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Xyztec's virtual reality showroom
Feel free to move around in the interactive xyztec showroom and discover all bondtesters and services with a mouse click. Watch product videos, brochures, and manuals. Explore xyztec!
xyztec
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Thermal Warpage Testing Services
If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs.
Akrometrix
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What Year Was It?
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Lewis and Clark Expedition
Lewis and Clark expedition leaves St. Louis on a mission to explore the Northwest from the Mississippi River to the Pacific Ocean.
See the answer below.
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FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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What Year Was It Answer
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Lewis and Clark Expedition Answer: May 14, 1804
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Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
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Automakers Face Memory Shock as AI Uses Up Semiconductor Supply
In 2026, automakers confront a DRAM and NAND flash shortage as AI data centers consume high-bandwidth memory. This supply shift forces EV and software-defined vehicle makers to overhaul procurement strategies while stricter EU safety regulations further increase automotive semiconductor demand.
EE Times
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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TSMC expects global chip revenue to hit US$1.5tn
TSMC forecasts global semiconductor revenue will surpass $1 trillion this year and reach $1.5 trillion by 2030, driven by AI demand, with AI inference becoming the main growth engine and high-performance computing accounting for 55% of revenue.
Taipei Times
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When Encryption Meets Quantum
Quantum computing threatens modern cryptography by breaking RSA and ECC, forcing engineers to redesign security in silicon, firmware, and key management. With ‘harvest now, decrypt later’ attacks rising, NIST post-quantum standards and 2027–2030 compliance deadlines drive urgent migration.
EE Times
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Two Component, Thermally Conductive Epoxy
Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength.
Master Bond
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Accelerating Chipmaking Innovation for the Energy-Efficient AI Era
Applied Materials builds the EPIC Center to accelerate semiconductor R&D by uniting talent, infrastructure, and co-innovation. The $5 billion platform breaks siloed workflows, compresses feedback loops, and speeds lab-to-fab transitions to meet tightly coupled angstrom-era AI hardware challenges.
IEEE Spectrum
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Why Vision LLMs Force A Rethink Of Edge AI Hardware
Vision LLMs moving on-device expose limits of TOPS-focused edge accelerators, as memory traffic, utilization, and irregular multimodal workloads dominate performance. New designs emphasize sustained efficiency through hardware-software co-design and packet-based execution rather than peak compute alone.
Semiconductor Engineering
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GHz Sockets 0.2mm to 1.27mm
Industry's smallest footprint that has up to 500,000 insertions, bandwidth up to 94GHz, 2.5mm per side larger than IC, ball count over 10,000.
Ironwood Electronics
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Chiplets Need A New Workflow
Chiplets reshape semiconductor design by shifting from monolithic SoCs to multi-die systems, forcing engineers to adopt unified, early-stage workflows that integrate architecture, packaging, verification, and reliability analysis to manage interconnect complexity, multi-physics effects, and system-level risks.
Semiconductor Engineering
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Flash Getting Stacked High-Bandwidth Version
Sandisk advances high-bandwidth flash (HBF) to place large AI model parameters inside GPU packages, reducing data movement. Working with SK hynix and OCP, it targets standardization, with samples planned for 2026 and inference devices expected in 2027.
Semiconductor Engineering
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Contamination Control
Balazs provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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Gates Add Functionality, But Wires Create Problems
Advanced semiconductor nodes shift performance limits from transistors to interconnects, as shrinking wires increase resistance, capacitance, delay, and power. Designers now prioritize routing, floorplanning, and power delivery innovations, while exploring materials and 3D integration to mitigate worsening wire bottlenecks.
Semiconductor Engineering
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Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online.
DL Technology
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| Today's Sponsor |
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Test Your Knowledge
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Where is the human skin the thickest?
See answer below.
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Quote of the Day
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I will prepare and some day my chance will come. Abraham Lincoln
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Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
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| Cartoon of the Day
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"The Latest Environmental Crisis: Wireless Data Pollution."
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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Where is the human skin the thickest? Answer: The back
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