July 8, 2026

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging Rising AI and HPC demand is accelerating panel-level packaging adoption, forcing chip manufacturers to upgrade inspection and metrology systems. Shrinking features, higher layer counts, and larger panel sizes require advanced defect detection, 3D measurement, and warpage control to maintain yield and reliability. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

World working together ‘as one ecosystem’ on RISC-V chip research: executive Alibaba vice-president Qi Xiaoning said global collaboration on the open-standard RISC-V chip architecture remains strong despite US-China tensions. He highlighted Alibaba’s RISC-V advances, praised international cooperation, and said Hong Kong could become a key hub for chip design and future RISC-V events. South China Morning Post

Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity. Technical Paper

Sponsor New Quadra Pro Manual X-Ray System Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more. Nordson TEST & INSPECTION

Chinese Team Achieved Major Breakthrough in Carbon Nanotube CFET Architecture Researchers at Peking University developed the first all-carbon nanotube CFET digital logic circuits, marking a major advance toward ultra-low-power, high-performance chips that could accelerate next-generation AI, edge computing, and semiconductor scaling beyond silicon. TrendForce

Chinese Firms Reportedly Raise Domestic AI Chip Budget Share from 30% to 46% Amid Shift from NVIDIA Chinese companies are increasing domestic AI chip spending from 30% to 46% of their budgets, accelerating the shift away from Nvidia as export restrictions, government support, and stronger local semiconductor suppliers drive greater adoption of homegrown AI hardware. TrendForce

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Achieve Precision in WLCSP Bumping Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts. PacTech

New DRAM Price-Fixing Case Against Samsung, SK hynix, and Micron Tests Whether HBM Expansion Can Prove Collusion A new U.S. lawsuit accuses Samsung, SK hynix, and Micron of restricting DRAM supply under the guise of expanding HBM production for AI, testing whether market shifts can provide evidence of unlawful price-fixing and collusion. TrendForce

Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience Micron and Ford signed a long-term strategic agreement to secure automotive memory and storage supplies for next-generation vehicles. Micron will expand U.S. production, including advanced DRAM manufacturing in Virginia, strengthening supply chain resilience and supporting growing demand for intelligent vehicles. 3DInCites

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Advantech posts record revenue in second quarter Advantech posted record second-quarter revenue as rising edge AI demand fueled strong global sales despite supply chain pressures. Quanta also achieved record quarterly revenue, driven by robust AI server shipments, and expects to double AI-related revenue this year while expanding its server business. Taipei Times

Samsung results trigger stock rotation Asian tech stocks fell as investors locked in profits despite Samsung’s blockbuster earnings, reflecting growing caution over AI-driven chip valuations. Money rotated into defensive sectors while markets awaited upcoming results from TSMC and other semiconductor leaders amid persistent geopolitical concerns. Taipei Times

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Photoluminescence Inspection Is Changing How Manufacturers Protect Yield In SiC And GaN Devices Power semiconductor manufacturers are adopting advanced photoluminescence inspection and electrical metrology to detect critical SiC and GaN wafer defects, improve yield, and ensure reliability as the industry transitions to larger wafers for high-voltage, high-performance power devices. Semiconductor Engineering

Multi-die Testing In The Field Must Build On Established Test Methodologies AI-driven multi-chip systems are outgrowing traditional testing methods, accelerating demand for in-system testing, predictive analytics, and high-speed interfaces such as PCIe to detect, isolate, and repair failures throughout a chip’s lifecycle, improving reliability in AI, automotive, and data center applications. Semiconductor Engineering

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

China’s chip equipment rally faces earnings test as memory boom fuels bets on local tools China’s semiconductor equipment stocks are surging on expectations of strong AI-driven chip spending, localisation and memory expansion. Investors now await first-half earnings to confirm whether rising orders, revenue growth and long-term profitability can justify the sector’s sharp market rally. South China Morning Post

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