July 21, 2026

RISC-V Europe Summit 2026: Beyond Embedded Electronics RISC-V Summit Europe 2026 highlighted the architecture's rapid expansion into data centers, edge AI, robotics, and space. Backed by the ratified RVA23 server standard and growing industry adoption, RISC-V is emerging as a flexible, open alternative to Arm and x86. EE Times

Sponsor Copper Stud & CTE Nano Tech Underfill AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles. AI Technology, Inc.

SK Group Chairman Says Abnormal Memory Prices Should Fall; AI Chip Demand Seen Up 60–100% Next Year SK Group Chairman Chey Tae-won warned AI-driven memory prices are unsustainably high and could raise PC and smartphone costs, hurting demand. He urged memory makers to expand capacity instead of limiting supply as AI demand outpaces production through 2027. TrendFore

The Evolution of Inspection and Metrology in the AI Era AI's rise drives demand for advanced processors, shifting the industry to chiplet architectures with high-bandwidth memory. This transformation introduces new challenges in semiconductor manufacturing, especially in inspection and metrology. Technical Paper

Sponsor High Temperature Resistant, Die Attach Epoxy Master Bond EP17HTS-DA is an electrically conductive die attach epoxy that meets NASA low outgassing specifications and offers high temperature resistance. Master Bond

UMA: The Architecture Edge AI Needs to Scale As AI moves to edge devices, memory has overtaken compute as the biggest bottleneck. Unified Memory Architecture (UMA) lets CPUs, GPUs and NPUs share memory, boosting capacity and bandwidth so larger AI models and long-context workloads run reliably. EE Times

AI is 'new engine' keeping Chinese economy from harder landing Artificial intelligence is powering China's slowing economy by boosting electronics, exports and industrial investment. Analysts say AI is lifting near-term growth and global competitiveness but warn the economy could weaken if AI investment momentum fades. Taipei Times

Sponsor Buy Ceramic Dispensing Needles Online Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online. DL Technology

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

AI boom drives US$100bn TSMC Arizona buildout TSMC will invest another US$100 billion in Arizona, bringing its total US commitment to US$265 billion as AI demand accelerates. The expansion boosts US chip production, supports key customers, strengthens competitiveness, and keeps leading-edge R&D in Taiwan. Taipei Times

Ex-TSMC worker indicted for alleged trade secret theft Taiwan indicted a former TSMC deputy manager for allegedly stealing critical chip trade secrets to aid a China-based venture under the Blue Sea Project. Prosecutors seek a seven-year sentence in the first case involving attempted transfer of nationally protected chip technology. Taipei Times

Sponsor The Global Leader in Warpage Metrology Solutions We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain. Akrometrix

New study highlights how micro-transfer printing can lead to advanced silicon photonics Researchers spotlight micro-transfer printing as a scalable way to integrate advanced materials with CMOS-compatible silicon photonics, easing AI bandwidth bottlenecks. The approach enables heterogeneous chip manufacturing and speeds telecom, datacom, sensing & quantum innovation. Nanowerk

Why China's open-weight AI model Kimi K3 is sparking anxiety in Silicon Valley Moonshot AI's open-source Kimi K3 has cut China's AI gap with the U.S. to weeks, outperforming several top American models at lower cost. Surging demand strained computing capacity, forcing the company to pause new subscriptions temporarily. South China Morning Post

Sponsor No more cartridge exchanges The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more. xyztec

Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design Rapidus and Cadence are integrating the Cadence InnoStack AI Super Agent into the Raads platform to automate advanced-node SoC design workflows, boost engineering productivity, improve design quality, and target up to a twofold reduction in design turnaround time. 3DInCites

Post-Quantum Cryptography Incorporated into SoCs via eFPGA QuickLogic and PQSecure integrated reprogrammable post-quantum cryptography into SoCs with embedded FPGA technology, enabling field updates without silicon redesign. The approach counters quantum threats, supports evolving NIST standards, and extends long-term security. EE Times

Sponsor Keep Production Moving with Expert Component Recovery Solutions Discover proven component removal, reclamation, and requalification services that help recover inventory, extend component availability, and keep production running. Circuit Technology Center

Verifying Networks On Chip As multi-die systems grow more complex, formal verification helps designers maintain throughput, detect serialization bugs, preserve coherency, protect data security, and expose silent data corruption before deployment, improving overall system reliability. Semiconductor Engineering

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation