semiconductor
packaging news
Sponsor
MicroCircuit-Laboratories-LLC

FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
Industry Press
CEZAMAT Boosts Advanced Photonics R&D with UV Nanoimprint System from EV Group
EV Group
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia
SEMI
ISRL USA and AIIP Sign MOU to Build America's First Dedicated Semiconductor SubFAB R&D Facility
AI Infrastructure Partners
Fraunhofer IPMS opens up new possibilities for industrial communication with LI-FI GRATHUS®
Fraunhofer IPMS
Seika Machinery Introduces the Laboratory Roll-to-Roll Coater (LR2RC) by infinityPV
Seika Machinery
STMicroelectronics reveals high-precision op amps for 4V-36V range
STMicroelectronics
PEMTRON Brings Next-Gen X-ray and Wafer Inspection Technologies to SEMICON Southeast Asia 2026
PEMTRON
405 nm OEM Laser for High-Accuracy Raman Spectroscopy
TOPTICA Photonics SE
MORE INDUSTRY PRESS
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
XYZTEC
What Year Was It?
The First Earth Day
What Year
Earth Day, an event to increase public awareness of the world's environmental problems, is celebrated in the United States for the first time.
See the answer below.
Tresky
Sponsor
Balazs-Nanoanalysis

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
AI-Technology-Inc
Sponsor
Nordson-ASYMTEK

New PLP solution improves underfill yields
Underfill yields were greater than 99% and cycle time decreased 30% with the ASYMTEK Vantage system for panel-level packaging (PLP). Learn more.
Nordson Electronics Solutions
What Year Was It Answer
The First Earth Day
Answer: April 22, 1970
April 22, 2026
Intel-Backed Firm Breaks Ground on India's 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually
Intel expands advanced packaging as its backed 3D Glass Solutions breaks ground on India's first 3D chip packaging plant in Odisha. The integrated site will make glass substrates, assembled units and 3D modules for AI, HPC, defense and automotive, as India seeks more chip investment.
TrendForce
Sponsor
CyberOptics

Corner fill inspection
A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly.
Nordson Test & Inspection
SK hynix Reportedly Breaks Ground on First U.S. Advanced Packaging Plant in Indiana, Eyes 2H28 Production
SK hynix breaks ground on its first U.S. fab in Indiana, targeting 2028 production of next-gen AI memory like HBM4E and HBM5. It ramps advanced packaging and DRAM capacity at home, investing heavily and adding EUV tools to boost output and meet rising AI demand.
TrendForce
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Technical Paper
Sponsor
Pac-Tech

Turnkey Electroless Plating Solutions
PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success.
PacTech
Apple's elevation of silicon head Johny Srouji signals sprint to build in-house chips for all devices
Apple named John Ternus CEO and promoted Johny Srouji to chief hardware engineer, strengthening its in-house silicon strategy. The move advances custom chip development for iPhones and Macs, boosting integration, AI capabilities & reduced reliance on external suppliers.
CNBC
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
Semiconductor manufacturing shifts to chiplets and heterogeneous integration, using wet processing, electrochemical plating, PECVD, and panel-level packaging to boost precision, scalability, and sustainability while meeting AI, 5G, and HPC demand and replacing legacy tools.
3DInCites
Sponsor
kyzen

Does Water Do the Job on Its Own?
Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more.
KYZEN
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Indium-Corporation

No-Clean, Flip-Chip and Ball-Attach Flux
Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications.
Indium Corporation
Apple Eyes Product Engineering Revival with CEO Transition
Apple replaces Tim Cook with hardware chief John Ternus as CEO on Sept 1, shifting leadership toward product innovation. Cook becomes executive chairman. Ternus must advance Apple silicon success and revive AI efforts including Siri amid rising competition.
EE Times
The OSAT Explosion: Why CG Semi and Kaynes are the Real Architects of India's Chip Independence
India's semiconductor industry shifts in 2026 as firms expand beyond design into manufacturing. In Gujarat's Sanand region, companies like CG Semi and Kaynes Semicon build OSAT and ATMP facilities, strengthening infrastructure for 'Made in India' chips powering global electronics.
BISinfotech
Sponsor
Amkor-Technology

Amkor's System in Package (SiP) Solutions
Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more.
Amkor Technology, Inc.
The Changing ASICs Landscape: the Shift Toward Chip Disaggregation
AI reshapes ASIC design toward system-specific, modular, disaggregated architectures. Advanced packaging and multi-die integration optimize performance via cross-domain collaboration, but raise verification complexity, driving reusable IP, co-design, and partnerships.
EE Times
Research Bits: Apr. 21
Researchers build edge AI by mapping models onto memristor crossbars and demonstrating neuromorphic designs. Advances in ultra-thin memory and brain-inspired nickelates enable low-power computing and better signal processing.
Semiconductor Engineering
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Apple incoming CEO John Ternus faces a defining challenge: Fixing the company's AI strategy
Apple names hardware chief John Ternus CEO as Tim Cook steps down, pushing investors to demand a clearer AI strategy. The company lags rivals in generative AI, relying on partners while betting on integrated devices and future AI hardware.
CNBC
Hong Kong can advance AI beyond the confines of geopolitical rivalry
Analysts argue global AI is not just US–China rivalry but a multipolar system where middle powers shape outcomes. Hong Kong can position itself as a responsible governance hub, leveraging its legal system, education links, and regional partnerships.
South China Morning Post
Sponsor
Plasmatreat-GmbH

Low Pressure Plasma for Electronics
Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production.
Plasmatreat
The Global Semiconductor Talent Shortage
Semiconductor shortages drive major US and EU investments like the CHIPS Act to expand production and talent pipelines. As the industry heads toward $1 trillion by 2030, companies and governments race to address a growing global skills shortage.
Deloitte
Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
Today's Sponsor
Henkel-AG-Co
Sponsor
Henkel-AG-Co

What do 81.3 % of automotive chip specialists agree on?
That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels.
Henkel AG & Co.
Test Your Knowledge
Which one of these structures is the oldest: Taj Mahal, Leaning Tower of Pisa, Tower of London
See answer below.
Uyemura
Quote of the Day
"The first rule of any technology used in a business is that automation applied to an efficient operation will magnify the efficiency. The second is that automation applied to an inefficient operation will magnify the inefficiency."
Bill Gates
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
Surfx-Technologies
Cartoon of the Day
Cartoon
"Global warming is a good thing - more hot prospects, no more frozen assets!"
Copyright © Randy Glasbergen
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Ontos-Equipment-Systems
Test Your Knowledge Answer
Which one of these structures is the oldest: Taj Mahal, Leaning Tower of Pisa, Tower of London
Answer: Tower of London is the oldest structure built in 1078. Taj Mahal was built between 1631 and 1648 and the Leaning Tower of Pisa was built in 1173.