Sep 28, 2026 Inside TSMC's Evolving Design Ecosystem: Shaping the Future of AI, with AI TSMC is expanding its Open Innovation Platform with AI-driven design workflows, system-level support and energy-efficient technologies. Its new AI Design Kit enables agentic optimization, targeting 3x–5x productivity gains in digital design and up to 6x in analog/RF design. EE Times

Sponsor High-Reliability BGA Reballing BGA reballing requires controlled deballing, precise ball placement, proper thermal processing, and rigorous inspection. Circuit Technology Center provides repeatable BGA reballing services. Circuit Technology Center

Chip Industry Week In Review Cadence advanced AI-driven chip design with specialized agents, while Alibaba, CXMT and YMTC expanded domestic AI and memory capabilities. Samsung, GUC and imec also pushed HBM and 3D-memory technologies, highlighting rapid innovation across China’s semiconductor ecosystem. Semiconductor Engineering

Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Technical Paper

Sponsor Ultra-Thin Wafer Handling Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps. Brewer Science

Full-Stack Semiconductor Solutions for Smart, Secure Industry and Digital Energy NSING Technologies delivers full-stack semiconductor solutions for industrial automation, AI data centers & digital energy, combining high-performance MCUs, security chips & BMS components. Its technologies enhance efficiency, security, reliability & sustainable power management. EE Times

GlobalFoundries sees 'strong' demand for Chinese optical modules amid data centre boom GlobalFoundries is increasing investment in silicon photonics, advanced packaging and local manufacturing as AI data centers drive Chinese demand for optical modules. The chipmaker also aims to support suppliers and strengthen global supply chains. South China Morning Post

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

Technical Papers ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications MORE TECHNICAL PAPERS

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Google plans test of space chips in Project Suncatcher Google will launch a prototype satellite for Project Suncatcher to test AI chips in orbit, evaluating radiation, extreme temperatures, launch stresses, cooling and laser connectivity. The mission will gather data needed to assess future space-based AI computing infrastructure. Taipei Times

Huawei's Tau Law Takes Commercial Form Huawei is advancing chip scaling without EUV through LogicFolding, vertically stacking silicon to shorten signal paths, boost density and reduce power. The Kirin 9050 Pro demonstrates the approach in its Mate XT 2 tri-fold smartphone, despite manufacturing challenges. EE Times

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors India's new semiconductor incentive regime shifts more investment risk onto manufacturers, yet early commitments show companies remain willing to pursue fresh projects despite reduced subsidies and greater exposure to potential capital losses. Digitimes

GlobalFoundries accelerating global capacity expansion, official says GlobalFoundries plans to expand global chip capacity as AI drives surging RF and semiconductor demand. Singapore will play a key role, while the company strengthens Taiwan engagement, expands GaN technology and grows its local MIPS R&D team. Taipei Times

Sponsor actnano Materials with Nordson Equipment actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more! Nordson Electronic Solutions

Managing 3D-IC Design And IP Multi-chiplet integration boosts flexibility and performance but complicates data management. Strong IP management, revision control and traceability help teams prevent errors, improve collaboration, speed verification and deliver reliable designs. Semiconductor Engineering

When AI Agents Cross Chip Design Silos Specialized AI agents and small language models are transforming chip design and manufacturing by tackling targeted tasks. Multi-agent orchestration, human oversight and trusted data improve verification, optimization and production efficiency. Semiconductor Engineering

Sponsor GRYPPER SOCKETS at Ironwood Electronics Ironwood Electronics now offers True Zero Footprint BGA Memory Sockets and Grypper DDR sockets. Learn more. Ironwood Electronics

A Network-on-Chip (NoC) For Multi-Die Devices Chiplet-based physical AI systems are exposing limits in coherent die-to-die protocols. Transporting native NoC packets across chiplet boundaries could cut overhead, latency, buffering and complexity while supporting massive accelerator data streams. Semiconductor Engineering

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Managing 3D-IC Design And IP Heterogeneous multi-chiplet designs boost flexibility but complicate data management. Strong IP controls, traceability and revision tracking help teams coordinate design changes, prevent version errors and avoid costly failures before tape-out. Semiconductor Engineering