, Next-Gen AI Chips Set for 2H Ramp AMD struck a cautious tone as the AI boom rages. It forecast Q1 revenue of about $9.8B, down sequentially despite a one-off China boost from MI308 chips, trailing Nvidia's guidance while CPUs carry near-term growth risk for investors in early 2026. TrendForce

Broadcom, Nvidia shares rise on surging Google capital expenditures for AI Broadcom shares surged 6% after Google reported earnings and revealed plans to nearly double its capital expenditures to $185 billion, boosting AI data center growth. Broadcom's custom chips, including Google's TPUs, stand to benefit from hyperscaler demand. CNBC

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

Qualcomm stock sinks as memory shortage drags on forecast Qualcomm's first-quarter earnings beat expectations, but its forecast fell short due to a global memory shortage. Executives warned the shortage is limiting smartphone production, pushing customers toward premium devices, and shaping the broader mobile market. CNBC

What TI's Acquisition of Silicon Labs Stands For? Texas Instruments is acquiring Silicon Laboratories for $7.5 billion, aiming to strengthen its embedded processing and IoT edge AI capabilities. The deal adds Silicon Labs' wireless, security-focused processors and AI-enabled SDKs, boosting TI's IoT, industrial, and consumer solutions. EE Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Google parent beats on revenue, projects significant AI spending increase Alphabet topped fourth-quarter estimates but projected a massive AI spending surge, forecasting $175–$185 billion in 2026 capex. Shares slipped as investors weighed rising costs against strong growth in cloud, advertising, and Gemini AI adoption. CNBC

China's chip champion Moore Threads sees beyond silicon with push into AI coding Moore Threads launched an AI coding platform built on its MTT S5000 GPU, expanding beyond chips into developer software. The move pits the Chinese firm against Microsoft, Alibaba and others as domestic AI tools gain momentum. South China Morning Post

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Changes In Chip Architectures At The Edge Edge computing prioritizes low latency, tight power budgets, and efficient performance over raw throughput. Quadric CTO Nigel Drego explains how combining diverse processing elements enables flexible, powerful edge AI systems that can adapt quickly as algorithms change. Semiconductor Engineering

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies