Oct 21, 2026 Samsung Eyes 10% Output Increase for 2nm Exynos 2700 to Revive Non-Memory Business Samsung has begun wafer production for Exynos 2700, targeting 2027 Galaxy S27 models. Built on its second-generation 2nm process, the chip could boost performance, cut power use and support recovery in Samsung's foundry and System LSI businesses. TrendForce

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China's NAURA Targets Hybrid Bonding With RMB 405M Deal as Domestic Equipment Push Accelerates China's NAURA plans to acquire hybrid bonding specialist Nuohe Jianwei for RMB 405 million, expanding its 3D integration capabilities as local equipment makers target HBM and chiplet demand and challenge overseas leaders in advanced packaging. TrendForce

Bond front velocity in lubrication-mediated bonding of flexible substrates Robust theoretical model explaining bondwave velocity in direct wafer/die bonding and explaining why it accelerates. First model with predictive power to show realistic and observed values. Technical Paper

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Unimicron Warns of IC Substrate Crunch: Up to 30-Month Equipment Lead Times, 20% Material Gap in 2027 AI packaging demand is straining substrate materials and equipment, with lead times reaching 30 months and potential 20% material shortfalls in 2027. Growing substrate sizes and complex designs also challenge yields, power integrity and thermal management. TrendForce

Why Anthropic has a major China problem ahead of its blockbuster IPO Chinese AI models threaten Anthropic's growth and IPO prospects as cheaper open-weight rivals intensify competition and squeeze pricing. Hedgeye warns that weaker enterprise spending, OpenAI's resurgence and shrinking margins could derail Anthropic's $2 trillion valuation target. South China Morning Post

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Technical Papers ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing MORE TECHNICAL PAPERS

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TSMC expands Taiwan chipmaking capacity with new 3nm fab TSMC will build another 3nm semiconductor fab in Tainan, Taiwan, targeting volume production in early 2028 amid strong demand. The expansion supports broader capacity growth, alongside investments in Arizona and Japan, as advanced chips drive revenue. Cleanroom Technology

Community Colleges Put New Workers Into Semiconductor Jobs Fast The U.S. semiconductor industry faces a severe workforce shortage, with demand reaching 189,000 jobs by 2030. Community colleges are expanding affordable training, apprenticeships, and industry partnerships to prepare engineers and technicians for growing manufacturing needs. IEEE Spectrum

Sponsor From Heterogeneous Integration to 3D Front-End of Line Technologies This paper explores how hybrid and fusion wafer bonding have become foundational technologies in enabling both "More than Moore" heterogeneous integration and "More Moore" transistor scaling & recent advancements driving future architectures. EV Group

Chris Lattner: AI Code Generation Doesn't Solve Software Engineering Modular CEO Chris Lattner warns chipmakers against relying entirely on AI coding agents, emphasizing their limits in building reliable software infrastructure. He recommends using AI for focused tasks like code optimization and porting, while retaining essential engineering expertise. EE Times

How Singapore Connects Chip Research, Startups, and Manufacturing Singapore is linking semiconductor research with commercialization in silicon carbide, metalenses and silicon photonics. A*STAR supports technology translation, MetaOptics scales manufacturing, and GlobalFoundries expands photonics through its AMF acquisition. EE Times

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Building Physical AI Systems That Can Work in the Real World Physical AI developers must integrate perception, reasoning, planning, and control within strict size, weight, power, thermal, and cost limits. Heterogeneous computing and coordinated system architectures will enable robots to operate safely, efficiently, reliably, and economically at scale. EE Times

Amkor triples Gwangju investment to $2.3bn for advanced packaging hub Amkor Technology will triple its Gwangju investment to 3 trillion won by 2031, expanding advanced semiconductor packaging capacity with four facilities and 2,000 new jobs to meet surging AI chip demand and strengthen South Korea's semiconductor industry. Pulse

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Shipments of AI servers expected to grow: TrendForce Global AI server shipments are projected to rise 32.2% to 2.82 million units this year, TrendForce says. Major cloud providers' spending will drive market value to $920 billion next year, pushing total server market value above $1 trillion. Taipei Times

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Taiwan semiconductor electricity use hits record high in Sept. Taiwan's semiconductor industry used a record 4.5 billion kWh of electricity in September, up 11.55% year over year as AI chip demand surged. The Taiwan Research Institute expects annual consumption to exceed 50 billion kWh in 2026. Focus Taiwan