March 24, 2026

Terafab: The World's Next Generation Chip Factory Elon Musk unveiled Terafab, a $25 billion venture by Tesla, SpaceX, and xAI to build vertically integrated chips, aiming to transform AI infrastructure, reduce reliance on TSMC, and enable space-based computing. Futurist Speaker

Sponsor Next-Generation Epoxy Dispenser Introducing our latest ultra-high-speed, flexible solution capable of multiple dispensing methods & materials. 10µm accuracy available with 175Ag+ model. MRSI

Semiconductor technology: Turning India's dream to reality India accelerates semiconductor self-reliance, using incentives, global partnerships, and resources to scale chip design, fabrication, and 2D materials research, building talent and infrastructure to meet demand. The Pioneer

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

How GlobalFoundries Takes AI from Pilot to Global Scale AI is evolving from isolated tools into a core operational layer in semiconductor fabs. At GlobalFoundries, leaders deploy scalable, validated AI to enhance yield, efficiency, and decision-making, embedding it into everyday manufacturing processes and global operations. EE Times

OpenAI calls out Microsoft reliance as risk in investor document ahead of expected IPO OpenAI warned investors that heavy reliance on Microsoft for funding and compute poses risks, despite raising $110 billion from partners like Amazon, Nvidia, and SoftBank, while preparing for a potential IPO. CNBC

Sponsor Advanced Microelectronic Packaging and Fiber Optics Technologies As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Tresky

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Copper vs silver: a turning point for WBG die attach Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost. Henkel AG & Co.

Software Engineering Has Been Commoditized and Automated. What's Next? From sewing machines to AI, technology keeps boosting output while shrinking labor premiums. Software engineering now mirrors that trend, as automation cuts entry-level roles, concentrates value among top talent, and drives firms toward lean, AI-augmented teams. EE Times

Microsoft-backed startup raises US$40 million for advanced chipmaking equipment tech Norway-based Lace raises $40 million to advance helium atom-beam lithography, aiming to shrink chip features up to tenfold. Backed by Microsoft, the startup targets breakthroughs beyond ASML's light-based systems and plans pilot fab testing by 2029. BNN Bloomberg

Sponsor A Hybrid PLP Technology Based On A 650 X 650 mm Platform Multiple fan-out wafers or subpanels are assembled on a carrier panel with reduced cost in the RDL process. Read more. Amkor Technology, Inc.

Synopsys shares rally as activist Elliott builds multibillion-dollar stake in chip design firm Synopsys shares rose about 3% after Elliott Investment Management built a multibillion-dollar stake, betting on AI-driven chip complexity. Elliott aims to boost execution and profitability, as strong partnerships and surging AI demand position Synopsys for semiconductor growth. CNBC

U.K. Photonics: Innovation, Investment, and the IP Landscape Rising patent filings highlight accelerating global photonics innovation, with the U.K. emerging as a strong contributor. Despite fluctuations, robust R&D, growing startup activity, and increased funding position the U.K. to expand its influence in the rapidly growing global photonics market. EE Times

Sponsor IC Device & Micro-Electronic Cleaning Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge. Kyzen Corporation

Auto Ethernet 10BASE-T1s Steps Up, With Tbps On The Horizon Automotive Ethernet is rapidly overtaking CAN bus as vehicles demand higher data speeds to power software-defined systems, ADAS, and autonomy. Adoption is led by 10BASE-T1S, with future architectures scaling to multi-gigabit and optical networks. Semiconductor Engineering

These chips can help you live to be 1000 years old. China approved the world's first invasive brain-computer interface, accelerating commercialization. Fueled by investment, Big Tech, and AI chip advances, the sector is rapidly industrializing as firms scale production and global growth forecasts strengthen confidence. European Central Station

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Ho Chi Minh City sets sights on becoming semiconductor hub Ho Chi Minh City is accelerating its semiconductor ambitions under Plan 98, attracting global firms like AMD, NVIDIA and Qualcomm while investing in R&D, infrastructure and workforce development to build a competitive, integrated chip ecosystem. Vietnam Plus

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology