March 6, 2026

3D Stack: Mastering ESD Verification In Advanced Semiconductor Design Electrostatic discharge (ESD) verification plays a critical role in protecting semiconductor designs from sudden failure. As chips move into complex 3D stacks, engineers must adopt advanced verification techniques to manage rising design complexity and prevent electrostatic damage. Semiconductor Engineering

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VIEWPOINT 2026: Tom Solon, P.E., Director of Sales, RH Murphy Co. 2025 was a good year for RH Murphy Company and we look forward with guarded optimism to 2026. New automation equipment and staff are being added to support growth and customer needs. Demand for JEDEC matrix trays, waffle pack chip trays, test carriers and custom ESD trays grow steadily along with the connectivity ... RH Murphy Co.

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Intel CFO sees strong AI server chip demand Intel CFO Dave Zinsner said strong demand for server processors—driven by booming AI infrastructure—continues to outpace supply. Factory and industrywide chip shortages keep Intel running above capacity, though constraints should gradually ease while growth persists this year. Tech in Asia

Memory squeeze to continue into next year: Adata Adata Technology expects memory chip supply constraints to persist into next year, driving further DRAM and NAND price gains. Rising AI-driven demand for enterprise SSDs and low vendor inventories tighten supply, boosting Adata's sales and revenue outlook. Taipei Times

Sponsor Analytical Solutions Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions. Balazs Nanoanalysis

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

At MWC, Intel Outlines CPU-Driven Case for Telecom Networks Intel unveiled its Xeon 6 platform at MWC 2026, promoting CPUs with built-in AI acceleration as a cost- and energy-efficient alternative. The chip consolidates RAN, core, and AI inference workloads, helping operators simplify hardware and reduce power consumption. EE Times

Top chip leaders urge national drive to 'build China's ASML' amid US curbs China's semiconductor leaders urge a national effort to build a domestic alternative to ASML's EUV lithography systems, warning US sanctions expose weaknesses in China's fragmented chip sector & calling for coordinated investment, consolidation & technology development before 2030. South China Morning Post

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Power, Not Area: Why Edge GPU Design Is Entering A New Era Semiconductor scaling below 2nm is shifting GPU design priorities from transistor density to heat and power management. Rising thermal density forces lower voltages and frequencies, pushing architects toward energy-efficient parallelism, and selective chiplet use. Semiconductor Engineering

Auto Security Accelerates With Standardization And Certified Silicon Automakers are strengthening cybersecurity as software-defined vehicles grow more connected. New standards, encrypted networks and secure chips are reshaping design while automakers and chip firms work together to protect vehicle systems, data and passengers. Semiconductor Engineering

Sponsor 100+ Breakthrough Repair/Rework Guides Illustrated and Online Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards. Circuit Technology Center

The New Design Advantage: Why Unifying Processing And Connectivity Simplifies The Design Experience Mixed-signal advances integrate wireless connectivity and microcontrollers on a single chip, simplifying system design while reducing power use and size. The approach accelerates development, strengthens IoT connectivity, and enables efficient, reliable AI-ready devices. Semiconductor Engineering

Exclusive: Allen Wu on Disrupting $100M Cost of Building Custom AI Chips Allen Wu, founder of CoreLab Technology, aims to slash the $100 million cost of designing AI chips by building an open, modular compute platform using RISC‑V International and mixed architectures, enabling customizable processors for robotics and emerging physical AI workloads. EE Times

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TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties TSMC has strengthened its role in the global semiconductor supply chain through nearly two decades of investment in advanced packaging. Guided by leaders such as Shang-Yi Chiang, the company positioned itself at the forefront of the rapidly expanding AI chip era. Digitimes

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