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A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
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What Year Was It?
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The First Earth Day
Earth Day, an event to increase public awareness of the world's environmental problems, is celebrated in the United States for the first time.
See the answer below.
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Hermetic Microelectronic Package Seam Seal
Technical paper on technology that delivers a pristine internal atmosphere for hi-rel microelectronic components. Process automation, including AI, and standard tooling utilized in die and wire bonding is standard.
MicroCircuit Laboratories, LLC
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What Year Was It Answer
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The First Earth Day Answer: April 22, 1970
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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
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TSMC shows smaller, faster chips without a pricey new tool from ASML
TSMC unveiled next-generation chip technologies A13 and N2U, aiming for smaller, faster, cheaper chips for AI, smartphones and laptops. The company will enhance existing ASML EUV machines instead of adopting costly high-NA systems, accelerating its scaling roadmap.
Reuters
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How to Cold Bump Pull?
Learn how to perform an optimal Cold Bump Pull test on solder balls using tweezers. This guide covers test method settings and failures modes for CBP all types of bump testing.
xyztec
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TSMC Unfolds Map for Process, Packaging Tech
TSMC unveils chip roadmap featuring A14 1.4-nm GAA process and A13/A12 derivatives for AI and edge, alongside N2U 2-nm. It introduces photonics and advanced packaging to cut power use and latency while scaling AI data-center performance without high-NA EUV.
EE Times
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Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
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RDL Interposers – USA Fabrication
Organic Substrates/High Density Interposers - 20µm Dielectrics - 12µm Traces - 50µm "Stay Flat" Cores - Quick Turns. Learn more.
Advanced Component Labs, Inc.
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Powerchip predicts substantial jump in quarterly gross margin and profits
Powerchip Semiconductor Manufacturing raises chip prices amid tight supply and AI-driven demand, expects strong gross margin and profit growth this quarter. The company sees rising utilization, a return to profitability, and expanding memory, packaging, and 3D AI foundry businesses.
Taipei Times
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Micron pushes US Congress to curb Chinese competitors
Micron Technology urges US lawmakers to pass the MATCH Act, which would tighten export controls on chipmaking equipment to China, targeting CXMT, YMTC and SMIC, while restricting foreign service access, aiming to curb China’s memory industry on national security grounds.
Taipei Times
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Electrically Insulating, Toughened Epoxy
Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping.
Master Bond
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AI Agent Designs a RISC-V CPU Core From Scratch
In 2025, Verkor.io used its agentic AI system Design Conductor to autonomously design VerCore, a RISC-V CPU core in 12 hours, achieving performance comparable to a 2011 Intel Celeron and marking a milestone in end-to-end AI chip design.
IEEE Spectrum
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Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
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Indian Researchers Develop Molecular Memristor for Neuromorphic Computing
IISc Bangalore’s CeNSE researchers develop a ruthenium-based molecular memristor delivering 14-bit resolution and 4.1 TOPS/W, enabling energy-efficient neuromorphic computing. They design crossbar AI inference chips for edge applications, targeting 22 nm fabrication and startup commercialization within a year.
EE Times
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TSV Complexity Leads To Manufacturing Bottleneck
Through-silicon vias (TSVs) connect stacked chips but shrinking dimensions increase cost, defects, and signal issues. AI-driven demand strains limited packaging capacity, while complex etch, fill and wafer thinning processes and tight tolerances challenge manufacturing yield and scalability.
Semiconductor Engineering
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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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The Changing ASICs Landscape: the Shift Toward Chip Disaggregation
AI reshapes ASIC design toward system-specific, modular, disaggregated architectures. Advanced packaging and multi-die integration optimize performance via cross-domain collaboration, but raise verification complexity, driving reusable IP, co-design, and partnerships.
EE Times
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Today's Sponsor |
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OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
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Test Your Knowledge
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When did Time magazine name the computer its "Man of the Year"?
See answer below.
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Quote of the Day
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"It does not matter how slowly you go as long as you do not stop." Confucius
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Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
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| Cartoon of the Day
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"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen
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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
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Test Your Knowledge Answer
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When did Time magazine name the computer its "Man of the Year"? Answer: December 26, 1982. The first non-human to receive the award since its creation in 1927. Describing the personal computer as 1982's "greatest influence for good or evil."
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