June 16, 2026

Imec Pushes Quantum Toward Manufacturable Silicon Systems Imec unveiled the first quantum dot qubit device built with High-NA EUV lithography, achieving 6 nm gate spacing. The milestone boosts scalable silicon spin qubits and marks a key step toward semiconductor-style quantum manufacturing and large-scale systems integration. EE Times

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up GlobalFoundries plans to deliver the first OCI MSA-compliant silicon this year and start production in 2027, advancing open optical interconnects for AI data centers. The standard supports multi-vendor GPU links, reduces supply-chain risks, and speeds optical networking adoption. EE Times

Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity. Technical Paper

Sponsor Advanced Packaging for Next-Generation Vehicle As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more. Amkor Technology, Inc.

3D IC And 2.5D IC Packaging Market Research Explores Growth Within A $94.76 Billion Opportunity The 3D IC and 2.5D IC packaging market is expected to reach $94.76 billion by 2030 as AI, chiplets, and heterogeneous integration fuel demand. Industry leaders are expanding packaging capacity and deploying new tools to accelerate advanced semiconductor design and production. Open PR

TSMC Readies Panel-Level Packaging for AI Chips, Setting Up a Showdown With Samsung TSMC is accelerating development of panel-level packaging, building its CoPoS platform & supply chain to support AI chips at scale. The move pits TSMC against Samsung in a growing race to commercialize advanced glass- & panel-based packaging technologies for next-gen AI processors. Tech Times

Sponsor Flip Chip Bonding / C4 technology High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps". Tresky Automation

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor 1 of 10 Applications: Die Sorting Die sorting with Swiss made Tresky die bonders is just one of many powerful applications. Switching between them is a matter of minutes, and training could not be simpler. Dr. Tresky AG

Nvidia plans to raise at least $20 billion in its first debt sale since start of AI boom Nvidia plans to raise at least $20 billion, potentially up to $25 billion, in its first bond sale since the AI boom. The chipmaker aims to fund corporate needs, refinance debt, and support shareholder returns amid surging AI-driven growth and record cash flow. CNBC

Hon Hai partners with French firm on data centers Foxconn and Schneider Electric are joining forces to build next-generation AI data centers, combining expertise in computing, manufacturing, and cooling. Their partnership aims to deliver energy-efficient, modular, standardized infrastructure that can scale to meet surging AI demand. Taipei Times

Sponsor High-Speed, Reliable Plating with PACLINE® PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution. PacTech

Tensordyne Tapes Out LNS-Based AI Chip, Claims Huge Power Advantages Tensordyne has taped out its Napier AI inference chip, claiming up to 17× better power efficiency and significantly higher throughput than Nvidia-based systems. Using proprietary logarithmic computing, the startup targets faster, lower-cost AI inference, with systems expected in 2027. EE Times

Andy McLean: Rapidus MoU Will Help British Innovators Access 2-nm Technology Rapidus and the UK Semiconductor Centre signed an MoU giving British chip firms access to Rapidus' 2nm process by 2027. The deal boosts U.K. AI hardware development, deepens semiconductor ties with Japan, and helps startups commercialize advanced technologies. EE Times

Sponsor Next-Generation Epoxy Dispenser Introducing our latest ultra-high-speed, flexible solution capable of multiple dispensing methods & materials. 10µm accuracy available with 175Ag+ model. MRSI

China reaches mass production of key isotope in quantum computing, Beijing says China has mass-produced silicon-28 with over 99.99% isotopic purity, securing its first independent large-scale supply of a key quantum computing material. The advance strengthens domestic supply chains, reduces foreign reliance, and enables more stable silicon-based qubits. South China Morning Post

Wi-Fi Flies Higher As Edge AI Build-Out Takes Root Edge AI is reshaping AI computing by moving processing closer to devices, enabling faster, low-power, task-specific applications. As connected devices grow, advanced Wi-Fi technologies are becoming essential for secure and efficient edge networking, while reducing cloud dependence. Semiconductor Engineering

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Research Bits: June 15 Researchers advanced next-generation electronics with three breakthroughs: radiation-resistant ferroelectric NAND memory for space missions, self-aligning molecular materials that enhance silicon photonics, and an ultra-low-voltage light-emitting transistor that combines computing, memory, and display functions for wearable and neuromorphic devices. Semiconductor Engineering

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH