Sep 16, 2026 ASE's SPIL Reportedly Nears Arizona Expansion as TSMC, Amkor Step Up U.S. Advanced Packaging ASE's SPIL is nearing a decision on a new Arizona facility as AI demand boosts advanced packaging needs. ASE, Amkor and TSMC are expanding U.S. capacity, while customers qualify alternative suppliers as CoWoS demand tightens supply through 2028. TrendForce

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more AI Technology, Inc.

Samsung Electro-Mechanics, Qualcomm Reportedly Develop Organic Bridge Packaging, Eye Intel EMIB Alternative Samsung Electro-Mechanics and Qualcomm are developing organic bridges for 2.1D AI packaging, targeting dense die-to-die links without silicon interposers. The approach could reduce reliance on Intel EMIB IP and expand advanced packaging options. TrendForce

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor Reduce the Risk of Tin Whiskers Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk. Circuit Technology Center

OpenAI, Google, Anthropic discussing collaboration on AI safety issues OpenAI, Anthropic & Google are discussing AI safety standards amid growing security concerns. Following calls to slow advanced model development, the companies are exploring industry-led cooperation, voluntary standards and potential federal oversight to address emerging risks. CNBC

TSMC careful about use of AI in sensitive research TSMC is cautiously adopting AI to protect sensitive research data, with COO Y.J. Mii emphasizing human decision-making and safe deployment. While AI supports chip design, engineers must overcome unknown challenges in developing next-generation semiconductor technologies. Taipei Times

Sponsor Premier Semiconductor Packaging Event 3 days featuring 5 technical tracks, 100 exhibitors, panels, posters, professional development, along with strong industry engagement. Keynotes from Qualcomm, Marvell, and Cerebras. IMAPS 2026 on September 28. IMAPS

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

TSMC's Germany venture hits milestone TSMC's Dresden semiconductor fab has reached its topping-out milestone, keeping construction on schedule and within budget. ESMC targets timely completion as Dresden prepares for workforce growth, supplier investment and infrastructure expansion. Taipei Times

Micron union nixes payout deal Micron Taiwan's workers' union rejected the company's one-time payout, demanding a permanent system distributing 15% of operating profits to employees. Negotiations continue, with workers potentially voting on strike action amid rising memory chip demand and record profits. Taipei Times

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

AI Data Centers Have A Stranded Power Problem Data centers waste power through idle hardware, conservative voltage settings and redundant supplies. Engineers use efficient architectures, real-time monitoring and dynamic voltage scaling to boost efficiency while safely using reserved capacity. Semiconductor Engineering

Hardware-Software Co-Design In The AI Era AI can unify hardware and software development, but fragmented teams, incomplete specifications and inaccurate models slow progress. Engineers use virtual prototypes, cloud FPGA testing and specification-driven workflows to accelerate codesign. Semiconductor Engineering

Sponsor What is Hybrid Alignment? Passive and active alignment in one Tresky DIE Bonder ➜ powering flexible, high-precision assembly for advanced packaging. Tresky

Scaling Thermal Analysis From Transistors To Data Centers Semiconductor Engineering convened industry experts from Synopsys, Silvaco, Vinci, Keysight EDA, and Siemens EDA to discuss thermal management and heat-related trade-offs in chip and system design during a private conversation at the recent Design Automation Conference. Semiconductor Engineering

One Processor, One Toolchain Quadric's Chimera GPNPU combines CPU, DSP, and neural processing functions into one software-controlled core, eliminating workload partitioning, multiple toolchains, and complex debugging. Its unified architecture simplifies embedded AI development, integration, and software bring-up. Semiconductor Engineering

Sponsor Particle-Free Plasma Cleaning Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

What U.S.' tariff push means for Korea's semiconductor industry U.S. semiconductor tariffs could pressure Samsung and SK hynix to expand U.S. manufacturing. Korea lacks Taiwan's production-linked exemptions, while shifting policies and broader tariffs could disrupt supply chains and trigger legal challenges over implementation. The Korea Times

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

Advanced Packaging Changes The Rules For Semiconductor Health And Performance SiPs advance Agentic and Physical AI by integrating processors, accelerators, memory and connectivity in heterogeneous packages. Advanced packaging boosts performance and power efficiency but complicates electrical, thermal and mechanical design. Semiconductor Engineering