July 9, 2026

Worker shortage endangers US chip production plans A nationwide shortage of skilled workers could delay US semiconductor projects and limit future chip production, with a projected deficit of up to 157,000 workers by 2030. Industry leaders urge continued government funding, workforce training and stronger education pipelines to meet growing demand. Taipei Times

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imec Roadmap Extends to A3 by 2038; Chip Density Gains Shift Beyond Traditional Transistor Scaling imec's latest semiconductor roadmap projects chip technology through the A3 node by 2038, shifting future density gains beyond traditional transistor scaling. The roadmap emphasizes CFET architectures, backside power delivery, advanced packaging, and next-generation EUV lithography to sustain semiconductor performance improvements. TrendForce

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

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IBM’s Latest Semiconductor Breakthrough IBM says it has achieved a major semiconductor breakthrough, reinforcing continued advances in chip technology despite years of predictions that Moore’s Law was ending. The development highlights sustained exponential improvements in semiconductor performance and manufacturing innovation over the past two decades. Brown Stone Research

Apple, Broadcom chip deal expected to exceed US$30bn Apple will spend more than US$30 billion with Broadcom through 2031 to manufacture over 15 billion US-made chips, expand Colorado production, and advance wireless and AI server technologies, reinforcing its broader US$600 billion domestic investment and job creation commitment. Taipei Times

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Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

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Chip analysis providers report record-high sales Materials analysis firms MA-tek and Msscorps posted record second-quarter revenue as booming AI chip demand accelerated advanced semiconductor analysis. Both expect silicon photonics and co-packaged optics to drive long-term growth, expanding capacity and specialized services for next-generation AI data centers. Taipei Times

China’s circuit-board makers push capex towards record to feed AI boom China's PCB makers are accelerating factory expansion and record capital spending to meet soaring AI server demand. Companies are investing billions in advanced high-end boards, although manufacturing hurdles, supply chain constraints and geopolitical risks could slow the sector's rapid growth. South China Morning Post

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Stacking Chips Sideways Gives AI More Memory Researchers are developing side-stacked DRAM architectures to replace traditional HBM stacks, tackling heat and bandwidth limits in AI chips. New designs, including V-Die and MOSAIC, promise higher memory capacity, faster performance, lower latency, and cooler operation for future AI accelerators. IEEE Spectrum

Apple commits $30 billion to Broadcom for U.S. chipmaking push Apple expanded its partnership with Broadcom through a multi-year deal worth more than $30 billion to produce over 15 billion U.S.-made chips. The agreement strengthens domestic semiconductor manufacturing, expands Broadcom’s Colorado facility, and supports Apple’s long-term silicon supply chain strategy. CNBC

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Unifying Software And Semiconductor Development A Siemens EDA white paper highlights how software-defined system design is transforming semiconductor development by integrating IC, PCB and software workflows. Partnering with Perforce, Siemens promotes unified design, end-to-end traceability and cross-disciplinary collaboration to manage growing system complexity and rising chip-design costs. Semiconductor Engineering

Apple begins testing CXMT chips for devices sold in China, FT says Apple has begun testing DRAM chips from China's CXMT for devices sold domestically and is seeking U.S. approval for broader adoption. The move highlights Apple's supply chain balancing act as geopolitical tensions and China's semiconductor ambitions continue to reshape the global memory market. CNBC

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Worker shortfall endangers U.S. chip factory revival — including Ohio’s Intel shop A nationwide shortage of skilled workers threatens to delay construction of billions of dollars' worth of new U.S. semiconductor plants and limit future chip production, prompting calls for stronger industry collaboration and sustained government funding to meet growing demand. Crains Cleveland Business

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology