June 30, 2026

SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026 SEMI forecasts global 300mm memory fab equipment investment will exceed $50 billion for the first time in 2026, driven by surging AI demand. Strong spending on DRAM, HBM, and DDR5 technologies is expected to fuel continued growth through 2027. SEMI

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

TSMC’s 2Q Margins Reportedly Near 70% amid Strong 3/5nm Demand, 3Q Revenue Seen Growing Over 10% TSMC is expected to post second-quarter gross margins approaching 70% as strong AI demand drives advanced 3nm and 5nm chip production. Analysts also forecast third-quarter revenue will grow more than 10% sequentially on continued AI momentum. TrendForce

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

The Chinese chipmaker Apple suddenly needs Apple has sought US approval to source DRAM chips from China's ChangXin Memory Technologies as AI-driven demand tightens global memory supplies and raises costs. With limited alternatives beyond Samsung Electronics, SK Hynix and Micron Technology, Apple faces higher device prices or lower margins. Finshots

Panel with Arteris, GlobalFoundries, Tenstorrent: RISC-V Ecosystem Growth for Physical AI At a MIPS event in Taipei, EE Times' Nitin Dahad moderated a panel on RISC-V ecosystem growth for Physical AI, featuring experts from Arteris, GlobalFoundries and Tenstorrent, who discussed advancing agentic AI at the edge through open-chip technologies. EE Times

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Apple accuses India of ‘copy-pasting’ rivals’ claims in antitrust investigation Apple has urged India's antitrust regulator to dismiss findings that it abused App Store rules, arguing investigators copied rivals' claims instead of conducting an independent probe. The company also warned potential penalties could disrupt investment and its India operations. Taipei Times

Graphene can hold multiple states of superconductivity, a new study finds MIT researchers have discovered multiple unconventional superconducting states in naturally occurring rhombohedral graphene, revealing that some strengthen instead of weaken under magnetic fields. The findings uncover unexpected quantum behavior in graphite and could advance research into next-generation superconducting materials. MIT News

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Imec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nm — company redefines Moore's Law as cell sizes gain importance for density Imec’s latest semiconductor roadmap projects 3-angstrom-class process technology by 2038 but expects key transistor scaling to plateau by 2030. To sustain performance gains, chipmakers will increasingly rely on innovations such as CFET transistors, Hyper-NA EUV lithography, and incremental node improvements. Tom's Hardware

The Lab Mistake That Might Revolutionize Computing Researchers have discovered that ordinary CMOS transistors can function as artificial neurons and synapses, offering a scalable neuromorphic computing approach. The breakthrough could dramatically reduce AI’s energy consumption by replacing power-hungry GPU-based processing with brain-inspired hardware. IEEE Spectrum

Sponsor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Nordson Test & Inspection

Top China chip toolmakers consolidate to build national champions, defy US curbs China is accelerating semiconductor consolidation as state-backed toolmaker Piotech moves to acquire Wuxi Shangji Semiconductor. The deal broadens Piotech’s chip equipment portfolio, strengthens domestic manufacturing capabilities and advances Beijing’s push for self-sufficiency despite US export restrictions. South China Morning Post

TSMC says it manufactured 12,682 different products for 534 customers in 2025 — meaning the chips inside your phone, car, and bank all trace back to one company on a single island TSMC manufactured 12,682 unique chip designs for 534 customers in 2025, underscoring its dominance in global semiconductor production. With near-monopoly control over advanced chipmaking, the company has become an indispensable manufacturing partner for industries spanning smartphones, AI, automotive, and healthcare. Silicon Canals

Sponsor Lower Electronics Costs Through Component Recovery Recovering electronic components can reduce costs, minimize waste, and maximize inventory. Circuit Technology Center provides component recovery solutions. Circuit Technology Center

Rethinking Chip Verification EDA vendors are advancing AI-driven, executable “golden specifications” to unify chip design and verification, aiming to reduce signoff time, improve coverage, and prevent specification drift as increasingly complex multi-die, chiplet, and 3D semiconductor designs strain traditional verification workflows. Semiconductor Engineering

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.