June 3, 2026

Intel CEO Says TSMC a 'Partner' in Chip Production Intel CEO Lip-Bu Tan reaffirmed Intel's close partnership with TSMC, balancing outsourced advanced chip production with expansion of its 18A and 14A foundry roadmap. He also welcomed Nvidia competition as AI demand boosts CPU sales and industry collaboration. Taipei Times

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Photonics: A Foundational Scaling Layer for AI-Era Computing Photonics is emerging as a foundational scaling layer for AI-era computing, enabling faster, lower-power data movement across chips, racks & clusters. It extends Moore's Law limits by improving interconnects, memory sharing & system-level performance for distributed AI workloads. EE Times

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

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Physical AI Pushes Chipmakers Up the Value Chain At TSMC's European Symposium, industry leaders highlighted AI's growing impact on chips and infrastructure. STMicroelectronics targets physical AI systems, Cisco warns agentic AI will stress networks, and Nordic Semiconductor expands into edge AI system solutions. EE Times

SK Chair Sees Memory Shortage Through 2030, Eyes Capacity Doubling and Stronger TSMC, Taiwan Ties SK Group Chairman Chey Tae-won warned memory shortages may last through 2030 as AI fuels HBM demand. SK plans to double wafer capacity in five years while deepening ties with Taiwan partners, as SK hynix advances next-generation HBM4E. TrendForce

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Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

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Goldman Sachs CEO David Solomon says markets are in 'greed' mode as AI companies seek billions Goldman Sachs CEO David Solomon says investors have shifted into 'greed' mode as markets prepare for a massive AI fundraising wave, including IPOs from OpenAI, Anthropic and SpaceX, noting abundant liquidity and continued optimism despite scale concerns. CNBC

SK Hynix plans to double capacity to ease memory crunch SK Hynix plans to double memory chip capacity over five years to ease an AI-driven global shortage expected to last until 2030. The company will significantly boost capital spending to expand production and meet surging data center demand. Taipei Times

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Taiwan key to AI development: Lai President William Lai said Taiwan is vital to global AI development at Computex Taipei as major tech firms reaffirmed investment plans. He highlighted economic growth, investor confidence, stable power supplies, and resilient supply chains. Taipei Times

Nvidia's new PC chips represent CEO Huang's bid to win at every layer of AI stack Nvidia moves beyond data centers into PCs, unveiling RTX Spark SoC with MediaTek and Microsoft partners. The push targets edge AI computing, challenging Intel, AMD and Qualcomm, as Wall Street reacts and Nvidia seeks to dominate AI across devices. CNBC

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The Evolution Of UCIe Since 2022, UCIe has expanded from a simple die-to-die interconnect into a broad chiplet standard supporting data transfer and validation. Cadence's Mayank Bhatnagar highlights flexible physical and logical design views for multi-foundry, multi-speed integration. Semiconductor Engineering

Research Bits: Jun. 2 Researchers unveiled three innovations: a Monash valleytronics chip that processes optical data at room temperature, a modular tabletop EUV lithography system, and a UC San Diego humidity-responsive display that reveals hidden images for sensing, authentication, and security uses. Semiconductor Engineering

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Huawei to hold the line as memory price surge hits China's smartphone makers Chinese smartphone makers face their toughest post-Covid year as soaring memory chip costs and weak demand force price hikes, downgrades or margin losses. Counterpoint projects shipments falling 14% to 1.08 billion, with Apple & Samsung more resilient than Chinese brands. South China Morning Post

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