July 15, 2026

Semiconductor Equipment Sales Forecast to Reach a Record $229 Billion in 2028 SEMI forecasts global semiconductor equipment sales will hit a record $165.9 billion in 2026, up 23.2%, as AI fuels investment in leading-edge logic, HBM, memory, test and packaging. Spending is expected to climb to $229.5 billion by 2028. SEMI

Sponsor 1 of 10 Applications: Die Sorting Die sorting with Swiss made Tresky die bonders is just one of many powerful applications. Switching between them is a matter of minutes, and training could not be simpler. Dr. Tresky AG

Electronic Design Industry Rides Chip Wave, APAC Leads Q1 2026 Growth Growing demand for in-house chip design lifted the EDA market 12.7% year over year to $5.7 billion in the first quarter of 2026. New entrants, including hyperscalers and Apple, fueled spending on design tools, IP, verification, and engineering services. EE Times

Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Technical Paper

Sponsor Sintering Bonding Process During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes. Tresky Automation

China's Dongfang Suanxin Unveils HBM-Free 14nm AI Chip, Claims Higher Memory Bandwidth Than NVIDIA H200 Shanghai start-up Dongfang Suanxin unveiled its 14nm DF1000 AI chip, using a software-defined, near-memory architecture to reduce reliance on advanced nodes and HBM. It targets late-2026 mass production and plans future chips to challenge NVIDIA. TrendForce

SK Hynix is a golden goose that has to lay more eggs South Korea's K-power gains global attention as SK Hynix's record US$26.5 billion U.S. listing underscores its AI memory leadership. The chipmaker must balance government goals, U.S. expansion, investor demands and industry risks to sustain profits. Taipei Times

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor S-Connect™: Advanced Bridge Die Solution Introducing Amkor's new S-Connect™, S-SWIFT™ with an embedded silicon bridge, delivering improved power integrity and signal performance. Amkor Technology

UMC starts mass production of silicon photonics wafers in Singapore UMC has begun mass production of silicon photonics wafers at its Singapore fab with Silith Technology, enabling high-volume 1.6T optical interconnects for AI data centers. The partners also plan next-generation 400G/lane products to meet rising AI networking demand. Taipei Times

Powerchip raising prices Powerchip raised DRAM prices by 45% and increased power management and display driver chip prices by 10–15%, citing persistent supply shortages. The company expects stronger margins, AI-driven foundry growth, and expanded advanced packaging capacity to fuel revenue growth. Taipei Times

Sponsor Recover Valuable Components and Reduce Electronics Costs Don't let usable components go to waste. Learn component recovery methods that reduce material costs, extend inventory value, and support sustainable manufacturing. Circuit Technology Center

Global AI boom sees China's chip exports nearly double in first half of year China nearly doubled integrated circuit exports in the first half of 2026 as surging global AI demand lifted shipments of chips, computing hardware, AI devices and industrial robots. The export boom strengthened China's innovation-led growth despite trade headwinds. South China Morning Post

Spain Semiconductor Industry Convenes to Forge Domestic Alliances Spain's semiconductor sector strengthened collaboration through MatchMaking Day, connecting companies with partners, funding and localized supply chains. The initiative advances RISC-V and analog design tools, cuts development risks, and accelerates innovation across Europe. EE Times

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

AI Models On The Edge Quadric says successful edge AI with small language models depends on optimizing hardware and software together, not shrinking models alone. It advocates flexible NPUs, application-specific tuning and open-source software to extend product lifecycles and strengthen differentiation. Semiconductor Engineering

Research Bits: July 14 Researchers unveiled three sustainable electronics advances: a cerebellum-inspired memtransistor that doubles anomaly detection speed while reducing AI energy use, a biodegradable fungal PCB, and a doping method that improves organic semiconductor performance and stability. Semiconductor Engineering

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Chinese AI labs to challenge Thinking Machines Lab with new industry focus Former Chinese AI leaders are steering away from the frontier AI race, launching Yoolee AI and InfiX.ai to build cost-efficient, industry-specific AI models and agents that deliver practical business value while protecting enterprise data and reducing computing costs. South China Morning Post

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection