March 25, 2026

Arm Releases First in-house Chip, with Meta as Debut Customer Arm Holdings unveiled its first in-house AGI data-center CPU, shifting from licensing to manufacturing. Meta signed on as its first customer, as rising AI demand boosts CPUs' importance and intensifies competition with existing chip partners. CNBC

Sponsor Proven Die-Attach Pastes and Films Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity. AI Technology, Inc.

Musk's Terafab Vision Raises Questions Over TSMC Impact; Advanced Packaging May be Best Entry Point Elon Musk unveils Tesla's Terafab vision to integrate chips and packaging, but 2nm entry faces steep yield, talent, and equipment hurdles. Tesla may start with advanced packaging and partnerships, gradually reshaping supply chains and boosting its long-term chip autonomy. TrendForce

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

Sponsor 2026 IEEE ECTC – May 26-29 in Orlando The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. ECTC

PC prices in Taiwan expected to rise 25-30% in Q2: Asustek Asustek Computer Inc expects PC prices in Taiwan to rise 25–30% in Q2 as DRAM and SSD shortages, plus limited CPUs from Intel and Advanced Micro Devices, drive costs up, despite steady demand and shipment growth. Taipei Times

Power Module Packaging Evolves as Materials and Supply Chains Redefine Power Electronics Electrification is accelerating demand for power modules, driving rapid advances in packaging for higher performance and reliability. New materials, supply chain shifts, and regional manufacturing are reshaping the market as it races toward $20B by 2031. EE Times

Sponsor Medical Grade, Toughened Epoxy Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation. Master Bond

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

What Will It Take to Build the World's Largest Data Center? Surging AI demand is fueling massive data center builds, led by Meta's 5-GW Hyperion project. Engineers race to solve scale and speed challenges as communities grapple with higher costs, environmental impacts, and growing strain on power infrastructure. IEEE Spectrum

Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference The IMAPS Device Packaging Conference drew record attendance as AI-driven data center investments surged. Leaders stressed sustainable, revenue-backed growth, rising adoption, and advanced packaging's key role in boosting performance, efficiency, and next-gen computing. 3DInCites

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Alibaba reveals new AI chip designed for 'agents' Alibaba unveiled its XuanTie C950 CPU to boost agentic AI capabilities, enabling efficient multi-step task processing in data centers. Built on RISC-V architecture, the chip enhances performance and reduces reliance on restricted foreign semiconductor supply chains. CNBC

Anthropic says Claude can now use your computer to finish tasks for you in AI agent push Anthropic upgrades Claude with agentic computer-use, enabling users to delegate tasks as the AI opens apps, browses, and edits files. The move ramps up rivalry with OpenClaw, while Anthropic warns the early-stage feature includes safeguards. CNBC

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Research Bits: Mar. 24 Researchers at DGIST, the University of Cambridge, and Penn State advance dual-gate transistor designs, boosting nanoscale stability, scalability, and sensitivity. Their work enables low-power 3D chips and highly responsive biosensors for precise chemical detection. Semiconductor Engineering

SK hynix to purchase 12 tln won worth of chip equipment from ASML SK hynix commits 12 trillion won to buy advanced EUV scanners from ASML, aiming to boost next-generation chip production by 2027. The investment supports rising AI-driven demand and accelerates its shift to sixth-generation technology, strengthening its memory market leadership. Yonhap News Agency

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Surging demand for AI agents fuels Hong Kong's race to expand computing power Chinese chip executives warn autonomous AI agents will unleash volatile, surging compute demand. Hong Kong responds by planning a 36-fold capacity expansion through a new supercomputing hub, reinforcing China's fast-growing global infrastructure push. South China Morning Post

Sponsor Epoxy & Adhesive DIE Bonding One of the most common methods of creating a connection between chip and substrate is the gluing process. Extreme precise epoxy & adhesive bonding processes for sustainable bonds. Tresky Automation