June 10, 2026

As Chips Go Vertical, Metrology Struggles to Keep Up Chipmakers shift advanced manufacturing to complex 3D structures, pushing traditional inspection to limits. They adopt inline non-destructive metrology—fast AFM X-ray—to detect buried defects, improve control, and enable angstrom-scale production. EE Times

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Co-Packaged Optics Testing Faces Steep Data Center Ramp Co-packaged optics (CPO) promises faster, more energy-efficient data center connectivity, but scaling production requires flexible testing of integrated optical and electrical components. Industry experts highlight challenges to achieve high-volume manufacturing. Semiconductor Engineering

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

India's 2035 Chip Ambitions Focus on Targeted Design, Manufacturing Leadership India unveiled a roadmap to build a $120–150 billion semiconductor ecosystem by 2035, targeting design, mature-node chips, packaging, and materials. Stronger incentives. partnerships, and workforce development are boosting confidence in the plan. EE Times

Samsung tops global chipmakers with nearly 90 tln won in investment Samsung Electronics led global semiconductor investment in 2025, spending 89.9 trillion won on capital expenditures and R&D. The company maintained aggressive investment despite a 2023 profit slump, positioning itself to benefit from the industry's recovery and future growth. Yonhap News Agency

Sponsor Award Winning Acquisition Mode Dynamic Planar CT Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure. Nordson Test & Inspection

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

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Rethinking the Logic-Routing Tradeoff in FPGAs Efinix unveiled its Titanium Edge FPGA family for edge AI, leveraging its XLR architecture to dynamically balance logic and routing. The chips deliver higher performance, lower power consumption, flexible AI processing, and integrated HyperRAM support for faster deployment. EE Times

Upstart chipmakers keep challenging Nvidia. This time it’s Microsoft-backed D-Matrix D-Matrix has begun shipping its Corsair AI inference chips, claiming up to 10x faster performance and 5x better energy efficiency than Nvidia GPUs on smaller workloads. Backed by major customers and investors, the startup is targeting a profitable niche in the AI inference market. CNBC

Sponsor Auer Carries of Hermetic Packages for Seam Sealing Hermetic Packages and Covers will be sealed one at a time, with automated seam sealing using AI. The Robotic Cover Sealer (RCS) is a cleanroom seal processor. MicroCircuit Laboratories, LLC

With a global AI data shortage looming, China boosts its own supply China is accelerating its AI strategy with a push to expand, standardise and commercialise industry-specific data sets. By promoting synthetic data, automated labeling and data-driven finance, it aims to secure high-quality training resources and boost global AI competitiveness. South China Morning Post

China chip giants form US$577 million 'patient capital' fund to counter US tech curbs China's top tech firms, including CXMT and Alibaba, have launched a 3.91 billion yuan fund to back long-term semiconductor and deep-tech innovation. The move advances technological self-reliance, counters US export curbs and strengthens China's domestic chip ecosystem. South China Morning Post

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AI Models Transform Defect Inspection And Review, But Can Fail To Scale AI is advancing semiconductor defect inspection by raising yields, detecting hidden flaws, and cutting false alarms. Manufacturers are scaling AI with physics-based models to handle growing data volumes and improve inspection precision. Semiconductor Engineering

What I Learned At The 2026 GSA Tech Summit: The Future Of Semiconductor Collaboration Is Full Stack The GSA Tech Summit highlighted the need for effective collaboration across the semiconductor ecosystem as manufacturing complexity accelerates. Industry leaders emphasized that success now depends less on scale and more on operational coherence and cross-sector partnerships. Semiconductor Engineering

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

Why Analog And Mixed-Signal Chips Resist Adaptive Test IEEE 2427-2025 defines a standardized framework for analog and mixed-signal test coverage, helping chipmakers balance quality and cost. separating process variation from soft failures limits adaptive testing and analytics-driven test reduction. Semiconductor Engineering

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