July 24, 2026

Realizing The Future Of 3D-IC: Final Scenario And Sign-off Multi-chiplet package designers can speed 3D-IC development by optimizing chiplet interface routing before physical implementation. Early planning reduces congestion, preserves signal integrity, ensures UCIe compliance, cuts redesigns, and improves PPA and cost. Semiconductor Engineering

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

The Impact Of AI Automation On Chip Design EDA companies see agentic AI as a way to enhance, not replace, semiconductor design tools. Industry experts say trusted AI will automate workflows, improve verification, and optimize engineering processes while keeping humans involved in critical decisions and sign-off. Semiconductor Engineering

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

U.S. Starts Genesis Mission with $5B for First Projects The U.S. launched the $5 billion Genesis Mission to speed AI-driven research in energy, quantum computing and national security. But analysts warn the funding trails China's far larger AI investments, threatening America's long-term edge in the global AI race. EE Times

Intel's stock jumps as chipmaker rides AI boom to fastest revenue growth in almost 15 years Intel beat second-quarter expectations with its fastest revenue growth since 2011, driven by booming AI server chip demand. The company issued strong guidance, expanded long-term CPU supply deals, and reported sharp gains in data center, foundry revenue, and profit margins. CNBC

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor High power atmospheric plasma system Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength! Plasma Etch

Cerebras stock gains on AMD partnership Cerebras shares climbed 5% after the AI chipmaker partnered with AMD to integrate its wafer-scale processors into AMD's Helios AI systems. The alliance targets ultra-low-latency AI, boosting Cerebras as demand for faster AI infrastructure grows. CNBC

Alphabet's cash burn raises alarm for Big Tech as AI spending climbs Alphabet's record US$5.9 billion quarterly cash burn highlights the rising cost of AI investment, despite booming Google Cloud growth. Investors now expect Microsoft, Meta and Amazon to boost AI spending further, intensifying concerns over profitability, cash flow & long-term returns. Taipei Times

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

DAC 2026: Users Are Not Waiting; DIY AI Is Now in Vogue Engineers at DAC 2026 accelerated DIY AI for chip design, building reinforcement learning agents, on-premises LLMs and multi-agent workflows atop EDA tools. Their systems improved verification, optimization, automation and design efficiency. EE Times

Designing Electro-Optical Chips Silicon photonics is moving into mainstream chip design, driving EDA vendors to unify optical, electrical, thermal and system-level verification. AI-assisted workflows help engineers validate co-packaged optics, speed development and ensure reliable performance. Semiconductor Engineering

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

Untangling Chip Traffic Jams As AI accelerators and chiplet designs grow more complex, engineers are advancing networks-on-chip to optimize data flow, preserve cache coherency, and reduce latency and congestion. New NoC architectures and verification tools enable scalable AI performance. Semiconductor Engineering

Chip Policy: The UK Vs. The US Vs. EU Vs. India The UK is pursuing a focused semiconductor strategy, investing £500 million in AI hardware and chip innovation instead of building costly fabs. By leveraging strengths in chip design and research, it aims to capture 5% of the $1 trillion AI chip market. Semiconductor Engineering

Sponsor Swiss made die bonders from Tresky Ideal for high-mix, low-volume production at highest quality. They are perfect for many uses, just like a Swiss Army Knife. Operator training takes only minutes. Dr. Tresky AG

The End Of Physics Silos In Engineering AI Engineering AI is evolving from isolated, domain-specific models to unified physics foundation models that reason across thermal, mechanical, electrical, and material interactions. This solver-grounded approach boosts design accuracy, scalability, and engineering decisions. Semiconductor Engineering

Sponsor Selective Laser Bonding for Fine Parts Localized laser heating enables precise bonding without heating the full substrate, reducing thermal stress and energy use in advanced packaging. See how it works. PacTech