July 1, 2026

EU Chips Act 2: Award-Winning Sequel or Straight to Video? The proposed EU Chips Act 2.0 expands beyond factory investments by strengthening chip design, demand, and multi-foundry flexibility. Supporters argue the broader strategy will improve Europe's semiconductor resilience, bridge the lab-to-fab gap, and reduce long-term supply chain vulnerabilities. EE Times

Sponsor Photonics Bonder for Sub-Micron Accuracy Tresky's Photonics Bonder delivers sub-micron die placement on a granite-based T-7000 platform for VCSELs, lasers and photodiodes. Tresky

Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel Samsung has reportedly revived development of its 1.4nm foundry process, targeting mass production in 2029 after delaying earlier plans. The strategy prioritizes strengthening 2nm manufacturing while positioning Samsung to compete more closely with TSMC and Intel in advanced chip production. TrendForce

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor IC Device & Micro-Electronic Cleaning Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge. Kyzen Corporation

Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel Samsung and SK hynix's planned 800 trillion won semiconductor expansion is expected to tighten global supplies of critical chipmaking equipment, increasing competition for advanced manufacturing tools and potentially creating production challenges for TSMC and Intel as they expand next-generation process technologies. TrendForce

Micron CEO: Customers driving hard bargain on price contributed to memory shortage Micron CEO Sanjay Mehrotra said aggressive customer pricing and years of underinvestment worsened today’s AI-driven memory chip shortage. He expects supply constraints to persist beyond 2027 as Micron invests $200 billion to expand manufacturing capacity and meet soaring demand. CNBC

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

The great AI reckoning: how China is flipping the script on US’ new industrial revolution China has transformed from a perceived technology follower into a global innovation leader, rapidly narrowing the AI gap with the US through rising R&D investment and advanced models, prompting Western reassessment of China's scientific capabilities and technological influence. South China Morning Post

The rise of Silicon Saxony in Dresden Silicon Saxony has emerged as Europe’s leading semiconductor hub, offering Taiwanese companies a strategic base to diversify risk, serve European customers and expand through manufacturing, R&D and partnerships, while adapting to local regulations, workforce needs and long-term industrial priorities. Taipei Times

Sponsor The Next Step in Surface Prep! All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated surfaces without a vacuum chamber. Ontos Equipment Systems

The Chip War with China Is Failing A growing body of analysis argues that U.S. semiconductor export controls have accelerated China's domestic chip development while reducing revenue for American chipmakers. Experts urge Washington to adopt more targeted restrictions, strengthen research investment, and better balance national security with long-term technological competitiveness. FPIF

Chip supply chain braces for more price hikes as upstream parts create new bottlenecks AI-driven demand is pushing semiconductor price increases beyond GPUs and memory into power components, PCB materials and chipmaking supplies. Tight capacity and rising input costs are creating upstream bottlenecks, threatening to slow global AI infrastructure expansion while boosting suppliers' pricing power. South China Morning Post

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Research Bits: June 30 Researchers developed two semiconductor breakthroughs: a low-temperature 3D silicon integration process that stacks high-performance circuits below 200°C, and metamaterial-based structures that boost nanoscale heat transfer up to fourfold, offering more efficient chip fabrication and advanced cooling for next-generation electronics. Semiconductor Engineering

The Chinese chipmaker Apple suddenly needs Apple’s device prices are rising as AI-driven demand squeezes global memory chip supplies. Facing higher costs, Apple has sought US approval to source DRAM from blacklisted Chinese chipmaker CXMT, whose rapid state-backed rise has reshaped the global memory market. Finshots

Sponsor High Capacity & Power Plasma Systems The BT-1 high capacity plasma systems features 5 shelves & high power plasma up to 5000 watts! Reactive Ion Etching chamber configurations with liquid cooling are also available. Plasma Etch

Graphene can hold multiple states of superconductivity, a new study finds MIT researchers discovered four unconventional superconducting states in naturally occurring rhombohedral graphene, with several surviving and even strengthening under magnetic fields. The findings reveal unexpected quantum behavior in graphite and could advance fundamental superconductivity research and future quantum technologies. MIT News

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation