Sep 17, 2026 Semiconductor Packaging and Testing Turn into a Major Battle Spot in 2026 AI-driven demand is fueling a major 2026 investment surge in semiconductor packaging and testing, with six leading firms expected to spend $19 billion. Advanced packaging, HBM and niche services are reshaping supply chains and creating new opportunities. Global Sources

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

SK hynix Reportedly Explores Leasing Intel's Ohio Fab, Could Produce Memory in U.S. for First Time SK hynix is exploring a deal with Intel to make memory chips in Ohio, potentially leasing part of Intel's delayed fab site or forming a venture with cloud firms. Seoul may review advanced HBM or DRAM production as a national core technology. TrendForce

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

Sponsor Swiss made die bonders from Tresky Ideal for high-mix, low-volume production at highest quality. They are perfect for many uses, just like a Swiss Army Knife. Operator training takes only minutes. Dr. Tresky AG

The Memory Chip Crisis Washington Can’t Ignore AI-driven demand has quadrupled memory prices, pushing companies toward Chinese suppliers. The author urges Washington to boost domestic production, streamline investment rules and carefully craft tariffs to expand supply, protect jobs and stabilize prices. National Review

Ex-HiSilicon Chip Chief's Startup Reportedly Raises $100M, Targets Ultra-Large AI Models on a Single Chip Jiuwanli Future Technology, founded by former Huawei HiSilicon executive Peng Chen, has raised over $100 million to develop edge AI inference chips. The startup aims to run ultra-large models on a single chip with low latency and power use. TrendForce

Sponsor How LAPLACE® Laser Assisted Bonding Saves Energy LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo. PacTech

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Arm CEO says he's more confident its new AI chip can meet a loftier $2B revenue goal Arm CEO Rene Haas expressed growing confidence in meeting $2 billion in AGI CPU revenue expectations, citing improved supply prospects. The company is expanding beyond chip-design licensing into direct chip sales amid strong data center demand and manufacturing constraints. CNBC

Nanoscale mechanics could enable brain-inspired computing MIT researchers developed a nanoscale computing platform using soft polymers to combine memory and processing in one energy-efficient device. Inspired by neurons, the technology could enable adaptive electronics, smart prosthetics, wearable health monitors, and intelligent robots. MIT News

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Global power grid to struggle, TrendForce says TrendForce forecasts global data center power demand will surge to 490.7GW by 2030, outstripping available grid capacity of 222.6GW. Growing electricity needs and grid-delivery delays could widen supply shortages, particularly in the US, after 2028. Taipei Times

SK Hynix mulling making chips in US SK Hynix is exploring a partnership with Intel to manufacture memory chips in Ohio, potentially expanding US production amid AI-driven shortages. The deal could support Intel and US manufacturing goals but faces South Korean regulatory hurdles and higher costs. Taipei Times

Sponsor Amkor's Double Sided Molded BGA Solutions To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate. Amkor Technology, Inc.

S. Korea cannot afford to slow down AI development South Korea's science minister Bae Kyung-hoon urged continued AI development to protect technological progress, industrial competitiveness & national security. He emphasized balancing innovation with safety & public trust amid global debates over slowing AI advancement. Yonhap News Agency

Moving Test Data Faster As chip designs grow more complex, testing requires more data and faster transfer. Siemens EDA's Vidya Neerkundar explains available test options, their applications, and how industry standards influence design-for-test processes and testing efficiency. Semiconductor Engineering

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Enabling Efficient Edge AI Inferencing Through Ecosystem Collaboration DEEPX, Rambus, and Samsung Foundry developed a scalable LPDDR platform for edge AI, combining processor architecture, memory interface technology, and advanced manufacturing to cut development risks and boost next-generation system performance. Semiconductor Engineering

Sponsor Trace Analytical for Semiconductor Industry Balazs™ provides the following analytical services with a commitment to absolute quality control: Water analysis, Chemical analysis, Gas analysis, Particle analysis, Material analysis, Part analysis, and Cleanroom Evaluation analysis. Balazs Nanoanalysis

China's domestic storage chips are catching up at an astonishing pace, with the technological gap being roughly 1 year for NAND, 2 years for DRAM and 3 years for HBM. China's memory chipmakers are narrowing the gap with South Korean leaders, advancing NAND, DRAM and HBM. YMTC and CXMT are expanding capacity and adopting advanced technologies despite equipment and manufacturing challenges. European Central Station