February 16, 2026

Can Hyperscalers Justify Their Huge AI Capex? Tech giants are ramping AI-driven spending, with Amazon, Microsoft, Meta, and Alphabet set to invest up to $700 billion this year in data centers, fueling market jitters as investors question returns, balance sheet risks, and uncertain payback timelines. CNBC

Sponsor New PLP solution improves underfill yields Underfill yields were greater than 99% and cycle time decreased 30% with the ASYMTEK Vantage system for panel-level packaging (PLP). Learn more. Nordson Electronics Solutions

VIEWPOINT 2026: Konrad Roessler, CEO, Heidelberg Instruments Mikrotechnik GmbH In 2025, Heidelberg Instruments, a supplier of direct-write lithography tools for R&D and industry, saw an increased demand from semiconductor packaging industry. The advantages of "maskless" are well-known: adaptability to distorted substrates, resolution below 2 microns, sharp patterns on warped substrates ... Heidelberg Instruments Mikrotechnik GmbH

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

Sponsor Turnkey Electroless Plating Solutions PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success. PacTech

Chip Industry Week In Review U.S. lawmakers are pushing stricter export controls on advanced semiconductor equipment to China, citing national security risks. The debate includes potential chip tariff exemptions for U.S. tech giants, Taiwan's resistance to production shifts, and Applied Materials' $252 M penalty. Semiconductor Engineering

SMIC says rushed AI chip capacity could end up idle China's top chipmaker SMIC warns AI-fueled demand is accelerating data center construction years ahead of need, risking underused sites. Heavy investment by global and domestic tech giants tightens memory supply, as SMIC posts a $173 million profit and boosts capital spending. Taipei Times

Sponsor Copper vs silver: a turning point for WBG die attach Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost. Henkel AG & Co.

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Plasma Etch PE-Avenger The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal. Plasma Etch

NVIDIA May Relax HBM4 Specs as Samsung and SK hynix Reportedly Face Capacity, Yield Limits Competition in HBM4 intensifies as Samsung begins mass shipments, edging past SK hynix and Micron. Yet supply hinges on NVIDIA's procurement strategy, as yield limits and tight capacity may push it to balance 11.7Gbps targets with lower-tier options. TrendForce

China moves deeper into liquid cooling as AI data centres push their thermal limits China's tech supply chain is ramping up liquid cooling investments as AI data centres demand higher power densities. Firms like Envicool, Sanhua and Lansi are scaling fast to meet surging demand, boosting energy efficiency and powering next-gen AI infrastructure nationwide. South China Morning Post

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Applied Materials shares soar after upbeat forecast Applied Materials shares surged 10% after projecting $7.65 billion in fiscal Q2 revenue, beating expectations. CEO Gary Dickerson credited AI-driven demand for memory chips, while regulatory settlements and strong customer orders from Samsung and Micron boosted confidence. CNBC

AI Drives AV Momentum at CES 2026 CES 2026 showcased over 4,100 exhibitors from 62 countries, highlighting AI, IoT, and autonomous vehicle innovations. U.S. companies led in AVs, while Chinese participation fell sharply, and top robotaxi firms—including Uber, Waymo, and Zoox—drew major attention. EE Times

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Qatar's Deep Tech Ambitions Come Into Focus Qatar is leveraging its sovereign wealth fund, the QIA, to aggressively invest across AI, semiconductors, and quantum computing. By funding startups, R&D centers, and talent pipelines, the country aims to build a deep tech ecosystem and secure a leading global position. EE Times

SK chief meets Nvidia, Google CEOs to explore AI cooperation SK Group Chairman Chey Tae-won met U.S. tech chiefs—Nvidia's Jensen Huang, Microsoft's Satya Nadella, Meta's Mark Zuckerberg and Google's Sundar Pichai—to deepen AI partnerships, advancing high-bandwidth memory, AI infrastructure and next-gen data center solutions. Yonhap News Agency

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Samsung starts mass production of next-gen AI chips Samsung Electronics has begun mass-producing its next-generation HBM4 memory chips, boasting speeds 40% above industry standards to meet AI data center demands. The company aims to capture early market leadership, with Nvidia expected as a major customer. Taipei Times

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies