August 21, 2026

CFETs Forge Better Connections Chipmakers are developing CFETs, stacking p- and n-type transistors vertically to boost density, performance and efficiency. TSMC, Intel, Samsung and IBM are pursuing different designs while tackling manufacturing challenges involving connections, warpage, variability and yield. Semiconductor Engineering

Sponsor Photonics Bonder for Sub-Micron Accuracy Tresky's Photonics Bonder delivers sub-micron die placement on a granite-based T-7000 platform for VCSELs, lasers and photodiodes. Tresky

Chip Packaging Experts Flag Heat as AI's Biggest Bottleneck; AI-Driven Design, CPO and STCO May Help AI's thermal bottleneck is driving new solutions as 3D-stacked chips and memory raise heat demands. Researchers are turning to AI design automation, digital twins, CPO and STCO to optimize cooling, power use and advanced packaging. TrendForce

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor Medical Grade, Toughened Epoxy Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation. Master Bond

Michael Robbins Named President and CEO of Semiconductor Industry Association SIA names Michael Robbins president and CEO, effective Oct. 1, 2026. The former AUVSI leader will succeed John Neuffer, bringing advocacy and government experience as the semiconductor industry faces pivotal challenges in U.S. competitiveness. Semiconductor Industry Association

Intel and Memory: A History of Exits, and a New Bid to Return Intel is eyeing a new memory push after decades of mixed results with DRAM, RDRAM, NAND and Optane. Its XBM and ZAM concepts aim to boost bandwidth and density, but commercialization after 2030 will test whether Intel can regain meaningful ground. TrendForce

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Technical Papers 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems MORE TECHNICAL PAPERS

Sponsor Thermal Warpage Testing Services If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs. Akrometrix

Micron CEO: AI has 'totally changed' the equation for the boom-and-bust memory industry Micron says AI has made memory strategic infrastructure, driving sustained demand for faster, lower-power products. The company expects shortages to persist as customers seek more supply, while long-term deals support U.S. manufacturing investments. CNBC

Chinese AI chips fall short on coding, forcing firms to stretch scarce Nvidia supply Chinese AI firms are optimizing inference software to overcome shortages of high-end Nvidia chips. As token demand surges, companies are adopting heterogeneous computing, combining domestic and Nvidia processors to cut costs and expand capacity for complex AI workloads. South China Morning Post

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

Breaking the Compute Barrier with Light: Silicon Photonics, Co-Packaged Optics, and Advanced Packaging AI and HPC growth is pushing interconnects toward higher bandwidth and efficiency. As copper links hit signal and power limits, silicon photonics, advanced packaging and co-packaged optics can deliver faster, longer-reach connections at scale. 3DInCites

How Will The Custom HBM Business Work? HBM4 enables customized base dies, allowing hyperscalers to tailor memory for specific AI workloads and differentiate XPUs. This approach shifts base-die manufacturing to logic foundries while memory makers assemble stacks, optimizing interfaces, performance, and power efficiency. Semiconductor Engineering

Sponsor Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. KYZEN

Three Strategic Imperatives For Energy-Efficient AI Computing AI's rapid growth is driving data center energy use and inference costs sharply higher, making energy efficiency a strategic priority. Smarter AI systems can reduce costs, improve ROI, and enable efficient physical AI applications despite growing infrastructure demands. Semiconductor Engineering

Managing Thermal Expansion And Electromigration Through Interposer Design As scaling moves vertical, 3D and 2.5D packaging boost chip density and AI bandwidth but create thermal and reliability risks. Researchers use modeling, materials engineering, and copper structures to control warpage, stress, and electromigration. Semiconductor Engineering

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Intel may expand 2 nm chip outsourcing to TSMC Intel may expand its partnership with TSMC to include advanced 2nm chips for upcoming processors, combining its 18A technology with TSMC's N2P and potentially N2X processes. The move could boost production flexibility and demand for Taiwanese semiconductor suppliers. Taiwan News

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation