April 17, 2026

Chiplet Standards Aim For Plug-n-Play Industry groups push chiplet standards to enable interoperable, off-the-shelf components. Efforts like UCIe, BoW, and OCP define interfaces and compliance, unifying ecosystems from interconnects to software for modular computing. Semiconductor Engineering

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TSMC first-quarter profit rises 58%, beats estimates as AI demand fuels record run TSMC reported a 58% surge in first-quarter profit, driven by strong AI chip demand, beating estimates and hitting record revenue. It forecast robust 2026 growth, raised capital spending, and expanded capacity while signaling resilient supply chains amid global concerns. CNBC

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

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Breakthrough Thin GaN Chiplet Technology Researchers at Intel Foundry demonstrated a gallium nitride (GaN) chiplet on 300 mm GaN-on-silicon wafers at IEDM 2025, advancing compact high-performance computing. They integrated ultra-thin 19 μm silicon and monolithic digital control circuits to boost power, speed & efficiency. Semiconductor Engineering

Musk asks suppliers to move at 'light speed' on Terafab project Elon Musk's team contacts major chip equipment suppliers for his planned Terafab, seeking rapid quotes and capacity. The ambitious project aims to build massive AI chip production, despite industry skepticism, targeting pilot manufacturing by 2029 and challenging TSMC. Taipei Times

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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TSMC projects over 30% sales growth TSMC raised its revenue growth forecast above 30% this year, citing surging AI chip demand, increased capital spending to US$56 billion, and global 3nm expansion, while reporting record profits and strong outlook driven by cloud service provider orders. Taipei Times

Quantum stocks on pace for a massive week after Nvidia debuts AI models to boost the tech Quantum stocks surged this week as Nvidia unveiled its Ising open-source AI models to accelerate quantum computing. IonQ jumped over 50%, while D-Wave and Rigetti rose more than 30%, driven by optimism around AI-enabled error correction and scaling breakthroughs. CNBC

Sponsor Get the Revisiting Underfill Handbook Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook. Nordson Electronics Solutions

TSMC and ASML post-earnings stock moves could be a sign of what's to come from chip companies TSMC and ASML reported strong earnings driven by surging AI chip demand, with TSMC posting a 58% profit jump and record results, yet both stocks fell as Wall Street's high expectations and concerns over future growth overshadowed solid performance. CNBC

Panel-Level Packaging's Second Wave Meets Engineering Reality Semiconductor makers accelerate shift from wafer to rectangular panel packaging as AI and HPC chips grow larger and cost pressures intensify, but glass brittleness, thermal stress, and microcracks force co-engineered material and process innovations to secure yield and reliability. Semiconductor Engineering

Sponsor Hermetic Microelectronic Package Seam Seal Technical paper on technology that delivers a pristine internal atmosphere for hi-rel microelectronic components. Process automation, including AI, and standard tooling utilized in die and wire bonding is standard. MicroCircuit Laboratories, LLC

Advancing Autonomous Fabs Semiconductor manufacturers push toward autonomous fabs as rising process complexity, costly equipment, and tighter stability demands accelerate automated preventive maintenance. New 2025 research also exposes persistent gaps in technology integration and standards. Semiconductor Engineering

The Thermal and Power Realities of the AI Era AI's rapid expansion is driving unprecedented energy demand, pushing data centers toward chiplets, 3D stacking, and advanced packaging. Engineers confront steep thermal and power challenges, spurring industry collaboration via SEMI's APHI coalition to boost efficiency. Semiconductor Engineering

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ASE to buy Innolux Tainan plant to boost semiconductor packaging capacity ASE will invest NT$14.85-billion to acquire Innolux's Southern Taiwan Science Park fab, expanding advanced semiconductor packaging for AI and high-performance computing. The company is also investing in new plants, hiring staff and strengthening Kaohsiung as a hub. Taiwan News

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura