Oct 15, 2026 ASML Warns of 2027–28 Supply Shortfall Despite 30% Annual Capacity Hikes ASML raised its 2026 revenue outlook to €44 billion–€45 billion after record Q3 sales, but warned capacity will lag AI-driven demand through 2028. New EUV scanners and faster DUV tools aim to boost output. TrendForce

Sponsor Gold Embrittlement Can Compromise Reliability Gold plating on component terminations can create solder joint reliability concerns. Learn how controlled gold mitigation and robotic hot solder dip processing can reduce risk. Circuit Technology Center

Why Heat Is Becoming A Bigger Chip Design Issue Semiconductor Engineering gathered experts from leading EDA firms to examine thermal challenges in advanced chip packaging. They explored cooling limits and engineering trade-offs as manufacturers stack dies and integrate components vertically to boost performance and density. Semiconductor Engineering

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Co-Packaged Optics Moves from Promise to Production Planning Ayar Labs' CPO Summit identified 2028 as a turning point for co-packaged optics. Industry leaders stressed copper's bandwidth limits, manufacturing and thermal challenges, and the need for standardized interfaces, interoperability and global supply-chain collaboration. EE Times

Beyond Lithography: 3D Scaling Puts New Demands on Materials ASM International's Flowable Carbon technology fills complex 3D semiconductor structures and self-planarizes surfaces. Already in high-volume production, it eliminates CMP and etch-back steps, cutting manufacturing costs, reducing defects and lowering yield risks. EE Times

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Technical Papers ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing MORE TECHNICAL PAPERS

Sponsor Oxide Reduction for Reliable Power Electronics Manufacturing As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in power electronics production. Download here. Plasmatreat GmbH

Why Hybrid Bonding Is Hard to Perfect Hybrid bonding boosts 2.5D and 3D chip packaging by increasing interconnect density and performance, but defects threaten reliability. Adeia's semiconductor IP portfolio traces to Ziptronix technologies, and AMD secured a multi-year license following a 2026 settlement. 3D Incites

Musk's Terafab plan poses no short-term threat to TSMC Analyst Kirk Yang says Elon Musk's proposed Texas semiconductor complex will not threaten TSMC in the short to medium term, as construction could take five to 10 years. However, the project could reshape US chipmaking competition and supply chains. Taipei Times

Sponsor Advanced Microelectronic Packaging and Fiber Optics Technologies As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Tresky

ASML struggles with chip tool demand ASML raised its 2026 sales forecast as surging AI investment fuels record demand for chipmaking equipment. The company warned of supply shortages through 2028, explored capacity expansion and reported sharply higher quarterly profits amid rising EUV demand. Taipei Times

ASML's EUV Expansion Runs Through Zeiss ASML faces lithography equipment demand exceeding planned 2027 and 2028 capacity, prompting expansion reviews. Scaling deliveries depends on Zeiss's qualified EUV optical assemblies, precision metrology, and manufacturing infrastructure to meet growing chipmaker demand. EE Times

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology

China chip exports jump 136% to US$45b as AI frenzy jacks up prices China's IC exports surged 136% year on year to US$45 billion in September, driven by rising memory chip prices and AI infrastructure demand. Strong semiconductor and hardware shipments underscore China's growing role in global technology supply chains. South China Morning Post

How To Define CPU And Software Stack Performance For Agentic AI Agentic AI is reshaping CPU performance testing by adding orchestration, tool execution, retrieval and validation. Researchers propose combining component and end-to-end benchmarks with replayable agent trajectories to improve reproducibility and isolate CPU workloads. Semiconductor Engineering

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

SK hynix projects AI infrastructure performance to grow 20-fold by 2030 SK hynix forecasts AI infrastructure performance will grow 20-fold by 2030 as inference demand surges. The company is developing advanced memory technologies, including 3D stacked DRAM and high-bandwidth flash, to handle expanding data requirements. Yonhap News Agency

Sponsor Trace Analytical for Semiconductor Industry Balazs™ provides the following analytical services with a commitment to absolute quality control: Water analysis, Chemical analysis, Gas analysis, Particle analysis, Material analysis, Part analysis, and Cleanroom Evaluation analysis. Balazs Nanoanalysis

SEMICON West 2026 gets underway as semiconductor sector hits $1T milestone The semiconductor industry has reached $1 trillion earlier than expected, with sales projected to hit $1.6 trillion in 2026. AI, quantum computing, and fab expansion drive growth, while autonomous engineering and US research investments accelerate innovation. Engineer Live