May 5, 2026

Global Semiconductor Sales Increase 25% from Q4 2025 to Q1 2026 Global semiconductor sales hit $298.5B in Q1 2026, rising 25% from Q4 2025. March reached $99.5B, up 79.2% year over year and 11.5% month over month, as strong demand across Asia Pacific, Americas, and China drove broad growth. driving market expansion. Semiconductor Industry Association

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

ASE, Powertech, KYEC CapEx May Hit NT$370B This Year as AI Drives Record OSAT Investment Taiwan OSAT firms ASE, Powertech, and KYEC ramp record capex as AI chip demand drives advanced packaging and testing expansion. ASE lifts spending and outlook, while all three boost capacity for CoWoS, FOPLP, and AI GPU/ASIC testing growth. TrendForce

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Micron Says AI Still in Early Stage as Memory Demand Reportedly Seen Exceeding 50% of Total Market This Year Micron CEO Sanjay Mehrotra warns the memory crunch is only beginning as AI demand accelerates. He says DRAM and NAND stay extremely tight with AI potentially exceeding 50% of demand as inference scales driving higher-capacity needs through 2028. TrendForce

The chip industry is booming again, but only for companies building AI infrastructure Industry group Semi reports silicon wafer shipments rose 13.1% year over year to 3,275 MSI despite a 4.7% seasonal quarterly dip, as AI and data centers drive demand while PC and smartphone markets weaken and capacity shifts to advanced chips. TechSpot

Sponsor Engineering Changes Don’t Have to Slow You Down When design updates demand precision and speed, trust the rework technicians at Circuit Technology Center to get it done right the first time. Circuit Technology Center

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Interested in a demonstration? We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day. Surfx Technologies

Chip testing demand lifts Ardentec forecast Ardentec Corp expects mid-single-digit revenue growth this quarter after strong gains driven by AI and smartphone chip testing demand. It forecasts rising quarterly profits and higher factory utilization, while new Longtan AI ASIC testing facility begins revenue later this year. Taipei Times

Agentic AI Tackles RTL Verification's Productivity Gap Electronic design automation now hits workflow coordination limits, not compute ceilings. Continuous, iterative verification dominates, while agentic AI orchestrates tasks, analyzes results, and streamlines flows, keeping engineers in control. EE Times

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

AI chipmaker Cerebras targets $3.5 billion raise in IPO Cerebras seeks to raise up to $3.5 billion in a Nasdaq IPO, selling 28 million shares at $115–$125 each, potentially valuing it at $26.6 billion, as strong AI demand and revenue growth fuel investor interest and expansion plans. CNBC

TSMC seeking approval for advanced fab in expanded Hsinchu Science Park TSMC seeks government approval for an advanced wafer fab at Hsinchu Science Park’s Longtan campus. The company plans angstrom-class (0.1nm) technology, revisiting a project shelved in 2023 amid local opposition, with a potential NT$500–600 billion investment pending review. Taipei Times

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Fraunhofer IPMS Eyes India For Contract Research and Semiconductor Partnerships Fraunhofer IPMS deepens ties with India's semiconductor ecosystem, delivering contract research in sensors, MEMS, and photonics. It partners with institutes and companies to link academia and industry, accelerate industrialization, and meet rising AI and microelectronics demand. EE Times

Applied Materials To Acquire NEXX For $120 Million Semiconductor engineers are moving beyond iterative simulation as system complexity rises. By embedding solver-grounded, deterministic analysis into workflows, they quickly assess coupled thermal, mechanical and electrical effects as designs evolve. Semiecosystem

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

From Simulation Checkpoints To Continuous Physics Semiconductor engineers are shifting beyond iterative simulation as complexity rises, adopting continuous physics reasoning. By embedding deterministic, solver-driven analysis into workflows, they rapidly evaluate coupled thermal, mechanical & electrical effects as designs evolve. Semiconductor Engineering

Sponsor No more cartridge exchanges The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more. xyztec