June 5, 2026

Keeping Security Algorithms Current Is Getting Harder Security algorithms now span silicon and software across the chip supply chain, creating update and synchronization challenges. Experts advocate hardware roots of trust, cryptographic agility, and secure lifecycle management to address evolving and post-quantum threats. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

TSMC says AI demand affecting supply TSMC says surging AI chip demand has strained global supply chains, prompting it to expand capacity rapidly to avoid bottlenecks, while chairman C.C. Wei warns shortages span equipment and components but insists Taiwan retains strong AI competitive advantage. Taipei Times

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

Sponsor Ultra-Thin Wafer Handling Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps. Brewer Science

Intel Says 18A May Reach Strong Margins by 2027; Notebook Chips on the Node Mark Fastest Ramp in 5 Years Intel's 18A process is advancing ahead of schedule, with improving yields, strong notebook CPU ramps, and rising supply. Backed by closer vendor collaboration and confidence in 14A, Intel aims to capitalize on growing CPU and data center demand. TrendForce

Netrasemi Brings Up A2000 AI Chip, Begins Customer Evaluation Phase Netrasemi has brought up its A2000 edge AI chip, built on TSMC's 12 nm process, and is supplying engineering samples for validation with OEMs, advancing its roadmap toward R1000 and R4000 chips and planned production next year. EE Times

Sponsor Chemically Resistant, UV Curable Epoxy Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating. Master Bond

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

Warren invites Nvidia CEO Jensen Huang to Senate hearing on China AI chip sales Nvidia CEO Jensen Huang will testify before the Senate Banking Committee on June 11 after Sen. Elizabeth Warren raised concerns about the company's China sales, export controls and national security risks tied to advanced AI chips amid rising U.S.-China tensions. CNBC

Foxconn and Intel team up to build AI systems Hon Hai Precision Industry and Intel agreed to jointly develop next-gen AI infrastructure and computing platforms, combining manufacturing and chip expertise to build data center systems, edge AI applications and energy-efficient solutions for industrial, smart city & robotics use. Taipei Times

Sponsor Seam Seal Data Collection Robotic Cover Sealer (RCS) is a fully digital, automated seam seal process using AI. Complete data is provided on each package and lid. MicroCircuit Laboratories LLC

Artificial intelligence companies warn of bottlenecks Taiwanese AI supply chain companies expect robust growth as AI investment accelerates, but warn of bottlenecks in memory chips, advanced packaging, and semiconductor materials analysis, as firms including Nanya, Alchip, Unimicron and Msscorps expand capacity and investment. Taipei Times

Computex 2026: Are We Heading for the Agentic PC Era Yet? At Computex 2026 in Taipei, analyst Jim McGregor highlighted a shift from AI PCs to agentic AI. Nvidia CEO Jensen Huang promoted agentic computing and new PC designs, while the event also emphasized physical AI and Taiwan's central electronics role. EE Times

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies

'Not afraid': TSMC brushes off mainland chip rivals amid AI boom TSMC chairman C.C. Wei said the company is not afraid of mainland Chinese competition from Huawei and SMIC, emphasizing manufacturing leadership and ongoing investment. He reassured investors about its Nanjing plant and projected strong AI-driven growth and expansion. South China Morning Post

European Electronic Waste Dilemma Global e-waste reached 62 million metric tons in 2022 as EU recyclers face shrinking margins from EPR competition, informal diversion, and strict regulation. Commodity-driven metal recovery, export limits, and weak domestic demand strain recycling operations. EE Times

Sponsor Automatic Grading Without Assistance Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images. xyztec

Orbital Data Centers Are Souped-Up Satellites – For Now Companies are exploring space-based AI data centers to ease Earth's power and resource constraints. Yet experts cite major hurdles, including energy supply, cooling, radiation, debris, and latency, raising doubts about feasibility. Semiconductor Engineering

Sponsor Proven Die-Attach Pastes and Films Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity. AI Technology, Inc.