August 6, 2026

TSMC Reportedly Expands Outsourcing of Key CoWoS Front-End Step to OSATs TSMC is reportedly expanding CoW outsourcing to OSAT partners including ASE to accelerate CoWoS packaging for AI chips. The move aims to ease capacity bottlenecks as AI demand surges, enabling faster production while supporting major CoWoS capacity growth through 2026. TrendForce

Sponsor Copper Stud & CTE Nano Tech Underfill AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles. AI Technology, Inc.

GlobalWafers forecasts growth GlobalWafers expects meaningful revenue growth in 2027 after a fire at its Italy fab delayed this year's recovery. Rising AI-driven wafer demand, stronger orders, higher factory utilization and planned price increases are expected to boost sales and support long-term growth. Taipei Times

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

Scale Up, Scale Out Challenges Amplified For Clusters Industry experts from Arm, Axiomise, Cadence, Expedera, Siemens EDA & Synopsys examine how AI data center architectures are evolving, highlighting shifts in silicon design, cloud infrastructure, verification & high-performance computing to meet growing AI workload demands. Semiconductor Engineering

U.S. Export Curbs Backfire? Samsung, SK hynix Reportedly Mull AMEC's Tools as China Fab Backup Tightening U.S. export controls may boost AMEC as Samsung and SK hynix reportedly assess its etching tools for China fabs to reduce supply risks. At the same time, both firms are replacing Chinese equipment in advanced nodes to limit geopolitical exposure. TrendForce

Sponsor New Quadra Pro Manual X-Ray System Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more. Nordson TEST & INSPECTION

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Samsung Lays Out AI Memory Roadmap Samsung unveiled a 3D memory roadmap to break AI's memory wall by advancing HBM and V-NAND with tighter accelerator integration. The strategy boosts bandwidth, energy efficiency and memory density to enable 10x higher AI token throughput by 2030. EE Times

Microsoft AI exec tells developers to default to OpenAI's top model as part of efficiency push Microsoft is directing developers to default to OpenAI's GPT-5.6 Sol for AI coding projects in GitHub Copilot, aiming to maximize efficiency and capitalize on OpenAI intellectual property while tightening AI spending and optimizing token usage across engineering teams. CNBC

Sponsor Achieve Reliable BGA Rework with Expert Reballing Methods BGA reballing requires precision, process control, and proven techniques. Manufacturers improve rework quality and maximize BGA reliability with proven reballing practices. Circuit Technology Center

Advantech sees solid sales growth Advantech expects double-digit revenue growth this quarter as strong demand for semiconductor equipment, AI infrastructure and edge AI boosts orders. The company reported surging profits, and rapidly expanding AI and robotics businesses, while preparing for supplier price increases. Taipei Times

Researchers make air-stable, ultrathin superconductors, for more scalable quantum devices MIT researchers developed a wafer-scale process to grow ultrathin niobium diselenide beneath graphene, preventing air degradation. The stable superconductor retains strong quantum performance, enabling smaller, more scalable quantum computers and ultrasensitive devices. MIT News

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

How four Asian economies are positioning themselves for the AI age Taiwan and South Korea are strengthening their AI sovereignty by expanding leadership in critical semiconductor technologies. Taiwan safeguards advanced chipmaking through TSMC, while South Korea invests in memory chip production, securing pivotal roles in the global AI value chain. Asia Times

Automotive Cybersecurity: AI Attack Surfaces Grow Upstream Security warns software-defined vehicles and AI are rapidly expanding automotive cyber risks. Its 2026 report logged 494 public cyber incidents in 2025, tracked 1,871 threat actors, and urged AI-driven defenses, stronger regulations, and real-time monitoring. EE Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Silicon, not software, will decide the AI race ChatGPT ignited mainstream AI adoption, triggering massive investment in chips, data centers, energy and infrastructure. The surge also intensified global competition for semiconductor manufacturing, computing power and electricity, the critical foundations of future AI leadership. Taipei Times

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.