March 4, 2026

Wafer Capacity Set to Surge: A New Phase for the SiC Industry in 2026 Global SiC leaders like Wolfspeed, Infineon Technologies and STMicroelectronics pivot toward AI data centers as EV demand slows, accelerating 8-inch capacity ramps and cost realignment ahead of a pivotal 2026 industry shift. TrendForce

Sponsor A Lifespan of Reliability Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions. Nordson Electronics Solutions

VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation Innovation is at the core of our culture, and we will continue expanding our product offerings in 2026. This includes advanced packaging materials and metal thermal interface materials designed to support high-performance computing, particularly AI-driven applications, where power density and thermal performance ... Indium Corporation

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

ASML goes beyond EUV and focuses on packaging ASML is pivoting beyond transistor miniaturization as physical limits stall Moore's Law, investing heavily in advanced packaging and 3D chip stacking. With its Twinscan XT:260, the company targets AI-driven demand and positions itself across the entire semiconductor value chain. Innovation Origins+

Follow The AI Leader The AI race in electronic design echoes IBM's once-safe dominance, but no clear leader has emerged. Tech giants build powerful in-house tools, EDA firms guard expertise & startups chase disruption, leaving a fragmented, unpredictable landscape as companies seek trusted AI partners. Semiconductor Engineering

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor How copper sintering could reshape WBG devices From EVs to energy infrastructure, WBG devices demand more. Read this 5-minute article on why copper sintering is gaining momentum. Henkel AG & Co.

SK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gaps SK hynix is overhauling HBM4 packaging to boost stability and speed as I/O doubles to 2,048. By thickening DRAM and narrowing layer gaps, it targets NVIDIA performance goals while easing power and signal challenges, with validation under way. TrendForce

MIPS, GlobalFoundries Bet on Physical AI MIPS speeds its comeback by acquiring Synopsys's ARC IP and going all-in on RISC-V to target physical AI and automotive markets. With 200 million deployed SoCs and a Mobileye EyeQ7 win, it advances customizable, real-time, safety-certified chips for software-defined vehicles. EE Times

Sponsor 2026 IEEE ECTC – May 26-29 in Orlando The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. ECTC

Apple raises MacBook prices across the board as M5 chips, new displays signal AI-first strategy Apple unveiled new MacBook Pro and Air models powered by M5 chips and refreshed its Studio Display lineup, aiming to revive slowing Mac sales. The higher-priced machines promise major AI performance gains and faster on-device processing to spur upgrades. CNBC

AP Memory optimistic on demand AP Memory Technology expects robust AI and HPC demand to lift revenue this year as clients pivot from scarce standard DRAM to customized memory. Growing silicon interposer and capacitor sales, along with new VHM chips, should fuel sustained growth despite last year's profit dip. Taipei Times

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

Inside IISc Bangalore's CeNSE Lab: From Wafer to Finished Device The Centre for Nano Science and Engineering at the Indian Institute of Science drives end-to-end semiconductor prototyping, from wafer fabrication to packaging and testing, helping startups and industry bridge research and early manufacturing to boost India's chip ecosystem. EE Times

New Challenges In Signoff As multi-die architectures and advanced nodes heighten chip complexity, signoff grows tougher under tight deadlines. Marc Heyberger of Cadence Design Systems details full-chip timing, flat vs. hierarchical analysis, 3D-IC advances, and AI's rising role in design. Semiconductor Engineering

Sponsor SEMICON China 2026: Shanghai March 25-27 Sessions and forums on advanced packaging, materials, power, design, supply chain, smart manufacturing, sustainability, and more. SEMI

Research Bits: Mar. 3 Researchers boost chip defect detection with electron ptychography, a multimodal SQUID microscope, and combined microscopy. The tools expose atomic-scale flaws, interface roughness, and hidden stacking faults, speeding root-cause analysis and improving device reliability. Semiconductor Engineering

Sponsor High Density I/C Substrates – 50um "Stay Flat" CORES - USA FAB Interposers/High Layer Counts – Low Loss/Low CTE Materials – 20µm Dielectrics /12µm Traces - ITAR Registered. Learn more. Advanced Component Labs, Inc.