June 17, 2026

GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up GlobalFoundries expects to deliver the first OCI MSA-compliant silicon this year and target production by 2027, advancing an open optical interconnect standard that lets hyperscalers mix GPUs from multiple vendors, reduce supply-chain risks, and improve AI data center scalability. EE Times

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TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States TSMC & Amkor signed a 10-year agreement to expand advanced packaging & testing capacity in Arizona, strengthening the U.S. chip supply chain. The partnership aims to speed time to market, support AI and HPC demand, and create a more integrated domestic semiconductor ecosystem. Business Wire

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

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TSMC Readies Panel-Level Packaging for AI Chips, Setting Up a Showdown With Samsung TSMC is accelerating development of panel-level packaging, building a supply chain and pilot line for its glass-based CoPoS technology to meet soaring AI chip demand. The move pits TSMC against Samsung in a high-stakes race to deliver larger, more efficient next-gen chip packages. Tech Times

TSMC Reportedly Runs Dual-Track Evaluation on CoPoS Pilot Line, Sparking Global, Local Vendor Competition TSMC is advancing CoPoS panel-level packaging with a dual-track equipment evaluation at its Longtan pilot line and mass production targeted within 2–3 years. Samsung and Korean suppliers are ramping up PLP investments, intensifying competition across advanced packaging equipment. TrendForce

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Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Seam Seal Data Collection Robotic Cover Sealer (RCS) is a fully digital, automated seam seal process using AI. Complete data is provided on each package and lid. MicroCircuit Laboratories LLC

Samsung Reportedly Plans MPW Expansion to 2nm in 2027, Unveils 18-Run Program Across Nodes Samsung will extend its MPW program to 2nm in 2027, helping fabless firms cut prototyping costs as it courts more AI, HPC, and automotive customers. The move follows SF2 production ramp-up and intensifies competition with TSMC's established 2nm CyberShuttle service. TrendForce

Intel begins production of most-advanced chip, inching closer to possible Apple deal Intel has started risk production of its advanced 18A-P chip node, marking a key milestone in its foundry turnaround. The new process boosts performance and efficiency, strengthens Intel's bid for major customers, and could support future chip manufacturing deals with Apple. CNBC

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SiMa Launches Agentic Development Environment for Physical AI SiMa.ai launched Palette Neat, an agentic development environment that lets developers build physical AI systems using plain-English prompts. The platform automates optimization and code migration, cutting development cycles from weeks or months to days or even hours. EE Times

AMD Snaps MEXT to Break the Memory Wall AMD acquired MEXT to address AI's growing memory bottleneck, adding predictive memory optimization that combines DRAM and flash for lower-cost, higher-capacity infrastructure. The move aims to boost AI workload efficiency, and reduce data center operating costs. EE Times

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Semiconductor Startup Builds Alternatives for Vital Legacy Chips Phoenix Semiconductor helps extend the life of U.S. Navy F/A-18F Super Hornets by recreating obsolete chips with modern off-the-shelf components. The startup serves industrial markets where legacy semiconductors remain critical but production volumes are low. IEEE Spectrum

RISC-V Silicon in the Jungle Could Save the Amazon Brazilian researchers unveiled the Internet of Trees, a RISC-V-based sensor network that acts as a digital nervous system for the Amazon. Using low-power, biodegradable devices and edge AI, it monitors biodiversity, tracks carbon, and detects environmental threats in real time. EE Times

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Qualcomm CEO says AI agents will replace apps — as chip giant works on 40 new AI-powered devices Qualcomm is developing more than 40 AI-powered wearable devices, including smart glasses, earbuds, watches, and jewelry, as it bets AI agents will transform user interactions, reshape apps, drive new hardware categories, and require more powerful, energy-efficient chips. CNBC

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