February 26, 2026

Back-End Automation Tackles Growing Complexity Industry experts from Semiconductor Engineering, Cohu, yieldWerx, Onto Innovation and ASE examined back-end automation in advanced packaging, stressing data analytics, yield gains, inspection complexity and integration hurdles as chipmakers scale next-gen technologies. Semiconductor Engineering

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

VIEWPOINT 2026: Adrienne Downey, Senior Market Research Analyst, TechInsights Artificial intelligence (AI) and high-performance computing (HPC) will continue to lead demand for advanced semiconductor nodes, memory and packaging through 2026. New technologies such as co-packaged optics (CPO) and silicon photonics (SiPho) are gaining momentum and are moving from research ... TechInsights

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Technical Paper

Sponsor Analysis Of Multi-Chiplet Package Designs and Requirements This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Amkor Technology

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026 Surging AI and HPC chip demand is keeping TSMC's CoWoS capacity tight through 2026, prompting ASE Holdings and PTI Group to accelerate FOPLP expansion. Vendors target mass production by 2027 as panel-level packaging gains momentum. Digitimes

Why SJ Semiconductor matters in Chin's race to build home-grown AI chips SJ Semiconductor won approval to list on Shanghai's Star Market, advancing China's semiconductor self-reliance push amid US curbs. The company plans a 4.8 billion yuan IPO to expand 3D packaging capacity and meet surging domestic AI chip demand. South China Morning Post

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

Nvidia's Jensen Huang says markets 'got it wrong' on AI threat to software companies Nvidia CEO Jensen Huang said markets misjudge AI's threat to software firms, arguing agentic AI will enhance—not replace—enterprise tools like ServiceNow and SAP. He spoke after Nvidia posted strong quarterly revenue growth and upbeat guidance driven by AI demand. CNBC

Nvidia has no H200 sales in China, US official says Nvidia Corp has not sold any H200 chips to China two months after the Donald Trump administration permitted shipments, as strict export rules stall approvals. The US Commerce Department is intensifying crackdowns on chip smuggling and enforcement violations. Taipei Times

Sponsor BGA Socket - Prototype to Reality Products designed with high- perf. integrated circuits, BGA socketing systems are an essential option during design, testing, and/or production phases of a new product development process. Ironwood Electronics

TSMC market cap swells to US$2tn on rally Taiwan Semiconductor Manufacturing Co. surpassed a US$2 trillion market capitalization after its ADRs jumped 4.25%, as surging AI demand drove record revenue and global investor inflows. The rally lifted Taiwan stocks, cementing TSMC's dominance in global semiconductor markets. Taipei Times

Exploring the Next-Gen of Network Communication 6G will redefine global connectivity with terabit speeds, ultra-low latency and AI-driven intelligence. Building on 5G, it will fuse satellites, massive IoT and sustainable design, pushing cost-effective infrastructure to power smart cities, digital twins and next-gen healthcare. EE Times

Sponsor Selective Laser Bonding for Fine Parts Localized laser heating enables precise bonding without heating the full substrate, reducing thermal stress and energy use in advanced packaging. See how it works. PacTech

Nvidia's new AI system Vera Rubin is 10 times more efficient than its predecessor — here's a first look Nvidia gears up for strong earnings as it prepares to launch its next-generation AI rack system, Vera Rubin, later this year. The liquid-cooled platform promises 10x performance per watt, targets major customers, and intensifies competition with Advanced Micro Devices. CNBC

SK hynix to invest additional 21.6 tln won in Yongin chip cluster SK hynix Inc. will invest an additional 21.6 trillion won in its Yongin semiconductor cluster, raising total funding to 31 trillion won through 2030. The company aims to expand AI memory production, including HBM and advanced DRAM, to meet surging global data center demand. Yonhap News Agency

Sponsor Optimize Your Process on Full SMT Demo Line Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start. Heller Industries

The Memory Supercycle: How Allocation Is Creating New Infrastructure Bottlenecks The global memory and NAND flash market has entered a supercycle as AI firms, hyperscalers, and GPU makers soak up supply. Vendors shift to high-margin HBM and advanced NAND, retire legacy nodes, trigger shortages, spike prices, and strain 2026 data center builds. EE Times

Sponsor Particle-Free Plasma Oxide Reduction Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies