May 4, 2026

Samsung Foundry Reportedly Wins Optical Module Order, Steps Up Silicon Photonics and CPO Drive Samsung Foundry accelerates silicon photonics, securing initial orders and advancing talks with global clients. It targets mass production in 2H26 and aims for CPO rollout by 2029, positioning optical tech as critical for scaling AI data center performance. TrendForce

Sponsor Hermetic Microelectronic Package Seam Seal Technical paper on technology that delivers a pristine internal atmosphere for hi-rel microelectronic components. Process automation, including AI, and standard tooling utilized in die and wire bonding is standard. MicroCircuit Laboratories, LLC

Behind TSMC's High-NA EUV Deferral: Low-NA Stays Strong, Customer Landscape Shifts, and ASML Quietly Pivots TSMC plans to skip High-NA EUV for its A13 node, favoring extended use of cheaper Low-NA tools. The move tempers near-term demand for ASML's next-gen systems while reinforcing strong Low-NA sales and shifting focus to packaging and diversified customers. TrendForce

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor Advanced Packaging for Next-Generation Vehicle As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more. Amkor Technology, Inc.

Nvidia's push into physical AI sparks rally in partners Asian stocks gain as Nvidia deepens partnerships across the region, expanding from chips into physical AI like robotics. Asian suppliers now make about 90% of production costs, up from 65%, boosting demand amid surging global AI investment. Taipei Times

AI supercycle reshapes chips as Samsung rides price boom and TSMC builds platform Generative AI reshapes the semiconductor supercycle, driving surging demand for GPUs and memory, triggering shortages and sharp price spikes. Samsung and TSMC report record profits as AI-led structural growth transforms chips into a long-term profit engine. Chosun Biz

Sponsor 1 of 10 Applications: Flip-Chip Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode. Dr. Tresky AG

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

S Korea's exports surge as AI boom fuels chip sales South Korea's exports surged 48% as semiconductor demand, driven by AI investment, propelled growth, delivering a $23.8 billion surplus. However, rising oil prices from Iran tensions and a weaker won increased import costs and inflation pressures despite strong external demand. Taipei Times

Robotics to grow rapidly: Advantech executive Advantech expects rapid robotics growth after exceeding 5% revenue, driven by AI-enabled AMRs, robotic arms, and inspection systems, with 20 new projects. The firm expands edge computing, drone modules & US manufacturing for localized high-performance industrial demand. Taipei Times

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

ASML says firm will not be chip industry's bottleneck ASML CEO Christophe Fouquet said the chip equipment maker will avoid becoming an industry bottleneck by investing in capacity and productivity. Strong AI chip demand drives growth, while export restrictions and delivery delays remain key risks to its dominance. MSN

Advanced Semiconductor Packaging: Laser-Based Strategies for Through-Glass Via Fabrication Through-glass vias (TGVs) power high-density interconnects in advanced 2.5D and 3D packaging. Using femtosecond lasers, manufacturers drill precise, high-aspect-ratio holes, boosting performance while tackling glass brittleness and scaling limits. Photonics

Sponsor How LAPLACE® Laser Assisted Bonding Saves Energy LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo. PacTech

Chip Industry Week in Review US Commerce Department orders IC equipment makers to halt shipments to Hua Hong, restricting China's chip access amid AI-driven shortages. Capacity may ease by 2027 as firms shift to chiplets, while US back-end gaps persist and TSMC expands 2nm output. Semiconductor Engineering

Apple CEO Tim Cook warns of extended memory crunch. 'We'll look at a range of options' Apple CEO Tim Cook warned that surging memory costs, driven by AI demand, are straining supply and lifting expenses. Meta and Microsoft raised capital spending forecasts, while Apple considers supplier deals, pricing changes, and margin trade-offs amid the global crunch. CNBC

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Prices of Nvidia's B300 server at $1 million in China on US curbs Strong demand for AI computing in China has driven Nvidia B300 server prices to about $1 million each as chip import crackdowns and smuggling enforcement tighten supply, intensifying competition and boosting activity in the fast-growing rental market. Economic Times CIO

Sponsor SQ7000+TM Multi-Function for 3D AOI, SPI & CMM The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system. Nordson Test & Inspection