February 19, 2026

Meta Deepens Nvidia Ties with Chip Pledge Meta Platforms will deploy millions of processors from Nvidia Corp, expanding their AI partnership. Meta will adopt Nvidia's Grace CPUs and upcoming Blackwell and Vera Rubin platforms, reinforcing Nvidia's dominance despite rising competition and Meta's chip ambitions. Taipei Times

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VIEWPOINT 2026: Dr. Srikanth Kommu and Dan Brewer, co-CEOs, Brewer Science Brewer Science proudly marks its 45th anniversary, reaffirming its mission: to be a company of the people, by the technology, for the customer. As the industry enters a new era of technological transformation, Brewer Science is committed to enabling breakthroughs that power AI, advanced ... Brewer Science

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Technical Paper

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Breaking HBM Barriers: Samsung's zHBM vs. Intel's Z-Angle Memory As HBM hits thermal limits, Intel and Samsung Electronics unveil rival 3D memory designs. Intel's diagonal ZAM cuts heat and power, while Samsung's zHBM stacks memory atop GPUs to boost bandwidth and efficiency, challenging traditional DRAM scaling. TrendForce

Cadence Design Systems shares pop on earnings beat, custom chip optimism Cadence Design Systems shares jumped over 6% after the company beat Q4 estimates with $1.99 EPS on $1.44 billion revenue. CEO Anirudh Devgan highlighted rising demand from system companies building custom AI chips and forecast up to $6 billion in annual revenue. CNBC

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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How China Struggles to Reach WFE Self-Sufficiency China is informally requiring new chip fabs to source at least 50% of wafer fabrication equipment from domestic suppliers, accelerating self-sufficiency amid sanctions. While local firms gain share in deposition and etching tools, lithography remains a major bottleneck despite heavy spending. EE Times

Nvidia touts India deals at AI summit At the AI Impact Summit in New Delhi, Nvidia Corp unveiled major partnerships with Larsen & Toubro Ltd and other Indian firms to build large-scale AI infrastructure. As Narendra Modi pushes India as a global AI hub, companies pledged billions despite governance concerns. Taipei Times

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Arm shares edge higher as Nvidia sells entire stake in company Nvidia sold its entire $155.8 million stake in Arm, lifting Arm shares over 1%. Despite exiting the investment, Nvidia maintains a long-term Arm license, while Arm reports strong AI-driven revenue growth and continues expanding its market momentum. CNBC

Korean Startup Takes On Cost and Latency With LLM-Specific Chip South Korean startup HyperAccel is set to launch its Bertha 500 LLM inference accelerator, targeting cost-efficient token generation in data centers. By optimizing LPDDR bandwidth and LLM-specific architecture, it claims up to 20× better throughput per dollar than Nvidia H100. EE Times

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Wi-Fi 7 Moves To The IoT Wi-Fi 7, also known as IEEE 802.11be, is expanding beyond premium laptops and AR/VR gear into IoT devices such as smart locks and robotic vacuums, as companies like Infineon highlight its ability to manage multiple bands and support dense, simultaneous connections. Semiconductor Engineering

India to Add 20,000 GPUs as AI Mission 2.0 Expands Compute and Chip Push At the India AI Impact Summit in New Delhi, Ashwini Vaishnaw unveiled plans to add 20,000 GPUs under AI Mission 2.0, expanding subsidized compute beyond 38,000 units, aligning chip design with AI goals & accelerating investment to boost domestic innovation & tech self-reliance. EE Times

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Meta expands Nvidia deal to use millions of AI chips in data center build-out, including standalone CPUs Meta Platforms will deploy millions of Nvidia chips, including standalone Grace CPUs & next-gen Vera Rubin systems, across its AI data centers under a multibillion-dollar deal. The expanded partnership accelerates Meta's AI ambitions & secures critical infrastructure through 2028. CNBC

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