June 29, 2026

Realizing The Future Of 3D-IC Design Heterogeneous chiplet technology reshapes semiconductor design by enabling flexible, efficient system-in-packages. However, legacy single-die tools fall short, driving system-centric workflows, digital twins, and co-optimization to improve performance, cost, and reliability while managing complex, evolving design data. Semiconductor Engineering

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

IBM Shows Sub-1-nm Chips, Targeting Production in 5 Years IBM announced a 0.7-nm nanostack chip technology enabling nearly 100 billion transistors and 3D stacked nanosheets, targeting production within five years. It promises 40% better SRAM scaling, easing AI memory bottlenecks and extending semiconductor scaling for a decade. EE Times

Peer viewpoint: semiconductor innovation for telecommunication networks Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure. Technical Paper

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Chip Industry Week In Review IBM unveiled a 7Å transistor architecture using staggered nanosheet transistors stacked at a beveled roof-tile-like angle to increase density, boosting performance by 50% or power efficiency up to 70% while improving SRAM scaling 40%, with mass production planned for 2031. Semiconductor Engineering

Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030 Lenovo expects elevated DRAM and NAND memory prices to remain the industry standard through 2030 as AI demand continues to outpace supply. The company says higher component costs will keep pressure on PC and device pricing for years. TrendForce

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

The memory shortage shaking Apple and Microsoft is ‘existential crisis’ for smaller players Memory chip shortages and soaring DRAM prices force Mono Technologies and other electronics makers to rethink production, as costs surge up to 260%. While giants like Apple and Microsoft raise prices, smaller firms face margin pressure, delays, and existential risks. CNBC

Samsung, SK Hynix plan AI spending push: report Samsung Electronics and SK Hynix plan to unveil massive new investment programs, including Samsung’s reported $646 billion decade-long spending package, as they meet South Korea’s president to boost semiconductor, AI data center, and physical AI expansion initiatives. Taipei Times

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ON Semiconductor records worst day since 2020 as CEO defends Synaptics deal ON Semiconductor announced an all-stock acquisition of Synaptics to accelerate its push into edge and physical AI, expanding its addressable market to $243 billion by 2030. CEO Hassane El-Khoury defended the strategy despite a sharp share decline. CNBC

Synaptics Acquisition by Onsemi Affirms Edge AI Is for Real onsemi CEO Hassane El-Khoury leads a $7 billion all-stock acquisition of Synaptics to expand from power and sensing into edge and physical AI, integrating compute, connectivity, and HMI technologies to target intelligent systems across automotive, industrial, and consumer applications. EE Times

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

IBM debuts world's first sub-1 nanometer chip technology IBM unveils first sub-1 nm (0.7-nm) chip using 3D nanostack architecture, packing nearly 100 billion transistors. It doubles density over 2 nm chips and boosts performance by 50% or energy efficiency by 70% for AI and computing applications. Nano Werk

The PQC Silicon Is Here Today for Tomorrow’s Quantum Threats New security chips embed post-quantum cryptography hardware accelerators to future-proof devices against quantum threats. STMicroelectronics’ ST54M and Samsung’s S3SSE2A integrate secure elements, NFC, and eSIM functions, enabling faster, hardware-level encryption and protecting mobile and edge devices from emerging attacks. EE Times

Sponsor Discover Real Operational Strategies from Proven Global Leaders In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required. Intraratio

Government to Fund 100% of Regional Semiconductor Infrastructure President Lee Jae Myung calls for industrial multipolarization beyond the capital region, pledging large-scale high-tech investments across provinces. The government proposes semiconductor support covering up to 100% infrastructure costs while Samsung Electronics and SK Hynix plan major regional investments. The Chosun

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