March 26, 2026

Beating The Heat In 3D Packages Rising power densities in AI and HPC chips push engineers to adopt thermal strategies. They combine simulations, AI hotspot prediction, and test wafers to optimize multi-die packaging, prevent overheating, and boost performance and reliability. Semiconductor Engineering

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Semicon China: AI, advanced packaging set to drive country's chip industry growth China's chip industry will expand rapidly, driven by agentic AI and advanced packaging, boosting its global wafer capacity share to about 42% by 2028. Rising AI inference demand and self-sufficiency efforts will accelerate growth despite persistent technology bottlenecks. South China Morning Post

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Arm Unveils First AGI CPU on TSMC 3nm; Meta Among Customers, Promising Up to 2× Performance vs. x86 Arm moves beyond IP to launch its first in-house AI data center chip, the Arm AGI CPU, built on TSMC's 3nm node. It promises 2× rack performance vs. x86 and major cost savings, with Meta and partners onboard as Arm targets $15B annual revenue within five years. TrendForce

CEA-Leti and the SEMI SOI Industry Consortium: Pioneering a Future-Ready SOI Ecosystem Edge AI drives real-time, low-power computing beyond silicon limits. SOI and FD-SOI boost performance and efficiency, enabling 6G, autonomous systems, and IoT. CEA-Leti and partners accelerate adoption, scaling sustainable, high-performance edge innovation. SEMI

Sponsor You can't spell brain without AI Custom silicon is changing how AI works. But why, and how? Get a first-hand perspective from Vishal Kirti, Senior ASIC Leader at Cisco Systems. A new read on Uniquely Wired. Henkel AG & Co.

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor FSO Seam Seal Hermetic Packages with AI. Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories. MicroCircuit Laboratories, LLC

Alibaba Unveils RISC-V XuanTie C950 CPU for AI Agents, 5nm Chip Reportedly Made by TSMC Alibaba accelerates its AI chip push, unveiling the RISC-V–based XuanTie C950 CPU for large-scale AI models. Built on a 5nm process, it targets high-end servers, boosts performance over 30%, and aims to strengthen supply resilience despite capacity limits. TrendForce

Tower Acquires 300mm Fab From JV Partner in Japan Tower Semiconductor is expanding its 300mm fab capacity in Japan by taking full control of its Uozu facility, restructuring its joint venture with Nuvoton, and targeting surging demand for silicon photonics while ensuring uninterrupted supply for existing customers. Semiecosystem

Sponsor Quick Turn I/C Package Substrates USA Fabrication – THIN "Stay Flat" CORES Organic Substrates/High Density Interposers - 20µm Dielectrics /12µm Traces 50um Cores - ITAR Approved. Learn more. Advanced Component Labs, Inc.

How AI and Geopolitics Forge a Memory Market Crisis AI-driven demand is triggering a semiconductor "RAMageddon," as production shifts to HBM and squeezes supply for consumer memory. Shortages, geopolitical strains, and rising costs drive sharp price hikes, eroding OEM margins and cutting global smartphone output. EE Times

Arm expands compute platform to silicon products in historic company first Arm Holdings plc unveiled its first in-house silicon, the Arm AGI CPU, targeting AI data centers. The move expands beyond IP to full chip production, with Meta Platforms and partners driving scalable, power-efficient infrastructure for agentic AI workloads. 3DInCites

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Arm jumps 16% as company expects revenue windfall from new chip, a 'significant shift' Arm shares surged 16% after unveiling its first in-house AI data center chip, projecting $15 billion revenue by 2031. The strategic shift into chip manufacturing, backed by major customers, signals a major expansion beyond its traditional licensing business. CNBC

What Policymakers Must Fix in Europe's Chips Act 2.0 Europe is reshaping Chips Act 2.0, shifting from crisis-driven action to building durable funding and governance frameworks. Policymakers aim to reduce fragmented national subsidies, align incentives, and design tools suited to a global, capital-intensive semiconductor industry. EE Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

TSMC capacity limits open doors for rival chip foundries Broadcom warns TSMC's chipmaking capacity is nearing its limits as AI demand surges for sub-3nm nodes. With supply tightening, rivals may gain ground, and improving yields could position Samsung to capture more advanced foundry business. Tech in Asia

Sponsor Thermally Conductive, Low Outgassing Epoxy Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively. Master Bond