July 10, 2026

As AI Moves from Training to Inference, Optics Moves Closer to the Chip As AI inference workloads grow, connectivity—not compute—emerges as a key bottleneck. Imec advocates moving optics closer to processors through 2.5D and eventually 3D optical I/O, cutting power, reducing latency, and enabling scalable, high-bandwidth AI systems for future demands. EE Times

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Where Does Quantum Computing Stand? Quantum computing is advancing as researchers and startups improve hardware, algorithms and error correction. Early commercial systems will complement classical computers as specialized accelerators, driving breakthroughs in defense, networking and sensing. Semiconductor Engineering

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

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TSMC PIC Capacity Seen Surging to 25K Wafers/Month by 2028; NVIDIA, Broadcom Eyed as Early COUPE Customers TSMC is rapidly expanding silicon photonics capacity, positioning its COUPE platform for AI-driven optical networking. Rising PIC output is expected to accelerate CPO adoption, support major chipmakers, and boost demand across the photonics supply chain. TrendForce

SK hynix to raise 40 tln won through Nasdaq ADR listing SK hynix will raise US$26.5 billion through a Nasdaq ADR listing, creating the largest U.S. equity debut by a foreign company. The chipmaker will invest the proceeds in new semiconductor manufacturing, advanced packaging and EUV equipment while strengthening its global valuation. Yonhap News Agency

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Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. KYZEN

Soaring server DRAM prices to moderate: report TrendForce expects server DRAM price increases to slow to 13–18 percent this quarter as major US cloud providers secure long-term supply deals. Persistent supply shortages, rising server demand and tighter RDIMM availability will continue supporting memory prices through next year. Taipei Times

Why China is finally letting AI firms buy the Nvidia H200 China plans to let selected firms, including Alibaba, buy limited Nvidia H200 AI chips, while preserving its self-sufficiency strategy. The controlled approvals balance immediate computing needs with long-term domestic chip development and strict government oversight. South China Morning Post

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Meet SK Hynix, the trillion-dollar South Korean chipmaker debuting on U.S. markets SK Hynix will debut on Nasdaq as AI-driven memory demand fuels record growth, raising funds to expand U.S. manufacturing. The HBM leader strengthens its Nvidia partnership while betting AI investment will offset the memory industry's historically volatile boom-and-bust cycles. CNBC

The Expansion Of LPDDR Into Edge AI Platforms As AI shifts from cloud data centers to edge devices and vehicles, LPDDR memory is becoming essential by delivering efficient bandwidth, low power consumption, and compact integration. Its performance-per-watt enables real-time AI inference while meeting reliability requirements. Semiconductor Engineering

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

AI Is Rewriting The IP Playbook AI is reshaping semiconductor IP development by speeding design, verification, customization, and lifecycle management. While it automates coding, testing, and debugging, engineers remain vital to ensure quality, reliability, and AI-ready IP. Semiconductor Engineering

An AI Model Fit For Purpose AI is reshaping semiconductor design by accelerating model creation & verification, but engineers must validate AI-generated models with trusted data, clear metadata, and human oversight to ensure accuracy, reliability, and safe deployment in increasingly complex chip design workflows. Semiconductor Engineering

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Wall Street Is Misreading the AI Chip Selloff Wall Street wiped more than $1 trillion from semiconductor valuations over AI spending concerns, but industry indicators tell a different story. Rapid HBM shipment growth and expanding AI infrastructure investments suggest demand remains strong, challenging the market's narrative. Dr. Robert Castellano Semiconductor Deep Dive Newsletter

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