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Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
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What Year Was It?
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Castro Announces Mariel Boatlift
The Castro regime announces that all Cubans wishing to emigrate to the U.S. are free to board boats at the port of Mariel west of Havana, launching the Mariel Boatlift.
See the answer below.
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Award Winning Acquisition Mode Dynamic Planar CT
Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure.
Nordson Test & Inspection
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What Year Was It Answer
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Castro Announces Mariel Boatlift Answer: April 20, 1980
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April 20, 2026
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TSMC Chases Soaring AI Demand
TSMC increases spending to nearly $56 billion to expand chip capacity for surging AI demand from Nvidia, AMD, and Apple, building new 3nm fabs in Japan, Taiwan, and the US, while acknowledging supply may still lag demand through 2027.
EE Times
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Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
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Chip Industry Week In Review
Cadence expands ChipStack AI with a head agent orchestrating semiconductor and system design, plus specialized agents for analog, custom, and digital implementation and signoff. Partnerships with Nvidia and Google accelerate AI-driven engineering platforms.
Semiconductor Engineering
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Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center
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The Latest News In IC Packaging & Test
RifSol launches a $1.7B semiconductor project in Morocco with a 200mm fab, design and packaging facilities for automotive chips. Kaynes Semicon begins OSAT production in India, while Arizona's West-MEC opens a K–12 semiconductor cleanroom for workforce training.
Semiecosystem
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TSMC still safe from Musk's fab ambitions
Reports of Elon Musk's planned "Terafab" highlight ambitions for in-house chip production, though details remain unproven. TSMC faces minimal near-term impact, possible mid-term pricing pressure, and longer-term risk if vertical integration expands.
Taipei Times
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Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
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FII expects strong year amid booming AI demand
Foxconn Industrial Internet expects strong growth this year as AI and high-end interconnect demand surges. Last year, it boosted profit 52% and revenue 48%, with AI servers tripling and cloud computing dominating sales, while expanding advanced optics and liquid-cooled systems.
Taipei Times
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Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Today's Sponsor |
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| Sponsor |
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Xyztec's virtual reality showroom
Feel free to move around in the interactive xyztec showroom and discover all bondtesters and services with a mouse click. Watch product videos, brochures, and manuals. Explore xyztec!
xyztec
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Test Your Knowledge
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During its earliest days in development, Windows was known by what name?
See answer below.
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Quote of the Day
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Problems are only opportunities in work clothes. Henry Kaiser
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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| Cartoon of the Day
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"How come you never bring me any of your stupid ideas anymore?"
Copyright © Randy Glasbergen
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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
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Test Your Knowledge Answer
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During its earliest days in development, Windows was known by what name? Answer: "Interface Manager," which was First developed in 1981 by computer scientist Chase Bishop who named the software project. Marketers at Microsoft later decided that the name "Windows" was more consumer-friendly.
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