Aug 31, 2026 Intel's Advanced Packaging, Led by EMIB-T, Set to Hit Its Stride in 2029 Intel is gaining traction in advanced packaging as Google and other tech firms eye EMIB amid CoWoS constraints. Intel expects EMIB-T revenue to ramp in 2H27, target 40% gross margins and grow into a major business by 2029. TrendForce

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Chip Industry Week in Review Hot Chips showcased rapid AI hardware advances, from 2nm processors and next-gen accelerators to new memory and advanced packaging. Semiconductor firms expanded capacity, pursued deals and tackled security and tariff risks as AI demand surged. Semiconductor Engineering

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Semicon to put spotlight on CPO, silicon photonics SEMICON Taiwan will spotlight silicon photonics and co-packaged optics as AI drives demand for faster, lower-power links. TSMC, Nvidia and Taiwanese suppliers are advancing CPO toward mass production, replacing copper and boosting AI bandwidth. Taipei Times

Powertech Bets NT$70B on World's First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC Powertech Technology plans to launch panel-level packaging for AI chips as early as 2027, investing $2.2 billion in FOPLP. Its PiFO technology targets ASICs, HBM and optics, with capacity booked through 2030 amid strong AI demand. TrendForce

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Technical Papers ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging ■ Revolutionizing IC Packaging with High-Density RDL Technology ■ EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices MORE TECHNICAL PAPERS

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TSMC Q2 employee bonuses rise more than 50% TSMC increased second-quarter employee bonuses by more than 50% year over year as record earnings reflected strong demand for AI and high-performance computing. The world's largest contract chipmaker paid NT$36 billion in bonuses, lifting first-half payouts to NT$70.35 billion. Taipei Times

Google's Marvell Deal Shows Custom Silicon Spreading Beyond the TPU Google's expanded custom-silicon partnership with Marvell could generate up to $120 billion through fiscal 2033. The deal spans TPUs, inference accelerators, storage, networking and memory, broadening Google's specialized AI infrastructure push. EE Times

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CXMT Corp's sales jump 10-fold amid AI demand CXMT's first-half revenue soared nearly tenfold to 150.3 billion yuan, while profit reached 77.6 billion yuan, driven by surging AI-related memory demand. The Chinese DRAM maker now leads China's market value and plans capacity expansion and HBM development. Taipei Times

SK Hynix starts construction at site in US' Indiana SK Hynix broke ground on a $4 billion advanced memory packaging facility in Indiana, strengthening U.S. semiconductor supply chains. The plant will produce next-generation HBM, create thousands of jobs and support America's growing AI hardware industry by 2029. Taipei Times

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China's chip supply chain 'safer' as self-sufficiency push gains traction, says top planner China says its semiconductor supply chain has become significantly more secure as domestic equipment, materials and advanced technologies improve. Beijing is accelerating chip self-sufficiency, while booming AI demand boosts exports and foundry capacity utilization. South China Morning Post

US reportedly considering new tariffs on semiconductors The U.S. is weighing semiconductor tariffs on laptops, gaming consoles and data-center servers. Industry leaders warn duties could raise prices, slow AI infrastructure growth and hurt chip designers without quickly expanding domestic capacity. Dig Watch

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Microscale Power Management Starts with Microflow Heat Measurement MIT researchers developed a precise method to measure nanoscale heat flow in multilayer semiconductor systems. By combining penetrating X-rays with laser pulses, the technique avoids measurement interference and could improve thermal management. EE Times

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AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex AI's investment boom is moving beyond chip fabrication into semiconductor packaging and testing. Taiwan's leading OSAT providers are expanding capacity to meet surging demand for advanced AI hardware, high-end packages and supporting infrastructure. Digitimes