July 27, 2026

DAC 2026: What Does It Actually Take to Create AI Chips? DAC 2026 showcases how engineers are advancing AI chips through accelerators, memory, interconnects and EDA innovations. Conference sessions tackle power, thermal, verification and multi-die challenges to deliver reliable, high-performance silicon systems. EE Times

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Intel's CPU Momentum Builds: 10 Long-Term Deals Reportedly Lock In Demand; Intel 3 Capacity Tightens Intel is locking in multi-year server CPU deals as AI demand strains supply, with Intel 3 capacity remaining its biggest bottleneck. Strong Granite Rapids demand, higher server CPU pricing and robust AI infrastructure spending are driving data center growth through 2028. TrendForce

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Technical Paper

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SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI SK hynix is accelerating 3D-stacked DRAM development for on-device AI, recruiting dedicated engineers and co-designing logic with a U.S. customer. The architecture promises higher bandwidth, lower latency and better power efficiency as next-gen AI memory advances. TrendForce

Qualcomm plans to increase prices by double digits Qualcomm will raise chip prices by double-digit percentages starting in September as AI-driven demand, limited TSMC capacity, and memory shortages tighten semiconductor supply. The increases will raise costs for smartphones and electronics manufacturers. Taipei Times

Sponsor High-force flip-chip bonding with Tresky Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force! Dr. Tresky AG

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

SK hynix expected to post record 64.1 tln won in Q2 operating profit SK hynix is expected to achieve record second-quarter profit of 64.1 trillion won, fueled by HBM leadership and AI demand. Rising memory prices and strong data center demand drive growth, positioning Korea's chipmakers for combined profits exceeding 150 trillion won. Yonhap News Agency

Nvidia locks down memory supply from SK Hynix as part of $500 billion AI deal Nvidia secured AI memory supply from SK Hynix through a potential $500 billion partnership, expanding AI infrastructure with massive data centers. Samsung and Broadcom also announced a $200 billion collaboration, strengthening memory & foundry capabilities for next-gen AI systems. CNBC

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Intel Foundry Improves Execution, but External Customers Remain the Test Intel Foundry strengthened its recovery as Q2 results showed higher revenue, improved losses and better yields. However, the company must still prove it can attract major external customers, with Fortinet's Intel 4 partnership marking an early test. EE Times

Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure NVIDIA and Amkor Technology forged a multi-year partnership to expand advanced AI chip packaging and testing. NVIDIA's investment boosts Amkor's U.S. capacity, strengthens supply chain resilience, and accelerates next-generation AI infrastructure for global markets. 3DInCites

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Surging memory chip prices make profitable budget phones 'impossible', analysts say Memory shortages and soaring chip costs are squeezing budget smartphone makers, making sub-US$100 devices unprofitable. Omdia says rising memory prices and AI-driven supply constraints will push brands toward pricier models, speeding the decline of ultra-low-cost phones. South China Morning Post

Chip Industry Week In Review Amkor, Nvidia, Siemens and partners advanced semiconductor innovation with new packaging, EDA, quantum, AI sensor and infrastructure initiatives. AMD unveiled its Helios AI platform, while Anthropic accelerated next-generation computing through major GPU deployment. Semiconductor Engineering

Sponsor LAPLACE® LAR 600A Saves Energy Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes. PacTech

China's largest memory chipmaker sparks fears of a cash drain as it readies for public debut ChangXin Memory Technologies' $8.6 billion IPO raises liquidity concerns in Chinese markets as investors shift funds toward the memory chip giant. Analysts say the listing may intensify short-term pressure but could strengthen CXMT's global DRAM ambitions. CNBC

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.