Oct 29, 2026 How Much Can Semiconductor Models Hide? Engineers are developing encrypted, reduced-order and surrogate models that let advanced packaging companies share predictive data while protecting proprietary processes. These models preserve material behavior and deliver reliable real-world predictions. Semiconductor Engineering

Sponsor Gold Mitigation: What Engineers Need to Know When gold-plated component surfaces enter the solder joint, reliability can be at risk. This technical paper examines gold removal, robotic hot solder dip processing, testing, and process control. Circuit Technology Center

Intel Wants a Quantum Business, Classiq Could Help Build One Intel plans to acquire Classiq to bring its quantum computing research to market, combining quantum hardware, control electronics and software with enterprise algorithm design. The deal positions Intel to pursue commercial opportunities across diverse quantum platforms. EE Times

The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging This paper examines advanced flip chip bonding technologies—LAB, R-LAB, and R-LTC—for AI and HPC packaging, demonstrating improved interconnect quality, warpage management, scalability, and reliability for next-generation chiplet-based semiconductor systems. Technical Paper

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

Samsung Electronics shares slid despite record profit in the third-quarter Samsung Electronics posted record quarterly revenue and profit as AI demand boosted HBM4 and server SSD sales. Despite strong earnings and shareholder returns, shares fell 4.13%, signaling investor concerns over reliance on memory chips. CNBC

Canadian Startup Aims to Be Quantum's 'Picks' and 'Shovels' Canadian startup Meissner Technologies uses AI-driven simulations and laboratory testing to discover superconducting materials for quantum computing detectors. Its innovations could reduce cooling costs, address helium shortages and& advance autonomous materials research. EE Times

Sponsor Maximize Photonic Coupling Efficiency Tresky's Active Alignment combines real-time optical feedback, multi-axis positioning and nanometer precision for photonics and advanced packaging. Tresky

Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor High-Speed Mass Ball Transfer With Ultra-SB²® Ultra-SB²® enables ultra-fast, precise mass solder ball transfer—ideal for advanced packaging and high-throughput semiconductor assembly. Explore Now. PacTech

SK Hynix Reports Record Q3 Results Driven by AI Memory Surge SK Hynix achieved record third-quarter revenue and operating profit as soaring memory prices fueled earnings. The company forecast shortages through 2030, secured long-term supply agreements & expanded shareholder returns while discontinuing its planned Solidigm IPO review. EE Times

Macronix reports record profit in Q3 Macronix reported record third-quarter net profit of NT$10.95 billion, driven by soaring margins and strong AI memory demand. The company expects further price increases, plans NAND capacity expansion in 2027, and targets high-growth memory markets. Taipei Times

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C. Ormet® TLPS

AI revenue to reach US$300m this year, UMC says UMC plans to invest an additional US$3.2 billion to expand AI-related chip, silicon photonics and advanced packaging capacity, targeting 25% AI revenue by 2029. The company also expects higher selling prices and sustained growth next year. Taipei Times

Full-Stack Semiconductor Solutions for Embodied AI & Robotics NSING Technologies details its full-stack semiconductor solutions for embodied AI and robotics, integrating MCUs, security ICs, wireless connectivity and battery management. Its whitepaper covers distributed architectures, robotic applications and EU Cyber Resilience Act compliance. EE Times

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

China's First 12-Inch Polycrystalline Silicon Carbide Substrate Unveiled Hunan Titan Future Technology has developed China's first 12-inch polycrystalline silicon carbide substrate, targeting AI chip cooling and advanced packaging. With thermal conductivity above 280 W/(m·K), the product has completed validation by leading companies. TrendForce

Elon Musk, Jensen Huang have opposing outlooks on AI neoclouds. Who is likely correct? Elon Musk warns that mounting debt could trigger widespread neocloud failures, while Nvidia's Jensen Huang remains confident in strong AI demand. Rising financing costs, delayed revenues and massive infrastructure investments intensify concerns about a potential global AI bubble. South China Morning Post

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

Google alters its cloud playbook, enlisting partners to sell more AI chips Google is expanding its AI chip business by partnering with Oracle to offer TPUs externally, challenging Nvidia's dominance. Strong demand from Anthropic and OpenAI could boost revenue, although lower margins and infrastructure demands pose challenges for future growth. CNBC

Sponsor Oxide Reduction for Reliable Power Electronics Manufacturing As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in power electronics production. Download here. Plasmatreat GmbH

SK hynix logs record profit in Q3 on AI chip supercycle SK hynix achieved record third-quarter revenue and operating profit as AI-driven memory demand surged. The company announced over 100 trillion won in shareholder returns for 2026, with HBM production capacity largely sold out through 2029. Yonhap News Agency