April 2, 2026

AI's Potential and Limitations in Chip Design Industry experts say AI is rapidly reshaping chip design, automating repetitive tasks, speeding verification, and compressing development cycles. While engineers remain essential, generative AI is boosting productivity and disrupting semiconductor workflows. Semiconductor Engineering

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

Solving the Semiconductor Talent Gap by Connecting and Training Talent to Support Industry Needs The semiconductor industry faces a growing talent gap as demand surges. The SEMI Foundation tackles this with certifications, program endorsements, and microcredentials, helping employers identify skilled workers and preparing a future workforce for critical roles. SEMI

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor Particle-Free Plasma Oxide Reduction Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

TSMC plans 3-nanometre chip production launch in Japan in 2028 TSMC plans to install equipment and begin mass-producing 3-nanometre wafers by 2028 at its second Japan fab, boosting advanced chip output. The plant will produce 15,000 wafers monthly, expanding beyond earlier plans focused on less-advanced semiconductor technologies. Reuters

The Thermal and Power Realities of the AI Era AI-driven demand is rapidly increasing global energy use, pushing data centers toward nearly 945 TWh by 2030. To cope, chipmakers adopt 3D stacking and chiplets, but face thermal, power, and integration challenges that require industry-wide collaboration. SEMI

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Taking on CUDA With ROCm: 'One Step After Another' AMD is intensifying efforts to grow its ROCm AI software stack to challenge Nvidia's CUDA dominance, investing in open-source tools, unified platforms, and developer outreach to boost portability, performance, and adoption across AI and data center ecosystems. EE Times

Intel shares jump 9% after buying back Ireland chip fab in sign of renewed strength Intel shares surged 9% after the company agreed to repurchase Apollo's 49% stake in its Ireland Fab 34 for $14.2 billion, signaling stronger finances, renewed CPU demand in AI computing, and confidence in its integrated chip manufacturing strategy. CNBC

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

Micron Readies Client Storage for AI Micron Technology targets AI-ready desktops and laptops with its new PCIe Gen5 QLC SSD, emphasizing high performance, power efficiency, and local AI processing. The company expects growing demand for on-device AI driven by privacy concerns and limited NAND supply. EE Times

China's Nexchip files for Hong Kong listing as chip expansion race heats up Nexchip Semiconductor filed for a Hong Kong listing to raise capital for expanding wafer production, leveraging strong AI-driven demand and China's self-sufficiency push. The foundry aims to strengthen its mature-node leadership while gradually advancing into 28nm chips. South China Morning Post

Sponsor Explore Reliable Solutions for WLP & PLP For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions. Nordson Electronics Solutions

Five key questions Apple faces entering its second half-century As Apple marks 50 years, it confronts slowing growth, AI uncertainty, and rising competition despite its vast device base and services strength. Leadership succession, geopolitical risks, and the search for a post-iPhone breakthrough will shape its next era. CNBC

Alibaba Launches XuanTie C950 CPU for Agentic AI Alibaba unveils the XuanTie C950, a high-performance RISC-V CPU built for agentic AI workloads. With native AI acceleration, it challenges leading architectures, advances China's tech independence, and narrows gaps with Western and proprietary chip designs. EE Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

AGI CPU: Arm's $100B AI Silicon Tightrope Walk Without Undermining Its Licensees Arm eased licensee concerns with its AGI CPU, targeting a $100 billion AI data center CPU market while avoiding direct clashes with GPUs and hyperscalers. Backed by Meta and partners, it challenges Intel and AMD, though future silicon ambitions remain uncertain. EE Times

Sponsor SQ7000+TM Multi-Function for 3D AOI, SPI & CMM The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system. Nordson Test & Inspection