April 22, 2026

Intel-Backed Firm Breaks Ground on India's 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually Intel expands advanced packaging as its backed 3D Glass Solutions breaks ground on India's first 3D chip packaging plant in Odisha. The integrated site will make glass substrates, assembled units and 3D modules for AI, HPC, defense and automotive, as India seeks more chip investment. TrendForce

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

SK hynix Reportedly Breaks Ground on First U.S. Advanced Packaging Plant in Indiana, Eyes 2H28 Production SK hynix breaks ground on its first U.S. fab in Indiana, targeting 2028 production of next-gen AI memory like HBM4E and HBM5. It ramps advanced packaging and DRAM capacity at home, investing heavily and adding EUV tools to boost output and meet rising AI demand. TrendForce

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Technical Paper

Sponsor Turnkey Electroless Plating Solutions PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success. PacTech

Apple's elevation of silicon head Johny Srouji signals sprint to build in-house chips for all devices Apple named John Ternus CEO and promoted Johny Srouji to chief hardware engineer, strengthening its in-house silicon strategy. The move advances custom chip development for iPhones and Macs, boosting integration, AI capabilities & reduced reliance on external suppliers. CNBC

Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging Semiconductor manufacturing shifts to chiplets and heterogeneous integration, using wet processing, electrochemical plating, PECVD, and panel-level packaging to boost precision, scalability, and sustainability while meeting AI, 5G, and HPC demand and replacing legacy tools. 3DInCites

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Apple Eyes Product Engineering Revival with CEO Transition Apple replaces Tim Cook with hardware chief John Ternus as CEO on Sept 1, shifting leadership toward product innovation. Cook becomes executive chairman. Ternus must advance Apple silicon success and revive AI efforts including Siri amid rising competition. EE Times

The OSAT Explosion: Why CG Semi and Kaynes are the Real Architects of India's Chip Independence India's semiconductor industry shifts in 2026 as firms expand beyond design into manufacturing. In Gujarat's Sanand region, companies like CG Semi and Kaynes Semicon build OSAT and ATMP facilities, strengthening infrastructure for 'Made in India' chips powering global electronics. BISinfotech

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.

The Changing ASICs Landscape: the Shift Toward Chip Disaggregation AI reshapes ASIC design toward system-specific, modular, disaggregated architectures. Advanced packaging and multi-die integration optimize performance via cross-domain collaboration, but raise verification complexity, driving reusable IP, co-design, and partnerships. EE Times

Research Bits: Apr. 21 Researchers build edge AI by mapping models onto memristor crossbars and demonstrating neuromorphic designs. Advances in ultra-thin memory and brain-inspired nickelates enable low-power computing and better signal processing. Semiconductor Engineering

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Apple incoming CEO John Ternus faces a defining challenge: Fixing the company's AI strategy Apple names hardware chief John Ternus CEO as Tim Cook steps down, pushing investors to demand a clearer AI strategy. The company lags rivals in generative AI, relying on partners while betting on integrated devices and future AI hardware. CNBC

Hong Kong can advance AI beyond the confines of geopolitical rivalry Analysts argue global AI is not just US–China rivalry but a multipolar system where middle powers shape outcomes. Hong Kong can position itself as a responsible governance hub, leveraging its legal system, education links, and regional partnerships. South China Morning Post

Sponsor Low Pressure Plasma for Electronics Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production. Plasmatreat

The Global Semiconductor Talent Shortage Semiconductor shortages drive major US and EU investments like the CHIPS Act to expand production and talent pipelines. As the industry heads toward $1 trillion by 2030, companies and governments race to address a growing global skills shortage. Deloitte

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation