Semiconductor Packaging News

Industry Press

2021 Resist revenues to grow 6% to $2.0B and to $2.4B by 2025
TECHCET

RISC-V Functional Safety Processor IP Core
The Fraunhofer Institute

ZEISS Innovation Hub in Dresden Opens Its Doors
ZEISS

Katja Tavernaro becomes member of Executive Board and Chief Sustainability Officer
Meyer Burger Group

Yield Engineering Systems, Inc. (YES) Joins Silicon Saxony High-Tech Network
Yield Engineering Systems, Inc.

Semiconductor revenues rose 0.5% QoQ to $131.1bn in 1Q21 according to Omdia
Omdia

AQS, Inc. Selects DAGE Assure Intelligent X-ray Component Counter for Mass Production
Nordson X-ray

30 GHz Bandwidth Socket for 0.65mm pitch BGA266
Ironwood Electronics

MORE INDUSTRY PRESS

What Year Was It?

First American Woman in Space

The space shuttle Challenger is launched into space. Aboard is Dr. Sally Ride, who became the first American woman to travel into space.
The day was Jun 18. What year was it?

June 18, 2021

Fan-Out Packaging Options Grow

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking ...
Semiconductor Engineering

IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%
In this month's June Update to The McClean Report, IC Insights presented its latest forecasts for the 2021 through 2025 IC market segmented by 33 major product ...
IC Insights

Silver Epoxy Turns Black after Oxygen Plasma but so what?
Resin bleed out is common and O2 plasma cleans it up, however it turns the silver epoxy black. This paper explains why and how it can help reduce wirebond rework.
Technical Paper

U.S. senators propose 25% tax credit for semiconductor manufacturing
A bipartisan group of U.S. senators proposed a 25% tax credit for investments in semiconductor manufacturing as Congress works to increase U.S. chip production. ...
Reuters

Xi picks top lieutenant to lead chip battle versus US
Chinese President Xi Jinping is renewing his years-long push to achieve technology self-sufficiency by tapping a top deputy to shepherd a key initiative aimed at helping ...
Taipei Times

Technical Papers

Will an Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Innovations in Wire Bond Inspection

Customized Assembly Process for Hermetic Devices

CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices

Optimizing Insertion Extraction Force in a Pin-Socket Interconnect

Hermetic Package Process Development

Justifying the Purchase of Die or Wire Bonding Equipment

MORE TECHNICAL PAPERS

Xi Jinping taps top lieutenant to lead third-generation chip development in battle against US sanctions
Chinese President Xi Jinping is renewing his years-long push to achieve technology self-sufficiency by tapping a top deputy to shepherd a key initiative aimed at ...
South China Morning Post

Finding, Predicting EUV Stochastic Defects
Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet ...
Semiconductor Engineering

Using Virtual Process Libraries To Improve Semiconductor Manufacturing
People think that semiconductor process simulation libraries should be developed using a perfect theoretical background that is strongly supported by empirical ...
Semiconductor Engineering

Greenfield Projects Needed To Meet Silicon Wafer Demand
After logging record shipments in the first quarter of 2021, the silicon wafer industry may need to start greenfield projects as soon as this year to boost capacity ...
Semiconductor Engineering

U.S. Takes First Steps Toward Resilient Supply Chains
The marathon race that is the rebuilding of American technology supply chains has commenced, with cautious optimism that initial efforts will eventually yield ...
EE Times

Intel CEO sees '10 good years' of chip industry growth
Intel CEO Pat Gelsinger said that he expects 10 "good years" of growth in the semiconductor industry during a panel at CNBC's Evolve conference. "We believe the market, ...
CNBC

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Quote of the Day

"The global village is not created by the motor car or even by the airplane. It's created by instant electronic information movement."
Marshall McLuhan

Industry Calendar

Jun 18, 2021
ECTC Virtual Conference
ECTC

Jun 22, 2021
Hardware to Highlight Leti Innovation Days
CEA-Leti

Jun 22, 2021
2021 International Conference on System-in-Package (SiP) Technology
IMAPS

Jun 22, 2021
FREE Webinar - Surface Cleanliness: How Clean is Clean?
ZESTRON Corporation

Jun 23, 2021
iMAPS New England Annual Meeting
IMAPS

FULL INDUSTRY CALENDAR

Test Your Knowledge Answer

What does a 'vigneron' cultivate?
Answer: Grapes (for wine-making)